公开(公告)号：US20080230515A1

公开(公告)日：2008-09-25

申请号：US12153431

申请日：2008-05-19

申请人： Ken Iyoda ,  Makoto Namioka ,  Hideyo Osanai ,  Susumu Shimada

发明人： Ken Iyoda ,  Makoto Namioka ,  Hideyo Osanai ,  Susumu Shimada

IPC分类号： C23F1/02

CPC分类号： H05K3/068 ,  H01L21/4846 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K3/0085 ,  H01L2924/00

摘要： The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate is bonded on a part of a ceramic substrate so as to expose an outer peripheral edge portion of the ceramic substrate in an integrally bonded member, the integrally bonded member is set on a treating apparatus while being covered with a masking member having a window portion from which the circuit pattern forming metal plate of the integrally bonded member is exposed. Further, the integrally bonded member is pressed with an appropriate pressure from a base plate side so that a boundary surface between a portion surrounding the window portion in the masking member and an exposed surface of the ceramic substrate which is exposed in a metal-ceramic bonded member has a state not allowing a liquid to pass therethrough. Thereafter, a treatment solution for wet treatment is injected from an injection pipe to be in contact with the circuit pattern forming metal plate.

摘要翻译： 本发明提供了在整体接合部件上形成电路图案的方法，该方法不需要在整体接合部件进行湿处理时必需的层压膜或抗蚀剂膜的校正步骤。 在电路图案形成用金属板接合在陶瓷基板的一部分上，以将整体接合部件露出陶瓷基板的外周缘部之后，将整体接合部件设置在处理装置上，同时被覆盖 掩模构件具有窗口部分，整体结合构件的电路图案形成金属板从该窗口部分露出。 此外，整体结合部件从基板侧以适当的压力被按压，使得掩蔽部件中的窗部分周围的部分与陶瓷基板的暴露在金属 - 陶瓷结合的表面之间的边界面 构件具有不允许液体通过的状态。 此后，从喷射管注入用于湿处理的处理液，以与电路图形形成金属板接触。

公开(公告)号：US20070017652A1

公开(公告)日：2007-01-25

申请号：US11528425

申请日：2006-09-28

申请人： Hideyo Osanai ,  Susumu Ibaragi ,  Makoto Namioka

发明人： Hideyo Osanai ,  Susumu Ibaragi ,  Makoto Namioka

IPC分类号： B22D19/00 ,  B22D11/00

CPC分类号： C04B37/026 ,  B22D19/00 ,  B32B2311/12 ,  B32B2311/24 ,  C04B2237/122 ,  C04B2237/402 ,  C04B2237/407 ,  H05K1/0306 ,  H05K3/101 ,  H05K2203/128 ,  Y10T428/24917

摘要： To provide a manufacturing apparatus that is capable of manufacturing metal-ceramic composite members in various shapes with high productivity, and a mold member and a manufacturing method therefore. An apparatus for manufacturing a metal-ceramic composite member was made, the apparatus including: a plurality of process regions, namely, an atmosphere replacing/heating part 11, a molten metal push-out part 21, and a cooling part 31; and a guide 48 for allowing a mold to pass through these plural process regions, molds 60 having ceramic members 86 placed therein are successively inserted into a mold inlet 43 provided in this guide 48 to pass through the guide 48 practically in a shielded state from the atmosphere, a molten metal 53 is poured thereto in the molten-metal push-out part 21, and the molten metal 53 is cooled and solidified in the cooling part 31 to join a metal and a ceramic, thereby manufacturing the metal-ceramic composite member.

