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27 条记录 (耗时 0.058 秒)

    Method for producing metal/ceramic bonding circuit board
    2.
    发明授权
    Method for producing metal/ceramic bonding circuit board 有权
    金属/陶瓷接合电路板的制造方法

    公开(公告)号：US07340828B2

    公开(公告)日：2008-03-11

    申请号：US10948695

    申请日：2004-09-22

    申请人： Hideyo Osanai ,  Makoto Namioka ,  Susumu Ibaraki

    发明人： Hideyo Osanai ,  Makoto Namioka ,  Susumu Ibaraki

    IPC分类号： H05K3/02

    CPC分类号： H01L21/4871 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/061 ,  H05K3/101 ,  H05K2203/0108 ,  H05K2203/128 ,  H05K2203/1476 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2924/00

    摘要： There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required to carry out etching, when a molten metal is caused to contact to a ceramic substrate to be cooled and solidified to bond the circuit forming metal plate to the ceramic substrate to etch the circuit forming metal plate to form a metal circuit plate having a desired circuit pattern. A molten metal is caused to contact both sides of a ceramic substrate 10 to be cooled and solidified. Thus, a circuit forming metal plate 12 having a shape similar to a desired circuit pattern is bonded to one side of the ceramic substrate 10, and a metal base plate 14 is bonded to the other side thereof.

    摘要翻译： 提供了一种用于制造金属/陶瓷接合电路板的方法，即使电路形成金属板厚，并且当熔融金属接触时可以缩短进行蚀刻所需的时间，其可以形成精细图案 到要冷却和固化的陶瓷基板，以将电路形成金属板结合到陶瓷基板上，以蚀刻电路形成金属板，以形成具有所需电路图案的金属电路板。 使熔融金属接触待冷却和固化的陶瓷基板10的两侧。 因此，具有与期望的电路图案相似的形状的电路形成金属板12接合到陶瓷基板10的一侧，并且金属基板14与另一侧接合。

    Aromatic oligomer and process for preparing the same
    4.
    发明授权
    Aromatic oligomer and process for preparing the same 失效
    芳族低聚物及其制备方法

    公开(公告)号：US5446124A

    公开(公告)日：1995-08-29

    申请号：US920386

    申请日：1992-08-18

    申请人： Masahiro Niwano ,  Kenji Manabe ,  Itaru Nitta ,  Kuniaki Asai ,  Makoto Namioka ,  Nobuko Nakayama

    发明人： Masahiro Niwano ,  Kenji Manabe ,  Itaru Nitta ,  Kuniaki Asai ,  Makoto Namioka ,  Nobuko Nakayama

    IPC分类号： C07C69/90 ,  C07C69/94 ,  C07C327/32 ,  C08G63/06

    CPC分类号： C07C327/32 ,  C07C69/90 ,  C07C69/94 ,  C08G63/06

    摘要： The present invention provides an aromatic oligomer comprising repeating structural units represented by the following formula (I), which oligomer has a number-average degree of polymerization of 2 to 10 and a flow temperature of 100.degree. to 400.degree. C.; and a process for preparing the same: ##STR1## wherein X is selected from O and S; and Ar is selected from ##STR2## wherein R.sup.1 and R.sup.2 are each selected from alkyl group having 1 to 3 carbon atoms and phenyl group, and p and q are each an integer of 0 to 2.The aromatic oligomer of this invention is mixed or reacted with a polymeric substance such as thermoplastic resin, thermosetting resin and rubber to realize enhancement of performance and functional characteristics of the polymeric material.

    摘要翻译： PCT No.PCT / JP90 / 01593 Sec。 371日期：1992年8月18日 102（e）日期1992年8月18日PCT提交1990年12月6日PCT公布。 WO91 / 12227 PCT出版物 日本1991年8月22日。本发明提供了包含由下式（I）表示的重复结构单元的芳族低聚物，该低聚物的数均聚合度为2〜10，流动温度为100〜400 DEG; 及其制备方法：S; 并且Ar选自具有1至3个碳原子和苯基的 基团，p和q各自为0至2的整数。本发明的芳族低聚物与聚合物质如 作为热塑性树脂，热固性树脂和橡胶，以实现聚合物材料的性能和功能特性的提高。

