-
公开(公告)号：US08258409B2
公开(公告)日：2012-09-04
申请号：US12058040
申请日：2008-03-28
IPC分类号： H05K1/00
CPC分类号： H05K3/383 , H01L23/3128 , H01L23/498 , H01L23/49838 , H01L23/564 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/056 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/48599 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H05K3/243 , H05K3/3452 , H05K2201/09727 , H05K2201/09772 , H05K2201/0989 , H05K2203/0307 , H05K2203/0361 , H05K2203/049 , H05K2203/0542 , H05K2203/0723 , H05K2203/1152 , H05K2203/1476 , Y10T29/49155 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： Provided are a circuit board with enhanced moisture resist and the method of manufacturing the circuit board, and a circuit device and a method of manufacturing the circuit device. A circuit board of the present invention includes: a substrate; wirings formed on the main surface of the substrate; a cover layer covering the wirings excluding the regions to be connectors; back electrodes formed on the bottom surface of the substrate; and through-hole electrodes formed so as to penetrate the substrate, and thereby connecting the wirings and the back electrodes. On surfaces of each of the wirings in this circuit board, convex portions on the periphery of the substrate are set larger in width than convex portions in a center portion of the substrate. With this configuration, adhesion reliability between the wirings and the cover layer under a thermal cycle load can be enhanced.
摘要翻译： 提供了一种具有增强的抗湿性的电路板和制造该电路板的方法，以及电路装置和该电路装置的制造方法。 本发明的电路板包括：基板; 在基板的主表面上形成的布线; 覆盖除了作为连接器的区域的布线的覆盖层; 形成在基板的底面上的背面电极; 以及形成为穿透基板的通孔电极，从而连接布线和背面电极。 在该电路基板的各配线的表面上，基板周边的凸部的宽度比基板的中央部的凸部的宽度大。 利用这种结构，可以提高热循环负载下的布线与覆盖层之间的粘附可靠性。
-
12.发明授权Method of manufacturing the circuit apparatus, method of manufacturing the circuit board, and method of manufacturing the circuit device 失效电路装置的制造方法，电路基板的制造方法以及电路装置的制造方法公开(公告)号：US08166643B2
公开(公告)日：2012-05-01
申请号：US12702865
申请日：2010-02-09
申请人： Kiyoshi Shibata , Ryosuke Usui , Yasunori Inoue
发明人： Kiyoshi Shibata , Ryosuke Usui , Yasunori Inoue
IPC分类号： H05K3/36
CPC分类号： H05K3/445 , H01L2224/16 , H01L2924/01019 , H01L2924/01078 , H05K1/056 , H05K3/0047 , H05K3/44 , H05K2201/0382 , H05K2201/09054 , H05K2201/09609 , H05K2201/0969 , H05K2203/0323 , Y10T29/49126 , Y10T29/4913 , Y10T29/49165
摘要： A method of manufacturing a circuit apparatus includes forming a plurality of pierced holes in a metal substrate. A first wiring layer is formed on one side of the metal substrate via a first insulating layer, and a second wiring layer is formed on the other side of the metal substrate via a second insulating layer. A conductor layer is formed in at least some of the plurality of pierced holes to establish a connection between the first wiring layer and the second wiring layer. A circuit element is connected to the first wiring layer on the one side of the metal substrate. When a plurality of pierced holes are formed, protrusions are formed on a surface of the metal substrate at least along either edge of each of the pierced holes provided with the conductor layer to protrude in a convex manner from the surface of the metal substrate.
