公开(公告)号：US06641026B2

公开(公告)日：2003-11-04

申请号：US10075838

申请日：2002-02-13

申请人： David T. Beatson ,  Christian Hoffman ,  James E. Eder ,  John Ditri

发明人： David T. Beatson ,  Christian Hoffman ,  James E. Eder ,  John Ditri

IPC分类号： B23K3112

CPC分类号： B23K31/12 ,  B23K20/002 ,  B23K20/10 ,  B23K2101/40 ,  H05K13/08

摘要： A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube offset tool having a plurality of total internal reflection surfaces, the cornercube offset tool located below the vision plane of the optical system; and an optical detector to receive an indirect image of the bonding tool through the cornercube offset tool. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the bonding tool; and receiving an indirect image of the bonding tool through the cornercube offset tool.

公开(公告)号：US07527186B2

公开(公告)日：2009-05-05

申请号：US11148486

申请日：2005-06-09

申请人： David T. Beatson ,  Deepak Sood ,  Norman Lucas

发明人： David T. Beatson ,  Deepak Sood ,  Norman Lucas

IPC分类号： G01B11/14 ,  G02B5/22 ,  B23K26/20

CPC分类号： H01L24/78 ,  B23K20/007 ,  H01L2224/78301 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/12043 ,  H01L2924/14 ,  Y10S228/904 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2924/00

摘要： A system for determining wire bonding tool placement for use with a wire bonder and an optical imager is provided. The system includes a prism disposed below the optical imager and the wire bonding tool. The system also includes at least one lens positioned between the prism and a lower portion of the wire bonding tool along a first optical axis. The at least one lens and the prism define an object plane between the at least one lens and the lower portion of the wire bonding tool. The at least one lens is positioned between the prism and the optical imager along a second optical axis. The at least one lens and the prism define an image plane between the at least one lens and the optical imager.

摘要翻译： 提供了一种用于确定用于引线接合器和光学成像器的引线接合工具布置的系统。 该系统包括设置在光学成像器下方的棱镜和引线接合工具。 该系统还包括沿着第一光轴定位在棱镜和引线接合工具的下部之间的至少一个透镜。 所述至少一个透镜和所述棱镜在所述至少一个透镜和所述引线接合工具的下部之间限定物平面。 所述至少一个透镜沿着第二光轴定位在所述棱镜和所述光学成像器之间。 所述至少一个透镜和所述棱镜限定所述至少一个透镜和所述光学成像器之间的图像平面。

公开(公告)号：US07320424B2

公开(公告)日：2008-01-22

申请号：US11092399

申请日：2005-03-29

申请人： David T. Beatson ,  E. Walter Frasch

发明人： David T. Beatson ,  E. Walter Frasch

IPC分类号： B23K37/00 ,  B23K31/00 ,  B23K31/02

CPC分类号： H01L24/78 ,  B23K20/004 ,  B23K2101/40 ,  H01L2224/45015 ,  H01L2224/78301 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2224/48 ,  H01L2924/2075 ,  H01L2924/20757 ,  H01L2924/20756 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2224/45099 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2224/05599 ,  H01L2924/00

摘要： A wire bonding machine for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. A bonding head conveyance system translates the bonding tool in a vertical direction and translates the bonding tool along a first horizontal axis. A work table supports at least one semiconductor device to be wire bonded. A work table conveyance system translates the semiconductor device along a second horizontal axis.

摘要翻译： 一种用于将导线接合到半导体器件的引线接合机。 引线接合机包括具有安装到其上的接合工具的引线接合头。 接合工具适于将线端附接到半导体器件。 接合头传送系统使焊接工具沿垂直方向平移并且沿着第一水平轴平移焊接工具。 工作台支撑至少一个待接线的半导体器件。 工作台传送系统沿着第二水平轴转换半导体器件。

公开(公告)号：US06870684B2

公开(公告)日：2005-03-22

申请号：US10418803

申请日：2003-04-18

申请人： David T. Beatson ,  Christian Hoffman

发明人： David T. Beatson ,  Christian Hoffman

IPC分类号： G01N21/88 ,  G02B27/14 ,  G02B3/00 ,  G02B13/00

CPC分类号： G02B27/145 ,  G01N21/8806 ,  G01N2021/8845 ,  G02B27/1066

摘要： A method and system for providing different images representing plural depths of field of an electronic device. The vision system has a beamsplitter for receiving an image of the device illuminated by the at least one light source, the beamsplitter providing one of the plurality of images of the device based in a wavelength of the light source; an aperture having a plurality of effective diameters based on the wavelength of light from the at least one light source, the aperture determining a depth of field of the image of the device; and an optical element for receiving the image of the device, the optical element magnifying the image by a predetermined magnification factor to produce a magnified image having the determined depth of field.

