公开(公告)号：US08642445B2

公开(公告)日：2014-02-04

申请号：US13476340

申请日：2012-05-21

Applicant: Meng-Tse Chen ,  Hui-Min Huang ,  Chun-Cheng Lin ,  Chih-Chun Chiu ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Hui-Min Huang ,  Chun-Cheng Lin ,  Chih-Chun Chiu ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L21/301

CPC classification number: B29C53/18 ,  H01L21/561 ,  H01L21/565 ,  H01L21/566 ,  H01L23/295 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2924/00

Abstract: Embodiments of mechanisms for flattening a packaged structure are provided. The mechanisms involve a flattening apparatus and the utilization of protection layer(s) between the packaged structure and the surface(s) of the flattening apparatus. The protection layer(s) is made of a soft and non-sticking material to allow protecting exposed fragile elements of the packaged structure and easy separation after processing. The embodiments of flattening process involve flattening the warped packaged structure by pressure under elevated processing temperature. Processing under elevated temperature allows the package structure to be flattened within a reasonable processing time.

Abstract translation: 提供了用于使封装结构平坦化的机构的实施例。 这些机构涉及压平装置以及在封装结构和平坦化装置的表面之间利用保护层。 保护层由柔软和不粘的材料制成，以保护封装结构的暴露的易碎元件并且在加工之后易于分离。 扁平化过程的实施例涉及在升高的加工温度下通过压力使翘曲的包装结构变平。 在高温下进行处理可使包装结构在合理的处理时间内变平。

公开(公告)号：US20120223425A1

公开(公告)日：2012-09-06

申请号：US13105338

申请日：2011-05-11

Applicant: Hui-Min Huang ,  Chun-Tang Lin ,  Chien-Wei Lee ,  Yen-Ping Wang

Inventor： Hui-Min Huang ,  Chun-Tang Lin ,  Chien-Wei Lee ,  Yen-Ping Wang

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H01L23/522 ,  H01L23/481 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2224/05552

Abstract: A semiconductor structure includes a chip, a plurality of metal posts disposed in the chip and a buffer layer disposed on the chip. The chip includes a silicon-based layer having opposite first and second surfaces, and a build-up structure formed on the first surface of the silicon-based layer consisting of at least a metal layer and a low-k dielectric layer alternatively stacked on one another. Each of the metal posts is disposed in the silicon-based layer with one end thereof electrically connected with the metal layer while the other end is exposed from the second surface of the silicon-based layer. The buffer layer is disposed on the build-up structure. By positioning the low-k dielectric layer far from the second surface that is used for connecting to an external electronic component, the present invention reduces the overall thermal stress.

Abstract translation: 半导体结构包括芯片，设置在芯片中的多个金属柱和设置在芯片上的缓冲层。 该芯片包括具有相对的第一和第二表面的硅基层，以及形成在硅基层的第一表面上的堆积结构，该硅基层至少由至少一层金属层和低k电介质层组成， 另一个。 每个金属柱设置在硅基层中，其一端与金属层电连接，而另一端从硅基层的第二表面露出。 缓冲层设置在积聚结构上。 通过将低k电介质层定位成远离用于连接到外部电子部件的第二表面，本发明降低了总的热应力。

公开(公告)号：US20120161301A1

公开(公告)日：2012-06-28

申请号：US13112226

申请日：2011-05-20

Applicant: Jung-Pang Huang ,  Hui-Min Huang ,  Kuan-Wei Chuang ,  Chun-Tang Lin ,  Yih-Jenn Jiang

Inventor： Jung-Pang Huang ,  Hui-Min Huang ,  Kuan-Wei Chuang ,  Chun-Tang Lin ,  Yih-Jenn Jiang

IPC: H01L23/495 ,  H01L21/60 ,  H01L23/48

CPC classification number: H01L21/56 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/014 ,  H01L2924/3511

Abstract: A semiconductor package includes: a chip having an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface; an encapsulant encapsulating the chip and having opposite first and second surfaces, the first surface being flush with the active surface of the chip; and first and second metal layers formed on the second surface of the encapsulant, thereby providing a rigid support to the overall structure to prevent warpage and facilitating heat dissipation of the overall structure.

Abstract translation: 半导体封装包括：具有多个电极焊盘的有源表面和与该有源表面相对的无效表面的芯片; 密封剂，其封装所述芯片并且具有相对的第一和第二表面，所述第一表面与所述芯片的有源表面齐平; 以及形成在密封剂的第二表面上的第一和第二金属层，由此为整个结构提供刚性支撑以防止翘曲并促进整体结构的散热。

公开(公告)号：US08033592B2

公开(公告)日：2011-10-11

申请号：US12199136

申请日：2008-08-27

Applicant: Chih-Cheng Hsu ,  Albert H. Butlin ,  John E. Carsley ,  Hui-Min Huang ,  Stephen R. Koshorek ,  John N. Owens

Inventor： Chih-Cheng Hsu ,  Albert H. Butlin ,  John E. Carsley ,  Hui-Min Huang ,  Stephen R. Koshorek ,  John N. Owens

IPC: B60J5/04

CPC classification number: B60R21/0428 ,  B60J5/0437 ,  B60J5/044 ,  B60J5/0455 ,  B60R2021/0006

Abstract: A door assembly for a vehicle includes an outer panel. A support panel is operatively connected to the outer panel and configured such that the support panel provides bending resistance to the outer panel when the outer panel is deflected toward the support panel during a first deflection distance of the outer panel. A cable is operatively connected in the door assembly between a first end and a second end of the outer panel such that the cable provides additional bending resistance to the outer panel when the outer panel is deflected toward the support panel during a second deflection distance of the outer panel, greater than the first deflection distance.

Abstract translation: 用于车辆的门组件包括外板。 支撑面板可操作地连接到外部面板并且构造成使得当外部面板在外部面板的第一偏转距离期间偏转到支撑面板时，支撑面板向外部面板提供抗弯曲性。 电缆在门组件中可操作地连接在外板的第一端和第二端之间，使得当外板在外板的第二偏转距离期间朝向支撑板偏转时，电缆向外板提供额外的弯曲阻力 外面板，大于第一偏转距离。