公开(公告)号：US08258409B2

公开(公告)日：2012-09-04

申请号：US12058040

申请日：2008-03-28

申请人： Yasuhiro Kohara ,  Kiyoshi Shibata ,  Masayuki Nagamatsu ,  Ryosuke Usui ,  Toshiya Shimizu

发明人： Yasuhiro Kohara ,  Kiyoshi Shibata ,  Masayuki Nagamatsu ,  Ryosuke Usui ,  Toshiya Shimizu

IPC分类号： H05K1/00

CPC分类号： H05K3/383 ,  H01L23/3128 ,  H01L23/498 ,  H01L23/49838 ,  H01L23/564 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/056 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K3/243 ,  H05K3/3452 ,  H05K2201/09727 ,  H05K2201/09772 ,  H05K2201/0989 ,  H05K2203/0307 ,  H05K2203/0361 ,  H05K2203/049 ,  H05K2203/0542 ,  H05K2203/0723 ,  H05K2203/1152 ,  H05K2203/1476 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： Provided are a circuit board with enhanced moisture resist and the method of manufacturing the circuit board, and a circuit device and a method of manufacturing the circuit device. A circuit board of the present invention includes: a substrate; wirings formed on the main surface of the substrate; a cover layer covering the wirings excluding the regions to be connectors; back electrodes formed on the bottom surface of the substrate; and through-hole electrodes formed so as to penetrate the substrate, and thereby connecting the wirings and the back electrodes. On surfaces of each of the wirings in this circuit board, convex portions on the periphery of the substrate are set larger in width than convex portions in a center portion of the substrate. With this configuration, adhesion reliability between the wirings and the cover layer under a thermal cycle load can be enhanced.

摘要翻译： 提供了一种具有增强的抗湿性的电路板和制造该电路板的方法，以及电路装置和该电路装置的制造方法。 本发明的电路板包括：基板; 在基板的主表面上形成的布线; 覆盖除了作为连接器的区域的布线的覆盖层; 形成在基板的底面上的背面电极; 以及形成为穿透基板的通孔电极，从而连接布线和背面电极。 在该电路基板的各配线的表面上，基板周边的凸部的宽度比基板的中央部的凸部的宽度大。 利用这种结构，可以提高热循环负载下的布线与覆盖层之间的粘附可靠性。

公开(公告)号：US20100244171A1

公开(公告)日：2010-09-30

申请号：US12727913

申请日：2010-03-19

申请人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

发明人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

IPC分类号： H01L31/02

CPC分类号： H01L27/14618 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14643 ,  H01L2224/05554 ,  H01L2224/48 ,  H01L2224/49175 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H04N5/2257 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor module includes a lower wiring substrate having a semiconductor device mounted and an upper wiring substrate having an opening in a position corresponding to the semiconductor device and having a packaging-component mountable region around the opening. The lower wiring substrate and the upper wiring substrate are electrically connected to each other via a plurality of solder balls provided around the semiconductor device. The solder balls are covered with light blocking under-fills.

摘要翻译： 半导体模块包括具有安装的半导体器件的下布线基板和在与半导体器件相对应的位置处具有开口的上布线基板，并且在开口周围具有封装部件安装区域。 下布线基板和上布线基板通过设置在半导体器件周围的多个焊球彼此电连接。 焊球被遮光不足的填充物覆盖。

公开(公告)号：US20100193937A1

公开(公告)日：2010-08-05

申请号：US12697803

申请日：2010-02-01

申请人： Masayuki Nagamatsu ,  Yasuhiro Kohara ,  Ryosuke Usui

发明人： Masayuki Nagamatsu ,  Yasuhiro Kohara ,  Ryosuke Usui

IPC分类号： H01L23/48

CPC分类号： H01L23/49816 ,  H01L21/4846 ,  H01L23/3128 ,  H01L23/498 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/01044 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A wiring layer including external connection regions is provided on a main surface of an insulating resin layer on a side opposite to that of a semiconductor device mounting face. The wiring layer is coated with a protection layer. An opening is provided to the protection layer such that each external connection region is exposed. Each external connection region has a curved surface recessed toward the insulating resin layer side. The entire area of each opening is filled with a solder ball for mounting a substrate, and the recess of each external connection region is filled with the solder ball, thereby connecting each solder ball to the intermediate layer.