    Metal/ceramic bonding substrate and method for producing same
    5.
    发明授权
    Metal/ceramic bonding substrate and method for producing same 有权
    金属/陶瓷接合基材及其制造方法

    公开(公告)号：US07256353B2

    公开(公告)日：2007-08-14

    申请号：US10747837

    申请日：2003-12-29

    申请人： Hideyo Osanai ,  Susumu Ibaraki ,  Ken Iyoda ,  Makoto Namioka

    发明人： Hideyo Osanai ,  Susumu Ibaraki ,  Ken Iyoda ,  Makoto Namioka

    IPC分类号： H05K1/00

    CPC分类号： H01L23/13 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/0058 ,  Y10T428/12007 ,  Y10T428/12493 ,  Y10T428/24926 ,  H01L2924/00

    摘要： There is provided a metal/ceramic bonding substrate capable of preventing the reverse thereof from greatly warping so as to be concave even if it is heated for soldering. In the metal/ceramic bonding substrate, a metal circuit plate 12 is bonded to one side of a ceramic substrate 10, and a heat sink plate (metal base plate) 14 is bonded to the other side thereof. On the heat sink plate 14, a work-hardened layer 16 is formed by shot peening. On the metal circuit plate 12 of the metal/ceramic bonding substrate, semiconductor chips (Si chips) 18 are soldered (solder layer 20). Then, a power module is produced by a predetermined process. On the reverse (the side of the work-hardened layer 16) of the power module, a radiating fin 26 is mounted via a thermal grease 24 by means of screws 22 or the like.

    摘要翻译： 提供了一种金属/陶瓷接合基板，其能够防止其逆向大的翘曲，从而即使被加热用于焊接也是凹的。 在金属/陶瓷接合基板中，金属电路板12接合在陶瓷基板10的一侧，并且散热板（金属基板）14接合到其另一侧。 在散热板14上，通过喷丸硬化形成加固硬化层16。 在金属/陶瓷接合基板的金属电路板12上焊接半导体芯片（Si芯片）18（焊料层20）。 然后，通过预定的处理产生功率模块。 在功率模块的相反（加工硬化层16的侧面）上，散热片26经由导热油脂24通过螺钉22等安装。

    Mold and method for manufacturing metal-ceramic composite member
    7.
    发明申请
    Mold and method for manufacturing metal-ceramic composite member 有权
    金属陶瓷复合材料制造用模具及其制造方法

    公开(公告)号：US20050016707A1

    公开(公告)日：2005-01-27

    申请号：US10668342

    申请日：2003-09-24

    申请人： Hideyo Osanai ,  Susumu Ibaragi ,  Makoto Namioka

    发明人： Hideyo Osanai ,  Susumu Ibaragi ,  Makoto Namioka

    IPC分类号： B22C9/00 ,  B22C9/06 ,  B22C9/22 ,  B22D19/00 ,  H01L23/12 ,  B22D19/04

    CPC分类号： B22D19/00

    摘要： To provide a mold capable of manufacturing a metal-ceramic composite member in which a predetermined number of ceramic members are joined onto a large joining metal, the large joining metal being free from swell and shrinkage cavity on the surface thereof and high in dimensional precision. A metal-ceramic composite member 3 according to this embodiment is manufactured in such a manner that a predetermined number of metal-ceramic bonded substrates 30 are placed in a mold main body 11 constituting a mold 1, with a ceramic substrate 31 side thereof facing upward, an atmosphere inside and outside the mold 1 is replaced with an inert gas such as a nitrogen gas from the atmosphere, a molten metal 42 is poured and filled in a first joining portion 14 that is formed by the molten metal main body 11 and an upper container 13 and that has a shrinkage cavity inducing portion 16 on a metal material holding portion side and a shrinkage cavity inducing portion 18 on an air vent side, and the molten metal 42 is cooled.