摘要翻译： 电路装置的制造方法包括在金属基板上形成多个穿孔。 第一布线层经由第一绝缘层在金属基板的一侧上形成，并且第二布线层经由第二绝缘层形成在金属基板的另一侧上。 在多个穿孔中的至少一些穿孔中形成导体层，以建立第一布线层和第二布线层之间的连接。 电路元件连接到金属基板的一侧上的第一布线层。 当形成多个穿孔时，至少沿着设置有导体层的每个穿孔的任一边缘，在金属基板的表面上形成突起，以从金属基板的表面凸出突出。
-
公开(公告)号：US07683266B2
公开(公告)日：2010-03-23
申请号：US11494744
申请日：2006-07-28
申请人： Kiyoshi Shibata , Ryosuke Usui , Yasunori Inoue
发明人： Kiyoshi Shibata , Ryosuke Usui , Yasunori Inoue
CPC分类号： H05K3/445 , H01L2224/16 , H01L2924/01019 , H01L2924/01078 , H05K1/056 , H05K3/0047 , H05K3/44 , H05K2201/0382 , H05K2201/09054 , H05K2201/09609 , H05K2201/0969 , H05K2203/0323 , Y10T29/49126 , Y10T29/4913 , Y10T29/49165
摘要： A circuit board and a circuit apparatus using the same which can prevent displacement and film exfoliation ascribable to thermal expansion, and suppress a drop in reliability at increasing temperatures. The circuit board of the circuit apparatus includes a metal substrate having pierced holes as a core member. Protrusions are formed on the top ends of the pierced holes, and depressions are formed in the bottom ends of the pierced holes. Wiring pattern layers are formed on both sides of this metal substrate via respective insulating layers. In order to establish electrical connection between the wiring pattern layers, a conductor layer which connects the wiring pattern layers is formed through the metal substrate via the pierced holes. The conductor layer thereby establishes electrical conduction between the wiring pattern layers. Furthermore, a semiconductor chip is directly connected to the surface side of the circuit board via solder balls.
摘要翻译： 一种电路板和使用该电路板的电路装置，其可以防止由于热膨胀而引起的位移和膜剥落，并且抑制在升高的温度下的可靠性降低。 电路装置的电路板包括具有穿孔作为芯构件的金属基板。 在穿孔的顶端形成突起，在穿孔的底端形成凹部。 接线图案层通过各自的绝缘层形成在该金属基板的两侧上。 为了建立布线图案层之间的电连接，通过穿孔穿过金属基板形成连接布线图案层的导体层。 导体层由此在布线图案层之间建立导电。 此外，半导体芯片通过焊球直接连接到电路板的表面侧。
-
公开(公告)号：US4386845A
公开(公告)日：1983-06-07
申请号：US220721
申请日：1980-12-29
CPC分类号： B82Y15/00 , G03G15/70 , G03G21/0047 , G03G21/12
摘要： An electrostatic copying apparatus is provided wherein a stationary original document image is projected onto a photosensitive member during movement of an optical device for exposure. An electrostatic latent image formed on the photosensitive member is transferred onto a copy sheet and is fixed. A jam detecting means is provided for immediately detecting a copy sheet being jammed along a transport path. A cleaning device removes residual toner particles remaining on the photosensitive member by means of magnetic force and stores the removed toner particles after a transferring operation. The occurrence of a jam is detected immediately, and thus a fault or an accident of the electrostatic copying apparatus due to the jam is prevented from continuing.
摘要翻译： 提供了一种静电复印装置，其中在用于曝光的光学装置的移动期间将静止原稿图像投影到感光构件上。 形成在感光构件上的静电潜像被转印到复印纸上并被固定。 提供卡纸检测装置，用于立即检测沿传送路径卡住的复印纸。 清洁装置通过磁力去除残留在感光构件上的残留调色剂颗粒，并在转印操作之后存储去除的调色剂颗粒。 立即检测到卡纸的发生，从而防止由于卡纸而导致的静电复印设备的故障或事故继续。
-
公开(公告)号：US4362502A
公开(公告)日：1982-12-07
申请号：US298771
申请日：1981-09-02
CPC分类号： G03G15/2064 , Y10T74/19014 , Y10T74/19056
摘要： A fixing and heating device for an electrostatic copying apparatus includes a fixing roller which (a) remains stationary at least until a toner is softened, (b) is driven at a low speed to even the surface temperature of the fixing roller when the surface temperature is lower than a temperature suitable for fixing when the surface temperature and is equal to the temperature suitable for fixing except during a fixing operation, and (c) is driven at a speed suitable for fixing when the surface temperature is suitable for fixing during the fixing operation.