摘要翻译： 提供一种能够以高生产率制造各种形状的金属 - 陶瓷复合构件的制造装置，以及模具构件和制造方法。 制造金属 - 陶瓷复合构件的制造装置，该装置包括：多个处理区域，即气氛置换/加热部件11，熔融金属推出部件21和冷却部件31; 以及用于允许模具通过这些多个处理区域的引导件48，其中放置有陶瓷构件86的模具60被连续地插入到设置在该引导件48中的模具入口43中，以实质上穿过引导件48处于屏蔽状态 在熔融金属推出部21中注入熔融金属53，在冷却部31中使熔融金属53冷却固化，使金属与陶瓷结合，由此制造金属 - 陶瓷复合部件 。

公开(公告)号：US06997233B2

公开(公告)日：2006-02-14

申请号：US10668342

申请日：2003-09-24

申请人： Hideyo Osanai ,  Susumu Ibaragi ,  Makoto Namioka

发明人： Hideyo Osanai ,  Susumu Ibaragi ,  Makoto Namioka

IPC分类号： B22D19/00 ,  B22D19/02 ,  B22D19/04 ,  B22D10/08

CPC分类号： B22D19/00

摘要： To provide a mold capable of manufacturing a metal-ceramic composite member in which a predetermined number of ceramic members are joined onto a large joining metal, the large joining metal being free from swell and shrinkage cavity on the surface thereof and high in dimensional precision. A metal-ceramic composite member 3 according to this embodiment is manufactured in such a manner that a predetermined number of metal-ceramic bonded substrates 30 are placed in a mold main body 11 constituting a mold 1, with a ceramic substrate 31 side thereof facing upward, an atmosphere inside and outside the mold 1 is replaced with an inert gas such as a nitrogen gas from the atmosphere, a molten metal 42 is poured and filled in a first joining portion 14 that is formed by the molten metal main body 11 and an upper container 13 and that has a shrinkage cavity inducing portion 16 on a metal material holding portion side and a shrinkage cavity inducing portion 18 on an air vent side, and the molten metal 42 is cooled.

摘要翻译： 为了提供能够制造金属陶瓷复合构件的模具，其中预定数量的陶瓷构件接合到大的接合金属上，大的接合金属在其表面上没有膨胀和收缩空腔，并且尺寸精度高。 制造本实施方式的金属 - 陶瓷复合构件3，将规定数量的金属陶瓷接合基板30配置在构成模具1的模具主体11内，陶瓷基板31侧面朝上 模具1内部和外部的气氛被来自大气的惰性气体如氮气置换，熔融金属42被注入并填充在由熔融金属主体11形成的第一接合部分14和 上部容器13，并且在金属材料保持部侧具有收缩空腔诱导部分16，在通风口侧具有收缩空腔诱导部分18，并且熔融金属42被冷却。

公开(公告)号：US07387741B2

公开(公告)日：2008-06-17

申请号：US10397429

申请日：2003-03-27

申请人： Ken Iyoda ,  Makoto Namioka ,  Hideyo Osanai ,  Susumu Shimada

发明人： Ken Iyoda ,  Makoto Namioka ,  Hideyo Osanai ,  Susumu Shimada

IPC分类号： B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00

CPC分类号： H05K3/068 ,  H01L21/4846 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K3/0085 ,  H01L2924/00

摘要： The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate 13 is bonded on a part of a ceramic substrate 12 so as to expose an outer peripheral edge portion of the ceramic substrate 12 in an integrally bonded member 10, the integrally bonded member 10 is set on a treating apparatus 30 while being covered with a masking member 20 having a window portion 22 from which the circuit pattern forming metal plate 13 of the integrally bonded member 10 is exposed. Further, the integrally bonded member 10 is pressed with an appropriate pressure from a base plate 11 side so that a boundary surface between a portion 23 surrounding the window portion in the masking member and an exposed surface 16 of the ceramic substrate which is exposed in a metal-ceramic bonded member 14 has a state not allowing a liquid to pass therethrough. Thereafter, a treatment solution 33 for wet treatment is injected from an injection pipe 35 to be in contact with the circuit pattern forming metal plate 13.