摘要翻译： 一种用于提供表示电子设备的多个景深的不同图像的方法和系统。 视觉系统具有用于接收由至少一个光源照射的装置的图像的分束器，分束器基于光源的波长提供装置的多个图像中的一个; 基于来自所述至少一个光源的光的波长具有多个有效直径的孔，所述孔确定所述装置的图像的景深; 以及用于接收装置的图像的光学元件，所述光学元件以预定的放大系数放大图像以产生具有确定的景深的放大图像。

公开(公告)号：US06760161B2

公开(公告)日：2004-07-06

申请号：US10336458

申请日：2003-01-03

申请人： David T. Beatson ,  Christian Hoffman ,  Michael Woodward ,  Lawrence B. Brown

发明人： David T. Beatson ,  Christian Hoffman ,  Michael Woodward ,  Lawrence B. Brown

IPC分类号： G02B2714

CPC分类号： G02B27/145 ,  G01N21/8806 ,  G01N2021/8845

摘要： A method and system for providing different magnified images of an electronic device. The vision system has a first beamsplitter for receiving an image of the device illuminated by a light source, the beamsplitter providing multiple of images of the device; optical elements for receiving the plural images of the device, each of the optical elements magnifying the image by a predetermined magnification factor to produce more than one magnified images; and a second beamsplitter for receiving the magnified images and filtering out all but one of the magnified images based on a wavelength of the light source.

摘要翻译： 一种用于提供电子设备的不同放大图像的方法和系统。 视觉系统具有用于接收由光源照射的装置的图像的第一分束器，分束器提供装置的多个图像; 用于接收设备的多个图像的光学元件，每个光学元件以预定的放大倍数放大图像以产生多于一个的放大图像; 以及第二分束器，用于接收放大图像，并且基于光源的波长滤除放大图像之外的所有图像。

公开(公告)号：US06608390B2

公开(公告)日：2003-08-19

申请号：US10054231

申请日：2001-11-13

申请人： David T. Beatson ,  Andrew F. Hmiel

发明人： David T. Beatson ,  Andrew F. Hmiel

IPC分类号： H01L2348

CPC分类号： H01L24/85 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49175 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A wirebonded semiconductor package structure that provides for high frequency operation, a large number of I/O terminals, controlled low impedance, compensated inductance, electromagnetic shielding against cross-talk and prevention of false signals from ground bounce includes a semiconductor device, a semiconductor package substrate and a wirebond(s) electrically connecting the semiconductor device to the semiconductor package substrate. The wirebonded semiconductor package structure also includes a first insulating encapsulant layer at least partially encapsulating the wirebond(s) and a conductor layer (e.g., a patterned gold conductor layer) disposed on the first insulating encapsulant layer and electrically connected to the semiconductor package substrate. A method for manufacturing such a wirebonded semiconductor package includes wirebonding a semiconductor device (i.e., a die) to a semiconductor package substrate to form a semiconductor package structure that includes the die, the semiconductor package substrate and a wirebond(s) electrically connecting the die to the semiconductor package substrate. A first insulating encapsulant layer is then applied that at least partially encapsulates the wirebond(s). A conductor layer (e.g., a gold conductor layer) is subsequently applied on the first insulating encapsulant layer such that the conductor layer is electrically connected to the semiconductor package substrate, thereby creating a wirebonded semiconductor package structure. Thereafter, the conductor layer is optionally patterned to form a patterned conductor layer that is electrically connected to the semiconductor package substrate.

公开(公告)号：US20120257208A1

公开(公告)日：2012-10-11

申请号：US13263342

申请日：2010-10-22

申请人： James Kengo Andersen ,  Eric Lee Goldner ,  Agop Hygasov Cherbettchian ,  Gerald Robert Baker ,  David T. Beatson

发明人： James Kengo Andersen ,  Eric Lee Goldner ,  Agop Hygasov Cherbettchian ,  Gerald Robert Baker ,  David T. Beatson

IPC分类号： G01B9/02 ,  G02B6/00 ,  G01P15/00

CPC分类号： G01D5/35312 ,  G01B9/0201 ,  G01B9/02014 ,  G01B9/02015 ,  G01B9/02027 ,  G01B9/0205 ,  G01D5/35316 ,  G01D5/35377 ,  G01H9/004 ,  G01L1/246 ,  G01P15/093 ,  G01V1/181 ,  G02B6/022

摘要： A fiber optic transducer is provided. The fiber optic transducer includes a fixed portion configured to be secured to a body of interest, a moveable portion having a range of motion with respect to the fixed portion, a spring positioned between the fixed portion and the moveable portion, and a length of fiber wound between the fixed portion and the moveable portion. The length of fiber spans the spring. The fiber optic transducer also includes a mass engaged with the moveable portion. In one disclosed aspect of the transducer, the mass envelopes the moveable portion.