摘要翻译： 一种用于静电复印设备的固定和加热装置包括定影辊，（a）至少直到调色剂软化为止保持静止，（b）当表面温度低于定影辊的表面温度时，以低速驱动至甚至表面温度 低于适于固定的温度，除了在定影操作期间，表面温度等于适合于固定的温度，和（c）当表面温度适合于定影期间固定时，以适于固定的速度驱动 操作。
-
公开(公告)号：US4316719A
公开(公告)日：1982-02-23
申请号：US158381
申请日：1980-06-11
CPC分类号： G03G15/2064 , Y10T74/19014 , Y10T74/19056
摘要： A fixing and heating device for an electrostatic copying apparatus includes a fixing roller which (a) remains stationary at least until a toner is softened, (b) is driven at a low speed to even the surface temperature of the fixing roller when the surface temperature is lower than a temperature suitable for fixing and when the surface temperature is equal to the temperature suitable for fixing except during a fixng operation, and (c) is driven at a speed suitable for fixing when the surface temperature is suitable for fixing during the fixing operation.
摘要翻译： 一种用于静电复印设备的固定和加热装置包括定影辊，（a）至少直到调色剂软化为止保持静止，（b）当表面温度低于定影辊的表面温度时，以低速驱动至甚至表面温度 低于适于固定的温度，以及当表面温度等于固定操作期间适合于固定的温度时，以及（c）以适于固定的速度驱动，当表面温度适合于在固定期间固定时 操作。
-
公开(公告)号：US20150041097A1
公开(公告)日：2015-02-12
申请号：US14381343
申请日：2012-02-22
申请人： Kiyoshi Shibata , Hideaki Yokoyama , Koichi Sato
发明人： Kiyoshi Shibata , Hideaki Yokoyama , Koichi Sato
摘要： A water jacket core (10) includes a base part (11) and is provided with an intermediate female thread part (15) in that base within a region surrounded by tangent lines (18, 19) that are parallel to a center line (17) passing through the centers of a plurality of bore pin insertion bores (12) for forming cylinder bores and are in contact with the bore pin insertion bores and by an intermediate position for the adjacent bore pin insertion bores.
摘要翻译： 水套芯（10）包括基部（11），并且在由与中心线（17）平行的切线（18,19）包围的区域内的该基座中设有中间阴螺纹部分（15） ）通过多个钻孔插入孔（12）的中心，用于形成缸孔，并与孔销插入孔和相邻孔销插入孔的中间位置接触。
-
公开(公告)号：US08016019B2
公开(公告)日：2011-09-13
申请号：US12596549
申请日：2008-04-17
IPC分类号： B22D18/04
摘要： The object of the present invention is to provide a casting method capable of simultaneously attaining the shortening of cycle time and the improvement in casting quality.The pressure allowing the molten metal level to go up to the positions of from P0 to P4 is applied to the molten metal within a molten metal reservoir 1. Then, the pressure of P4 is maintained for a predetermined time. During this time, the molten metal which comes into contact with an upper die 4 is cooled earlier than the molten metal being in contact with another die. Through this cooling the molten metal shrinks. However, since the pressure of P4 is maintained, the molten metal is supplied from the lower side to a shrunk portion, so as not to cause shrinkage cavity or underfill.