摘要翻译： 本发明提供了在整体接合部件上形成电路图案的方法，该方法不需要在整体接合部件进行湿处理时必需的层压膜或抗蚀剂膜的校正步骤。 在陶瓷基板12的一部分上接合有电路图案形成用金属板13，从而在整体接合部件10中露出陶瓷基板12的外周缘部，将整体接合部件10设置在处理装置 同时被具有窗口部分22的掩模构件20覆盖，整体接合构件10的电路图案形成金属板13从该窗口部分22露出。 此外，整体接合部件10以适当的压力从基板11侧按压，使得围绕掩模部件中的窗口部分的部分23与露出在掩模部件中的陶瓷基板的暴露表面16之间的边界面 金属陶瓷接合部件14具有不允许液体通过的状态。 之后，从注入管35注入湿润处理用处理液33，与电路图案形成金属板13接触。

公开(公告)号：US07131483B2

公开(公告)日：2006-11-07

申请号：US10659305

申请日：2003-09-11

申请人： Hideyo Osanai ,  Susumu Ibaragi ,  Makoto Namioka

发明人： Hideyo Osanai ,  Susumu Ibaragi ,  Makoto Namioka

IPC分类号： B22D18/02

CPC分类号： C04B37/026 ,  B22D19/00 ,  B32B2311/12 ,  B32B2311/24 ,  C04B2237/122 ,  C04B2237/402 ,  C04B2237/407 ,  H05K1/0306 ,  H05K3/101 ,  H05K2203/128 ,  Y10T428/24917

摘要： A manufacturing apparatus capable of manufacturing metal-ceramic composite members in various shapes with high productivity, and a mold member and a manufacturing method therefor. An apparatus for manufacturing a metal-ceramic composite member has a plurality of process regions, namely, an atmosphere replacing/heating part, a molten metal push-out part, and a cooling part; and a guide for allowing a mold to pass through these plural process regions. The molds have ceramic members placed therein and are successively inserted into a mold inlet provided in the guide to pass through the guide practically in a shielded state from the atmosphere. A molten metal is poured thereto in the molten-metal push-out part, and the molten metal is cooled and solidified in the cooling part to join a metal and a ceramic, thereby manufacturing the metal-ceramic composite member.

摘要翻译： 一种能够以高生产率制造各种形状的金属 - 陶瓷复合构件的制造装置，以及模具构件及其制造方法。 金属陶瓷复合构件的制造装置具有多个处理区域，即气氛置换/加热部件，熔融金属推出部件和冷却部件; 以及允许模具通过这些多个处理区域的引导件。 模具具有放置在其中的陶瓷构件，并且依次插入设置在引导件中的模具入口中，以实际上在大气中以屏蔽状态穿过引导件。 在熔融金属推出部中注入熔融金属，在冷却部冷却固化熔融金属，使金属和陶瓷结合，制造金属 - 陶瓷复合部件。

公开(公告)号：US20050060887A1

公开(公告)日：2005-03-24

申请号：US10948695

申请日：2004-09-22

申请人： Hideyo Osanai ,  Makoto Namioka ,  Susumu Ibaraki

发明人： Hideyo Osanai ,  Makoto Namioka ,  Susumu Ibaraki

IPC分类号： H05K3/44 ,  H01L21/48 ,  H01L23/12 ,  H01L23/373 ,  H05K1/03 ,  H05K3/06 ,  H05K3/10 ,  H05K3/02

CPC分类号： H01L21/4871 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/061 ,  H05K3/101 ,  H05K2203/0108 ,  H05K2203/128 ,  H05K2203/1476 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2924/00

摘要： There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required to carry out etching, when a molten metal is caused to contact to a ceramic substrate to be cooled and solidified to bond the circuit forming metal plate to the ceramic substrate to etch the circuit forming metal plate to form a metal circuit plate having a desired circuit pattern. After a molten metal is caused to contact both sides of a ceramic substrate 10 to be cooled and solidified. Thus, a circuit forming metal plate 12 having a shape similar to a desired circuit pattern is bonded to one side of the ceramic substrate 10, and a metal base plate 14 is bonded to the other side thereof. Then, etching resists 16 are printed on the circuit forming metal plate 12 to etch the circuit forming metal plate 12 to form metal circuit plates 12 having the desired circuit pattern.