摘要翻译： 在绝缘树脂层的与半导体器件安装面相反一侧的主表面上设置包括外部连接区域的布线层。 布线层涂有保护层。 向保护层提供开口，使得每个外部连接区域被暴露。 每个外部连接区域具有朝向绝缘树脂层侧凹入的弯曲表面。 每个开口的整个区域填充有用于安装基板的焊球，并且每个外部连接区域的凹部填充有焊球，从而将每个焊球连接到中间层。

公开(公告)号：US20120098137A1

公开(公告)日：2012-04-26

申请号：US13381299

申请日：2010-06-30

申请人： Ryosuke Usui ,  Yusuke Igarashi ,  Yasunori Inoue ,  Mayumi Nakasato ,  Masayuki Nagamatsu ,  Yasuhiro Kohara

发明人： Ryosuke Usui ,  Yusuke Igarashi ,  Yasunori Inoue ,  Mayumi Nakasato ,  Masayuki Nagamatsu ,  Yasuhiro Kohara

IPC分类号： H01L29/43 ,  H01L23/48 ,  H05K7/20

CPC分类号： H05K3/445 ,  H01L23/3735 ,  H01L24/48 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H05K1/05 ,  H05K1/053 ,  H05K1/056 ,  H05K1/185 ,  H05K2201/0195 ,  H05K2201/068 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had problems in having low rigidity and a tendency to bend. The ductility of the metal can be obstructed, and the metal protected; by covering substantially the whole area of the front and back sides of the metal core, consisting of metal as the main material, with a first ceramic film and a second ceramic film that obstruct the ductility of the aforementioned metal-core; and covering each of the ceramic films with insulated resin films, to cover the fragility of these ceramics.

摘要翻译： 传统的印刷电路板具有热辐射特性差的问题，并且用于改善热辐射特性的金属芯印刷电路板具有刚性低和弯曲倾向的问题。 金属的延展性可能受到阻碍，金属受到保护; 通过覆盖由金属作为主要材料构成的金属芯的正面和背面的大部分整个面积与第一陶瓷膜和阻碍上述金属芯的延展性的第二陶瓷膜; 并用绝缘树脂膜覆盖每个陶瓷膜，以覆盖这些陶瓷的脆性。

公开(公告)号：US08153186B2

公开(公告)日：2012-04-10

申请号：US12541407

申请日：2009-08-14

申请人： Masayuki Nagamatsu ,  Ryosuke Usui

发明人： Masayuki Nagamatsu ,  Ryosuke Usui

IPC分类号： H05K3/00

CPC分类号： H05K1/111 ,  H01L23/295 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/181 ,  H05K3/243 ,  H05K3/3452 ,  H05K3/383 ,  H05K2201/09745 ,  H05K2203/0369 ,  H05K2203/0542 ,  Y02P70/611 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/0401

摘要： An advantage of the present invention is to suppress moisture infiltrating from a pad electrode portion from spreading over the surface of a wiring pattern and improve the reliability of a packaging board. The wiring pattern of the packaging board is formed on an insulating substrate and includes a wiring region, an electrode region (pad electrode) connected with a semiconductor device, and a boundary region provided between the wiring region and the electrode region. A gold plating layer is provided on the surface of the electrode region of the wiring pattern. The top surface of the boundary region of the wiring pattern is so formed as to be dented from the top surface of the wiring region of the wiring pattern, and there is provided a stepped portion in the boundary region. A solder resist is formed in such a manner as to cover part of the gold plating layer and the wiring pattern corresponding to the boundary region and the wiring region, and the solder resist has a predetermined opening through which to connect to the semiconductor device. A conductive member is connected to the gold plating layer in the electrode region, and a molded resin layer seals the entire semiconductor module.

