Microfluidic chips
    16.
    发明授权

    公开(公告)号:US11179720B2

    公开(公告)日:2021-11-23

    申请号:US16319702

    申请日:2016-10-07

    Abstract: The present disclosure is drawn to microfluidic chips. The microfluidic chips can include an inflexible material having an elastic modulus of 0.1 gigapascals (GPa) to 450 GPa. A microfluidic channel can be formed within the inflexible material and can connect an inlet and an outlet. A working electrode can be associated with the microfluidic channel and can have a surface area of 1 μm2 to 60,000 μm2 within the microfluidic channel. A bubble support structure can also be formed within the microfluidic channel such that the working electrode is positioned to electrolytically generate a bubble that becomes associated with the bubble support structure.

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