摘要翻译： 提供了一种用于制造金属/陶瓷接合电路板的方法，即使电路形成金属板厚，并且当熔融金属接触时可以缩短进行蚀刻所需的时间，其可以形成精细图案 到要冷却和固化的陶瓷基板，以将电路形成金属板结合到陶瓷基板上，以蚀刻电路形成金属板，以形成具有所需电路图案的金属电路板。 使熔融金属接触要冷却和固化的陶瓷基板10的两侧。 因此，具有与期望的电路图案相似的形状的电路形成金属板12接合到陶瓷基板10的一侧，并且金属基板14与另一侧接合。 然后，将抗蚀剂16印刷在电路形成金属板12上以蚀刻电路形成金属板12，以形成具有所需电路图案的金属电路板12。

公开(公告)号：US5446124A

公开(公告)日：1995-08-29

申请号：US920386

申请日：1992-08-18

申请人： Masahiro Niwano ,  Kenji Manabe ,  Itaru Nitta ,  Kuniaki Asai ,  Makoto Namioka ,  Nobuko Nakayama

发明人： Masahiro Niwano ,  Kenji Manabe ,  Itaru Nitta ,  Kuniaki Asai ,  Makoto Namioka ,  Nobuko Nakayama

IPC分类号： C07C69/90 ,  C07C69/94 ,  C07C327/32 ,  C08G63/06

CPC分类号： C07C327/32 ,  C07C69/90 ,  C07C69/94 ,  C08G63/06

摘要： The present invention provides an aromatic oligomer comprising repeating structural units represented by the following formula (I), which oligomer has a number-average degree of polymerization of 2 to 10 and a flow temperature of 100.degree. to 400.degree. C.; and a process for preparing the same: ##STR1## wherein X is selected from O and S; and Ar is selected from ##STR2## wherein R.sup.1 and R.sup.2 are each selected from alkyl group having 1 to 3 carbon atoms and phenyl group, and p and q are each an integer of 0 to 2.The aromatic oligomer of this invention is mixed or reacted with a polymeric substance such as thermoplastic resin, thermosetting resin and rubber to realize enhancement of performance and functional characteristics of the polymeric material.

摘要翻译： PCT No.PCT / JP90 / 01593 Sec。 371日期：1992年8月18日 102（e）日期1992年8月18日PCT提交1990年12月6日PCT公布。 WO91 / 12227 PCT出版物 日本1991年8月22日。本发明提供了包含由下式（I）表示的重复结构单元的芳族低聚物，该低聚物的数均聚合度为2〜10，流动温度为100〜400 DEG; 及其制备方法：S; 并且Ar选自具有1至3个碳原子和苯基的 基团，p和q各自为0至2的整数。本发明的芳族低聚物与聚合物质如 作为热塑性树脂，热固性树脂和橡胶，以实现聚合物材料的性能和功能特性的提高。

公开(公告)号：US20080130123A1

公开(公告)日：2008-06-05

申请号：US12007104

申请日：2008-01-07

申请人： Makoto Namioka ,  Masato Kuwabara

发明人： Makoto Namioka ,  Masato Kuwabara

IPC分类号： G02B27/00

CPC分类号： G02B5/0268 ,  G02B5/0221 ,  G02B5/0236 ,  G02F1/133502

摘要： An anti-glare optical film which reduces in whitening of a screen without sacrificing anti-glare property, and a process for preparing the same. There is provided an anti-glare optical film has an irregular surface, wherein a ratio of areas of the surface having an inclination angle of 1° or less is 20% or less, a ratio of areas of the surface having an inclination angle of 5° or more is 20% or less, and a standard deviation of a height of the surface is 0.2 μm or less. There is also provided a process for preparing an anti-glare optical film.

