Power converter device based on normally-on type switching devices

    公开(公告)号:US10103634B2

    公开(公告)日:2018-10-16

    申请号:US15064687

    申请日:2016-03-09

    Abstract: A power converter device, includes switching devices and a controller, to realize conversion between power supplies by controlling on and off the switching devices via the controller. The switching devices include: at least one normally-on type switching device and at least one normally-off type switching device both having an operation frequency greater than 1 kHz and connected in series. The controller outputs a first and second control signal to correspondingly control the normally-on type switching device and the normally-off type switching device to control the normally-off type switching device to be turned on after the normally-on type switching device to be turned off. The present disclosure uses the normally-off type switching device originally disposed in the circuit, having a voltage blocking ability, to realize directly usage of the normally-on type switching device to improve efficiency and power density of switching power supply.

    POWER MODULE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20250088110A1

    公开(公告)日:2025-03-13

    申请号:US18961423

    申请日:2024-11-26

    Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

    Assembly structure and electronic device having the same

    公开(公告)号:US11503731B2

    公开(公告)日:2022-11-15

    申请号:US17004194

    申请日:2020-08-27

    Abstract: The present disclosure provides an assembly structure for providing power for a chip and an electronic device using the same. The assembly structure includes: a circuit board, configured to provide a first electrical energy; a chip; a power converting module, configured to electrically connect the circuit board and the chip, convert the first electrical energy to a second electrical energy, and supply the second electrical energy to the chip, wherein the chip, the circuit board and the power converting module are stacked; and a connection component, configured to electrically connect the circuit board and the power converting module. The present disclosure assembles a power converting module with a circuit board and a chip in a stacking manner, which may shorten a current path between the power converting module and the chip, reduce current transmission losses, improve efficiency of a system, reduce space occupancy and save system resource.

    POWER SUPPLY APPARATUS
    15.
    发明申请

    公开(公告)号:US20220261054A1

    公开(公告)日:2022-08-18

    申请号:US17733364

    申请日:2022-04-29

    Abstract: Disclosed herein is a power supply apparatus. The power supply apparatus includes at least one power unit and a magnetic unit. The magnetic unit is stacked with and electrically connected to the at least one power unit. The magnetic unit comprises a plurality of pins and a magnetic core. The at least part of the plurality of pins extends out of a projection of the magnetic core in a connection plane of the at least one power unit and the magnetic unit to connect to the at least one power unit.

    POWER MODULE
    16.
    发明申请
    POWER MODULE 审中-公开

    公开(公告)号:US20190393789A1

    公开(公告)日:2019-12-26

    申请号:US16560820

    申请日:2019-09-04

    Abstract: A power module includes a circuit board and a load group. The load group is installed on the circuit board. The load group includes a first-stage power conversion circuit, a second-stage power conversion circuit and plural loads. The first-stage power conversion circuit converts an input voltage into a transition voltage. The second-stage power conversion circuit converts the transition voltage into a driving voltage. A rated value of the first input voltage is higher than twice a rated value of the transition voltage. A rated value of the driving voltage is lower than a half of the rated value of the transition voltage. The distance between the input terminal of the second-stage power conversion circuit and the output terminal of the first-stage power conversion circuit is smaller than the distance between the input terminal of the first-stage power conversion circuit and each edge of the circuit board.

    Power supply apparatus
    18.
    发明授权

    公开(公告)号:US12253893B2

    公开(公告)日:2025-03-18

    申请号:US17733364

    申请日:2022-04-29

    Abstract: Disclosed herein is a power supply apparatus. The power supply apparatus includes at least one power unit and a magnetic unit. The magnetic unit is stacked with and electrically connected to the at least one power unit. The magnetic unit comprises a plurality of pins and a magnetic core. The at least part of the plurality of pins extends out of a projection of the magnetic core in a connection plane of the at least one power unit and the magnetic unit to connect to the at least one power unit.

    Power module and manufacturing method thereof

    公开(公告)号:US11277067B2

    公开(公告)日:2022-03-15

    申请号:US16130850

    申请日:2018-09-13

    Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

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