Abstract:
A method for producing a composition, the method being for producing a composition using a stirring device provided with a stirring tank and a stirrer, includes a mixing step of charging a resin, an acid generator, and a solvent into the stirring tank, and a stirring step of stirring the mixture accommodated in the stirring tank, using the stirrer, in which a ratio c of a content of the acid generator to a total mass of the mixture is 0.3% to 2.5% by mass, the stirrer is provided with a rotatable stirring shaft, a plurality of support parts attached to the stirring shaft, and a plurality of stirring elements attached to each of end parts of the plurality of support parts, the shape and the arrangement of the stirring elements are specified, and the positions of the plurality of stirring elements are specified so as to satisfy a specific Expression (1).
Abstract:
The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin having a polarity that increases by an action of an acid, (B) a photoacid generator, and an anion (P) which is one or more anions selected from the group consisting of NO3−, SO42−, Cl−, and Br−, in which a content of the anion (P) is from 0.01 ppb to 100 ppm with respect to a total mass of the actinic ray-sensitive or radiation-sensitive resin composition, an actinic ray-sensitive or radiation-sensitive film formed from the actinic ray-sensitive or radiation-sensitive resin composition, a pattern forming method, and a method for manufacturing an electronic device.
Abstract:
Provided are an actinic ray-sensitive or radiation-sensitive resin composition, used for forming an actinic ray-sensitive or radiation-sensitive film having a film thickness of 1 μm or more, and for being exposed to actinic rays having a wavelength of 200 to 300 nm or radiation, in which the transmittance, with respect to light at a wavelength of 248 nm, of an actinic ray-sensitive or radiation-sensitive film having a film thickness of 12 μm, which is formed using the actinic ray-sensitive or radiation-sensitive resin composition, is 5% or more, and a pattern having an excellent sensitivity as well as an excellent cross-sectional shape can be formed by the actinic ray-sensitive or radiation-sensitive resin composition in a case where an actinic ray-sensitive or radiation-sensitive film having a film thickness of 1 μm or more is exposed to light at a wavelength of 200 to 300 nm.
Abstract:
An active-light-sensitive or radiation-sensitive resin composition includes a resin (A) and a photoacid generator (B) capable of generating an acid upon irradiation with active light or radiation, in which the active-light-sensitive or radiation-sensitive resin composition contains at least a photoacid generator (B1) represented by the following General Formula (1) and a photoacid generator (B2) other than the photoacid generator (B1) as the photoacid generator (B).
Abstract:
An actinic ray-sensitive or radiation-sensitive resin composition contains a resin (A) and a resin (B) which include a repeating unit having an acid-decomposable group, and the acid-decomposable group in the resin (A) and the acid-decomposable group in the resin (B) have the same structures. Regarding the resin (A) and the resin (B), |GA−GB| is from 5% by mole to 20% by mole, SA/SB is 10/90 to 90/10, |MwA−MwB| is from 100 to 5,000, and |MwA/MnA−MwB/MnB| is 0.05 or more.
Abstract:
The present invention provides a pattern forming method which can be suitably applied to grayscale exposure since a deviation of the thickness among production lots is hardly generated, and an actinic ray-sensitive or radiation-sensitive resin composition. The pattern forming method of the present invention is a pattern forming method having a step A of forming a film having a thickness T on a substrate, using an actinic ray-sensitive or radiation-sensitive resin composition including a resin whose solubility in a developer changes by the action of an acid and an acid generator, a step B of exposing the film, and a step C of developing the exposed film using a developer to form a pattern, in which the film formed in the step A satisfies at least one of the following condition 1 or 2.Condition 1: In a case where the thickness T of the film is 800 nm or more, the value of γ is less than 10,000.Condition 2: In a case where the thickness T of the film is less than 800 nm, the value of γ is less than 5,000.
Abstract:
The pattern formation method includes the following steps (i) to (iii): (i) a step in which an active-light-sensitive or radiation-sensitive resin composition is used to form a film whose solubility in a developer increases as the exposure dose increases from an unexposed state but then decreases once a predetermined exposure dose has been reached; (ii) a step in which the film is exposed; and (iii) a step in which a developer containing an organic solvent in the amount of 80% by mass or more with respect to the total amount of the developer is used to develop the exposed film.
Abstract:
A method of forming a pattern includes (a) forming a film of an actinic-ray- or radiation-sensitive resin composition, (b) exposing the film to light, and (c) developing the exposed film with a developer comprising an organic solvent to thereby form a negative pattern. The actinic-ray- or radiation-sensitive resin composition includes (A) a resin whose solubility in the developer comprising an organic solvent is lowered when acted on by an acid, which resin contains a repeating unit with any of lactone structures of general formula (1) below, and (B) a compound that when exposed to actinic rays or radiation, generates an acid.
Abstract:
There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising: (A) a resin having a group capable of decomposing by an action of an acid to produce a polar group, (C1) a compound containing a group capable of generating a first acidic functional group upon irradiation with an actinic ray or radiation and a group capable of generating a second acidic functional group different from the first acidic functional group upon irradiation with an actinic ray or radiation, and (C2) at least one compound containing two or more groups selected from the group consisting of the groups capable of generating the structures represented by the specific formulae upon irradiation with an actinic ray or radiation.
Abstract:
A pattern forming method, includes: (i) a step of forming a film from an actinic ray-sensitive or radiation-sensitive resin composition containing (P) a resin having (a1) a repeating unit represented by the following formula (I) or (II) as defined in the specification in an amount of 20 mol % or more based on all repeating units in the resin (P) and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (ii) a step of exposing the film, so as to form an exposed film; and (iii) a step of developing the exposed film by using a developer containing an organic solvent to form a negative pattern.