摘要翻译： 本发明的优点是抑制从焊盘电极部分渗透的湿气在布线图案的表面上扩散，并提高包装板的可靠性。 包装板的布线图案形成在绝缘基板上，并且包括布线区域，与半导体器件连接的电极区域（焊盘电极）以及设置在布线区域和电极区域之间的边界区域。 在布线图案的电极区域的表面上设置镀金层。 布线图案的边界区域的顶表面被形成为从布线图案的布线区域的顶表面凹陷，并且在边界区域中设置有台阶部分。 形成阻焊层，以覆盖与边界区域和布线区域相对应的金镀层和布线图案的一部分，阻焊剂具有与半导体器件连接的预定开口。 导电构件连接到电极区域中的镀金层，并且模制树脂层密封整个半导体模块。

公开(公告)号：US20100288550A1

公开(公告)日：2010-11-18

申请号：US12679615

申请日：2008-07-28

申请人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

发明人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

IPC分类号： H05K1/11

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/16 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K1/113 ,  H05K3/002 ,  H05K3/4007 ,  H05K2201/0191 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09563 ,  H01L2924/00 ,  H01L2224/05599

摘要： There has been such a problem that conventional element mounting substrates and circuit devices using such substrates are not easily thinned, as there is a wiring layer formed on each of the substrates and that a part of the wiring layer is protruded and used as a bump electrode. In an element mounting substrate of this invention and a circuit device using such substrate, a through hole is arranged on an insulating base material, and a wiring layer is protruded from the surface of the insulating base material through the through hole. The protruding section of the wiring layer is used as a bump electrode, and a semiconductor element is mounted on the insulating base material. With such structure, the element mounting substrate is thinned, and the circuit device using such substrate is also thinned.

摘要翻译： 存在使用这种基板的常规元件安装基板和电路装置不容易变薄的问题，因为在每个基板上形成布线层，并且布线层的一部分突出并用作凸块电极 。 在本发明的元件安装基板和使用这种基板的电路装置中，在绝缘基材上设置通孔，并且通过贯通孔从绝缘基材的表面突出布线层。 布线层的突出部分用作凸起电极，半导体元件安装在绝缘基材上。 通过这种结构，元件安装基板变薄，并且使用这种基板的电路装置也变薄。

公开(公告)号：US20080136033A1

公开(公告)日：2008-06-12

申请号：US11937208

申请日：2007-11-08

申请人： Masayuki Nagamatsu ,  Ryosuke Usui

发明人： Masayuki Nagamatsu ,  Ryosuke Usui

IPC分类号： H01L23/485 ,  H05K3/06 ,  H05K1/09

CPC分类号： H05K1/111 ,  H01L23/295 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/181 ,  H05K3/243 ,  H05K3/3452 ,  H05K3/383 ,  H05K2201/09745 ,  H05K2203/0369 ,  H05K2203/0542 ,  Y02P70/611 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/0401

摘要： An advantage of the present invention is to suppress moisture infiltrating from a pad electrode portion from spreading over the surface of a wiring pattern and improve the reliability of a packaging board. The wiring pattern of the packaging board is formed on an insulating substrate and includes a wiring region, an electrode region (pad electrode) connected with a semiconductor device, and a boundary region provided between the wiring region and the electrode region. A gold plating layer is provided on the surface of the electrode region of the wiring pattern. The top surface of the boundary region of the wiring pattern is so formed as to be dented from the top surface of the wiring region of the wiring pattern, and there is provided a stepped portion in the boundary region. A solder resist is formed in such a manner as to cover part of the gold plating layer and the wiring pattern corresponding to the boundary region and the wiring region, and the solder resist has a predetermined opening through which to connect to the semiconductor device. A conductive member is connected to the gold plating layer in the electrode region, and a molded resin layer seals the entire semiconductor module.

摘要翻译： 本发明的优点是抑制从焊盘电极部分渗透的湿气在布线图案的表面上扩散，并提高包装板的可靠性。 包装板的布线图案形成在绝缘基板上，并且包括布线区域，与半导体器件连接的电极区域（焊盘电极）以及设置在布线区域和电极区域之间的边界区域。 在布线图案的电极区域的表面上设置镀金层。 布线图案的边界区域的顶表面被形成为从布线图案的布线区域的顶表面凹陷，并且在边界区域中设置有台阶部分。 形成阻焊层，以覆盖与边界区域和布线区域相对应的金镀层和布线图案的一部分，阻焊剂具有与半导体器件连接的预定开口。 导电构件连接到电极区域中的镀金层，并且模制树脂层密封整个半导体模块。