摘要翻译： 一种防眩光光学薄膜及其制备方法，其可减少屏幕的白化而不牺牲防眩光性。 提供了具有不规则表面的防眩光光学膜，其中具有1°或更小的倾斜角的表面的面积的比率为20％或更小，具有倾斜角度为5°的表面的面积比 °以上为20％以下，表面高度的标准偏差为0.2μm以下。 还提供了制备抗眩光光学膜的方法。

公开(公告)号：US06613450B2

公开(公告)日：2003-09-02

申请号：US10108317

申请日：2002-03-27

申请人： Nobuyoshi Tsukaguchi ,  Jyunji Nakamura ,  Masahiko Wada ,  Makoto Namioka ,  Masami Kimura

发明人： Nobuyoshi Tsukaguchi ,  Jyunji Nakamura ,  Masahiko Wada ,  Makoto Namioka ,  Masami Kimura

IPC分类号： C04B3702

CPC分类号： C04B37/026 ,  B23K35/007 ,  B23K35/286 ,  B23K35/3006 ,  B23K2101/34 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/18 ,  B23K2103/52 ,  B32B18/00 ,  B32B38/145 ,  B32B2309/68 ,  B32B2311/12 ,  B32B2311/24 ,  C04B35/01 ,  C04B35/10 ,  C04B35/56 ,  C04B35/565 ,  C04B35/58 ,  C04B35/581 ,  C04B35/584 ,  C04B37/023 ,  C04B2235/3232 ,  C04B2235/402 ,  C04B2235/404 ,  C04B2235/405 ,  C04B2235/407 ,  C04B2235/408 ,  C04B2235/428 ,  C04B2235/96 ,  C04B2237/121 ,  C04B2237/125 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/50 ,  C04B2237/708 ,  H01L2224/291 ,  H01L2224/32225 ,  H05K1/0306 ,  H05K3/38 ,  Y10T428/12535 ,  Y10T428/12576 ,  Y10T428/1259 ,  H01L2924/014

摘要： There is provided a metal/ceramic bonding article which ensures sufficient thermal shock resistance and has a substrate having a small outside dimension and which has both high reliability and compactness. The metal/ceramic bonding article comprises: a ceramic substrate; and a metal plate bonded to the ceramic substrate via a brazing filler metal, wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is longer than 30 &mgr;m and which is 250 &mgr;m or less, or wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is 25% or more of the thickness of the metal plate.

摘要翻译： 提供了一种确保足够的耐热冲击性的金属/陶瓷粘结物品，并且具有外部尺寸小的基板，并且具有高可靠性和紧凑性。 金属/陶瓷接合制品包括：陶瓷基板; 以及金属板，其通过钎料与陶瓷基板接合，其中，所述钎料从所述金属板的底面突出长度大于30μm，长度为250μm以下，或者所述钎焊 填充金属从金属板的底面突出金属板厚度的25％以上的长度。

公开(公告)号：US06419366B1

公开(公告)日：2002-07-16

申请号：US09576768

申请日：2000-05-24

申请人： Makoto Namioka

发明人： Makoto Namioka

IPC分类号： G02B2700

CPC分类号： G02B1/11

摘要： An image display device is provided which comprises an antiglare surface having unevenness and pixels having a minimum pixel pitch (a) of about 10 to about 100 &mgr;m, wherein a ratio (Sm/a) of an average spacing of roughness peak (Sm) of said unevenness to the minimum pixel pitch (a) is about 0.4 or smaller. In the image display device, the generation of “glittering” can be restrained.

摘要翻译： 提供一种图像显示装置，其包括具有不均匀性的防眩光表面和具有约10至约100μm的最小像素间距（a）的像素，其中，平均间隔粗糙度（Sm）的比（Sm / a） 所述对于最小像素间距（a）的不均匀度为约0.4或更小。 在图像显示装置中，可以抑制“闪光”的产生。