    摘要翻译： 为了提供能够制造金属陶瓷复合构件的模具，其中预定数量的陶瓷构件接合到大的接合金属上，大的接合金属在其表面上没有膨胀和收缩空腔，并且尺寸精度高。 制造本实施方式的金属 - 陶瓷复合构件3，将规定数量的金属陶瓷接合基板30配置在构成模具1的模具主体11内，陶瓷基板31侧面朝上 模具1内部和外部的气氛被来自大气的惰性气体如氮气置换，熔融金属42被注入并填充在由熔融金属主体11形成的第一接合部分14和 上部容器13，并且在金属材料保持部侧具有收缩空腔诱导部分16，在通风口侧具有收缩空腔诱导部分18，并且熔融金属42被冷却。

    Apparatus, mold, and method for manufacturing metal-ceramic composite member
    8.
    发明授权
    Apparatus, mold, and method for manufacturing metal-ceramic composite member 有权
    用于制造金属 - 陶瓷复合材料的装置，模具和方法

    公开(公告)号：US08011416B2

    公开(公告)日：2011-09-06

    申请号：US11528425

    申请日：2006-09-28

    申请人： Hideyo Osanai ,  Susumu Ibaragi ,  Makoto Namioka

    发明人： Hideyo Osanai ,  Susumu Ibaragi ,  Makoto Namioka

    IPC分类号： B22D19/00

    CPC分类号： C04B37/026 ,  B22D19/00 ,  B32B2311/12 ,  B32B2311/24 ,  C04B2237/122 ,  C04B2237/402 ,  C04B2237/407 ,  H05K1/0306 ,  H05K3/101 ,  H05K2203/128 ,  Y10T428/24917

    摘要： To provide a manufacturing apparatus that is capable of manufacturing metal-ceramic composite members in various shapes with high productivity, and a mold member and a manufacturing method therefore. An apparatus for manufacturing a metal-ceramic composite member was made, the apparatus including: a plurality of process regions, namely, an atmosphere replacing/heating part 11, a molten metal push-out part 21, and a cooling part 31; and a guide 48 for allowing a mold to pass through these plural process regions, molds 60 having ceramic members 86 placed therein are successively inserted into a mold inlet 43 provided in this guide 48 to pass through the guide 48 practically in a shielded state from the atmosphere, a molten metal 53 is poured thereto in the molten-metal push-out part 21, and the molten metal 53 is cooled and solidified in the cooling part 31 to join a metal and a ceramic, thereby manufacturing the metal-ceramic composite member.

    摘要翻译： 提供一种能够以高生产率制造各种形状的金属 - 陶瓷复合构件的制造装置，以及模具构件和制造方法。 制造金属 - 陶瓷复合构件的制造装置，该装置包括：多个处理区域，即气氛置换/加热部件11，熔融金属推出部件21和冷却部件31; 以及用于允许模具通过这些多个处理区域的引导件48，其中放置有陶瓷构件86的模具60被连续地插入到设置在该引导件48中的模具入口43中，以实质上穿过引导件48处于屏蔽状态 在熔融金属推出部21中注入熔融金属53，在冷却部31中使熔融金属53冷却固化，使金属与陶瓷结合，制造金属 - 陶瓷复合部件 。

    Anti-glare optical film and process for preparing the same
    9.
    发明申请
    Anti-glare optical film and process for preparing the same 审中-公开
    防眩光膜及其制备方法

    公开(公告)号：US20080130123A1

    公开(公告)日：2008-06-05

    申请号：US12007104

    申请日：2008-01-07

    申请人： Makoto Namioka ,  Masato Kuwabara

    发明人： Makoto Namioka ,  Masato Kuwabara

    IPC分类号： G02B27/00

    CPC分类号： G02B5/0268 ,  G02B5/0221 ,  G02B5/0236 ,  G02F1/133502

    摘要： An anti-glare optical film which reduces in whitening of a screen without sacrificing anti-glare property, and a process for preparing the same. There is provided an anti-glare optical film has an irregular surface, wherein a ratio of areas of the surface having an inclination angle of 1° or less is 20% or less, a ratio of areas of the surface having an inclination angle of 5° or more is 20% or less, and a standard deviation of a height of the surface is 0.2 μm or less. There is also provided a process for preparing an anti-glare optical film.

    摘要翻译： 一种防眩光光学薄膜及其制备方法，其可减少屏幕的白化而不牺牲防眩光性。 提供了具有不规则表面的防眩光光学膜，其中具有1°或更小的倾斜角的表面的面积的比率为20％或更小，具有倾斜角度为5°的表面的面积比 °以上为20％以下，表面高度的标准偏差为0.2μm以下。 还提供了制备抗眩光光学膜的方法。