公开(公告)号：US08440915B2

公开(公告)日：2013-05-14

申请号：US12915852

申请日：2010-10-29

申请人： Masayuki Nagamatsu ,  Kiyoshi Shibata ,  Takanori Hayashi

发明人： Masayuki Nagamatsu ,  Kiyoshi Shibata ,  Takanori Hayashi

IPC分类号： H05K1/11

CPC分类号： H05K3/3452 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/0367 ,  H05K2201/10515 ,  H05K2201/10734 ,  H05K2203/0588 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is of a PoP structure such that first electrode portions provided on a first device mounting board constituting a first semiconductor module and second electrode portions provided in a second semiconductor module are joined together by solder balls. A first insulating layer having an opening is provided on one main surface of an insulating resin layer which is a substrate, and an electrode portion, whose top portion protrudes above the top surface of the first insulating layer, is formed in the opening. A second insulating layer is provided on top of the first insulating layer in the periphery of the top portion of the first electrode portion; the second insulting layer is located slightly apart from the top portion of the first electrode portion. The first electrode portion is shaped such that the top portion is formed by a curved surface or formed by a curved surface and a plane surface smoothly connected to the curved surface.

摘要翻译： 半导体器件具有PoP结构，使得设置在构成第一半导体模块的第一器件安装板上的第一电极部分和设置在第二半导体器件中的第二电极部分通过焊球接合在一起。 具有开口的第一绝缘层设置在作为基板的绝缘树脂层的一个主表面上，并且其顶部突出于第一绝缘层的顶表面上方的电极部分形成在开口中。 在第一电极部分的顶部周边的第一绝缘层的顶部上设置第二绝缘层; 第二绝缘层位于与第一电极部分的顶部稍微分开的位置。 第一电极部分被成形为使得顶部由弯曲表面形成或由曲面形成并且平坦表面平滑地连接到弯曲表面。

公开(公告)号：US08269298B2

公开(公告)日：2012-09-18

申请号：US12727913

申请日：2010-03-19

申请人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

发明人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

IPC分类号： H01L21/00

CPC分类号： H01L27/14618 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14643 ,  H01L2224/05554 ,  H01L2224/48 ,  H01L2224/49175 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H04N5/2257 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor module includes a lower wiring substrate having a semiconductor device mounted and an upper wiring substrate having an opening in a position corresponding to the semiconductor device and having a packaging-component mountable region around the opening. The lower wiring substrate and the upper wiring substrate are electrically connected to each other via a plurality of solder balls provided around the semiconductor device. The solder balls are covered with light blocking under-fills.

摘要翻译： 半导体模块包括具有安装的半导体器件的下布线基板和在与半导体器件相对应的位置处具有开口的上布线基板，并且在开口周围具有封装部件安装区域。 下布线基板和上布线基板通过设置在半导体器件周围的多个焊球彼此电连接。 焊球被遮光不足的填充物覆盖。

公开(公告)号：US08068343B2

公开(公告)日：2011-11-29

申请号：US11829560

申请日：2007-07-27

申请人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

发明人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

IPC分类号： H05K7/00

CPC分类号： H01L23/36 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/3677 ,  H01L23/525 ,  H01L24/11 ,  H01L24/12 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00

摘要： A semiconductor module is provided, which is capable of suppressing the deterioration of reliability and improving heat radiation. The semiconductor module includes: a semiconductor substrate in which electrodes of a circuit element are formed on its surface; a re-wiring pattern connected to the electrodes to ensure large pitch of the electrodes; an electrode integrally formed with the re-wiring pattern; an insulating layer formed on a rear surface of the semiconductor substrate; a radiator formed on the insulating layer; and projections integrally formed with the radiator and penetrating the insulating layer to connect to the rear surface of the semiconductor substrate.

摘要翻译： 提供一种半导体模块，其能够抑制可靠性的劣化并改善散热。 半导体模块包括：其表面上形成有电路元件的电极的半导体衬底; 连接到电极的再布线图案以确保电极的大间距; 与所述再布线图形一体形成的电极; 形成在所述半导体衬底的后表面上的绝缘层; 形成在绝缘层上的散热器; 以及与散热器一体形成并穿透绝缘层的突起，以连接到半导体衬底的后表面。