摘要翻译： 本发明的目的是提供能够同时实现循环时间缩短和铸造品质的提高的铸造方法。 使熔融金属水平上升到P0至P4的位置的压力施加到熔融金属储存器1内的熔融金属上。然后，将P4的压力保持预定时间。 在此期间，与上模4接触的熔融金属比与另一模具接触的熔融金属更早地被冷却。 通过这种冷却，熔融金属收缩。 然而，由于保持P4的压力，所以熔融金属从下侧供应到收缩部分，以便不会造成空腔或底部填充。
-
19.发明申请PACKING BOARD FOR ELECTRONIC DEVICE, PACKING BOARD MANUFACTURING METHOD, SEMICONDUCTOR MODULE, SEMICONDUCTOR MODULE MANUFACTURING METHOD, AND MOBILE DEVICE 有权电子装置用包装板，包装板制造方法，半导体模块，半导体模块制造方法和移动装置公开(公告)号：US20080157338A1
公开(公告)日：2008-07-03
申请号：US11957030
申请日：2007-12-14
CPC分类号： H01L23/3114 , H01L23/525 , H01L24/11 , H01L24/12 , H01L2224/0231 , H01L2224/02313 , H01L2224/02319 , H01L2224/02333 , H01L2224/0401 , H01L2224/13022 , H01L2224/13099 , H01L2224/13147 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/351 , H01L2924/00
摘要： A manufacturing technology is provided capable of improving the reliability of a semiconductor module having a via contact connected to an electrode part of a semiconductor device. A conductive bump is formed on an insulating layer such that the end of the conductive bump is in contact with an electrode of a semiconductor substrate. By pressure-molding the assembly using a press machine, the semiconductor substrate, the conductive bump, and the insulating layer are integrated. With this, the conductive bump is allowed to embed itself in the insulating layer while maintaining contact with the electrode. The insulating layer is subject to laser irradiation from above so as to form an aperture exposing the conductive bump. Subsequently, the upper surface of the insulating layer and the interior surface of the aperture are plated with copper by electroless plating and electroplating so as to form a copper plating layer, and a via contact is formed in the aperture so as to coat the inner wall of the aperture.
摘要翻译： 提供了能够提高具有连接到半导体器件的电极部分的通孔接触的半导体模块的可靠性的制造技术。 导电凸块形成在绝缘层上，使得导电凸块的端部与半导体衬底的电极接触。 通过使用压制机对组件进行加压成型，将半导体衬底，导电凸块和绝缘层集成。 由此，允许导电凸块自身嵌入绝缘层中，同时保持与电极的接触。 绝缘层从上方经受激光照射，以形成露出导电凸块的孔。 随后，绝缘层的上表面和孔的内表面通过无电解电镀和电镀电镀铜，以形成镀铜层，并且在孔中形成通孔接触以涂覆内壁 的孔径。
-
公开(公告)号：US20070023202A1
公开(公告)日：2007-02-01
申请号：US11494744
申请日：2006-07-28
申请人： Kiyoshi Shibata , Ryosuke Usui , Yasunori Inoue
发明人： Kiyoshi Shibata , Ryosuke Usui , Yasunori Inoue
IPC分类号： H05K1/00
CPC分类号： H05K3/445 , H01L2224/16 , H01L2924/01019 , H01L2924/01078 , H05K1/056 , H05K3/0047 , H05K3/44 , H05K2201/0382 , H05K2201/09054 , H05K2201/09609 , H05K2201/0969 , H05K2203/0323 , Y10T29/49126 , Y10T29/4913 , Y10T29/49165
摘要： A circuit board and a circuit apparatus using the same which can prevent displacement and film exfoliation ascribable to thermal expansion, and suppress a drop in reliability at increasing temperatures. The circuit board of the circuit apparatus includes a metal substrate having pierced holes as a core member. Protrusions are formed on the top ends of the pierced holes, and depressions are formed in the bottom ends of the pierced holes. Wiring pattern layers are formed on both sides of this metal substrate via respective insulating layers. In order to establish electrical connection between the wiring pattern layers, a conductor layer which connects the wiring pattern layers is formed through the metal substrate via the pierced holes. The conductor layer thereby establishes electrical conduction between the wiring pattern layers. Furthermore, a semiconductor chip is directly connected to the surface side of the circuit board via solder balls.
摘要翻译： 一种电路板和使用该电路板的电路装置，其可以防止由于热膨胀而引起的位移和膜剥落，并且抑制在升高的温度下的可靠性降低。 电路装置的电路板包括具有穿孔作为芯构件的金属基板。 在穿孔的顶端形成突起，在穿孔的底端形成凹部。 接线图案层通过各自的绝缘层形成在该金属基板的两侧上。 为了建立布线图案层之间的电连接，通过穿孔穿过金属基板形成连接布线图案层的导体层。 导体层由此在布线图案层之间建立导电。 此外，半导体芯片通过焊球直接连接到电路板的表面侧。
-
-
-
-
-
-
-
-
-
搜索结果
60 条记录 (耗时 0.042 秒)