Abstract:
An actinic ray-sensitive or radiation-sensitive resin composition contains a resin (P) having a partial structure represented by General Formula (X), and a compound capable of generating an acid upon irradiation with actinic ray or radiation.
Abstract:
Provided is an active light-sensitive or radiation-sensitive resin composition with excellent exposure latitude and pattern roughness such as line width roughness, and a pattern-forming method using the same. The active light-sensitive or radiation-sensitive resin composition of the present invention contains (A) at least one type of a compound which is represented by General Formula (I) below and which generates an acid by irradiation with active light or radiation and (B) at least one type of a resin which includes a repeating unit which is represented by General Formula (1) below and of which, due to being decomposed by an action of an acid, the solubility increases with respect to an alkali developer.
Abstract:
The pattern forming method of the present invention includes: (i) forming a film including an actinic ray-sensitive or radiation-sensitive resin composition containing a compound (A) represented by General Formula (I) shown below; a resin (P) capable of decreasing solubility with respect to a developer including organic solvent by the action of an acid; and a compound (B) capable of generating an acid by irradiation of actinic rays or radiation; (ii) irradiating the film with actinic rays or radiation; (iii) developing the film irradiated with the actinic rays or radiation using a developer including an organic solvent. [Chem. 1] RN-A−X+ (I)
Abstract:
Provided are: a composition for forming a pattern, which contains a polymerizable compound, a photopolymerization initiator, and a sensitizer containing two or more of at least one kind of atom selected from the group consisting of a nitrogen atom and a sulfur atom, in which a length of a specific atom chain from one atom to another atom among the two or more atoms is 2 or 3 in terms of the number of atoms; a kit to which the composition for forming a pattern is applied; a cured film; a laminate; a pattern producing method; and a method for manufacturing a semiconductor element.
Abstract:
Provided is a laminate that excels in adhesion among a plurality of resin layers formed as insulating layers containing polyimide and so forth, a method for manufacturing the laminate, a semiconductor device, and, a method for manufacturing the semiconductor device. The laminate comprises a substrate, and at least two resin layers, each of the resin layers is independently brought into contact, in at least a part of the surface thereof, with other resin layer, and the layers independently has a Young's modulus exceeding 2.8 GPa and not exceeding 5.0 GPa, and, an elongation after fracture exceeding 50% and not exceeding 200%, and further has a three-dimensional radical crosslinked structure, and at least one of the resin layers contains at least either polyimide or polybenzoxazole.
Abstract:
Provided are a photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition.A polyimide precursor composition in which the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole; in General Formula (1-2), A1 and A2 each independently represent an oxygen atom or NH, R111 and R112 each independently represent a single bond or a divalent organic group, and R113 and R114 each independently represent a hydrogen atom or a monovalent organic group.
Abstract:
The present invention has an object to provide a method for forming a negative tone pattern in which DOF of a resist composition used is high and shrinkage of a film in post exposure bake is suppressed; a method for manufacturing an electronic device including the pattern forming method; and an active-light-sensitive or radiation-sensitive resin composition. The method for forming a negative tone pattern of the present invention including: a film formation step of forming a resist film on a substrate, using a resist composition; an exposing step of irradiating the film with active light or radiation; a heating treatment step of performing a heating treatment on the film irradiated with active light or radiation; and a developing step of developing the heating-treated film using a developer including an organic solvent, in which the resist composition includes a resin A having a repeating unit A with a group represented by a specific formula, a resin B having a repeating unit B with a group represented by a specific formula, and a compound that generates an acid upon irradiation with active light or radiation.
Abstract:
Provided is an actinic-ray- or radiation-sensitive resin composition including a resin (A) and any of compounds (B) of general formula (I) below. (In general formula (I), Rf represents a fluorine atom or a monovalent organic group containing at least one fluorine atom; R1 represents a hydrogen atom or a monovalent substituent containing no fluorine atom; X1 represents a monovalent organic group having at least two carbon atoms, or a methyl group in which a substituent other than a fluorine atom is optionally introduced, provided that X1 may be bonded to R1 to thereby form a ring; and Z represents a moiety that when exposed to actinic rays or radiation, is converted to a sulfonic acid group, an imidic acid group or a methide acid group.)
Abstract:
There is provided a pattern forming method containing: forming a film by using a radiation-sensitive or actinic ray-sensitive resin composition containing: (A) a onium salt compound containing a nitrogen atom in a cationic moiety; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; and (C) a resin capable of increasing the polarity by the action of an acid to decrease solubility in a developer containing an organic solvent, exposing the film; and developing the exposed film by using a developer containing an organic solvent to form a negative pattern.
Abstract:
Provided is a method of forming a pattern, including forming a film comprising an actinic-ray- or radiation-sensitive resin composition comprising, resin (A) comprising any of repeating units of general formula (I) below, which resin when acted on by an acid, decreases its solubility in a developer comprising an organic solvent, and a compound (B) expressed by any of general formulae (B-1) to (B-3) below, which compound when exposed to actinic rays or radiation, generates an acid, exposing the film to actinic rays or radiation, and developing the exposed film with a developer comprising an organic solvent to thereby obtain a negative pattern.