摘要翻译： 提供光纤换能器。 所述光纤换能器包括固定部分，其被固定到感兴趣的主体上，可移动部分具有相对于所述固定部分的运动范围，位于所述固定部分和所述可移动部分之间的弹簧以及一定长度的光纤 缠绕在固定部分和可移动部分之间。 纤维的长度跨越春天。 光纤传感器还包括与可移动部分接合的质量。 在换能器的一个公开的方面中，质量包围可移动部分。

公开(公告)号：US08004299B2

公开(公告)日：2011-08-23

申请号：US13038140

申请日：2011-03-01

申请人： Scott R. Williams ,  Edward Laurent ,  David T. Beatson ,  Bahadir Tunaboylu ,  Edward L. Malantonio

发明人： Scott R. Williams ,  Edward Laurent ,  David T. Beatson ,  Bahadir Tunaboylu ,  Edward L. Malantonio

IPC分类号： G01R1/067 ,  G01R31/00

CPC分类号： G01R1/06727

摘要： A probe for a probe card assembly includes a beam and a fulcrum element. The fulcrum element is positioned between a base end portion of the beam and a tip end portion of the beam and is adapted for contact with the beam such that the beam is cantilevered by the fulcrum.

摘要翻译： 用于探针卡组件的探针包括光束和支点元件。 支点元件位于梁的基端部分和梁的顶端部分之间，并且适于与梁接触，使得梁被支点悬臂。

公开(公告)号：US06997368B2

公开(公告)日：2006-02-14

申请号：US10458535

申请日：2003-06-10

申请人： David T. Beatson ,  Deepak Sood ,  Ashoke Banerjee

发明人： David T. Beatson ,  Deepak Sood ,  Ashoke Banerjee

IPC分类号： B23K31/02

CPC分类号： B23K20/007 ,  B23K20/002 ,  B23K20/10 ,  B23K31/12 ,  B23K2101/40 ,  H01L2224/78301 ,  H05K13/08

摘要： A system and method for aligning optical fibers that takes into account variations due to temperature changes and other nonrandom systemic effects. The system includes an alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the first one of the pair of optical fibers, and an optical detector to receive an indirect image of a bottom surface of the first optical fiber through the alignment tool, such an offset between the first optical fiber and the optical detector is determined based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the first optical fiber, and receiving an indirect image of the first optical fiber through the cornercube offset tool.

公开(公告)号：US06903880B2

公开(公告)日：2005-06-07

申请号：US10953962

申请日：2004-09-29

申请人： David T. Beatson ,  Christian Hoffman

发明人： David T. Beatson ,  Christian Hoffman

IPC分类号： G01N21/88 ,  G02B27/14 ,  G02B13/00 ,  G02B3/00

CPC分类号： G02B27/145 ,  G01N21/8806 ,  G01N2021/8845 ,  G02B27/1066

摘要： A method and system for providing different images representing plural depths of field of an electronic device. The vision system has a beamsplitter for receiving an image of the device illuminated by the at least one light source, the beamsplitter providing one of the plurality of images of the device based in a wavelength of the light source; an aperture having a plurality of effective diameters based on the wavelength of light from the at least one light source, the aperture determining a depth of field of the image of the device; and an optical element for receiving the image of the device, the optical element magnifying the image by a predetermined magnification factor to produce a magnified image having the determined depth of field.

摘要翻译： 一种用于提供表示电子设备的多个景深的不同图像的方法和系统。 视觉系统具有用于接收由至少一个光源照射的装置的图像的分束器，分束器基于光源的波长提供装置的多个图像中的一个; 基于来自所述至少一个光源的光的波长具有多个有效直径的孔，所述孔确定所述装置的图像的景深; 以及用于接收装置的图像的光学元件，所述光学元件以预定的放大系数放大图像以产生具有确定的景深的放大图像。