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公开(公告)号:US11930620B2
公开(公告)日:2024-03-12
申请号:US16914294
申请日:2020-06-27
Applicant: Intel Corporation
Inventor: Jeff Ku , Cora Nien , Gavin Sung , Tim Liu , Lance Lin , Wan Yu Liu , Gerry Juan , Jason Y. Jiang , Justin M. Huttula , Evan Piotr Kuklinski , Juha Tapani Paavola , Arnab Sen , Hari Shanker Thakur , Prakash Kurma Raju
IPC: G06F1/20 , H01L23/427 , H05K7/20
CPC classification number: H05K7/20309 , G06F1/203 , H01L23/427 , H05K7/20136 , H05K7/20336
Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.
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公开(公告)号:US20210234403A1
公开(公告)日:2021-07-29
申请号:US17230724
申请日:2021-04-14
Applicant: Intel Corporation
Inventor: Jeff Ku , Gavin Sung , Ivan Wang , Tim Liu , Jason Y. Jiang
Abstract: In one example an electronic device comprises at least one electronic component, a least one power storage device, and a chassis comprising a body formed from a rigid material and comprising a first pad coupled to the body by a first hinge, wherein the first pad is rotatable about the first hinge between a first position in which the first pad is closed and a second position in which the first pad is open, wherein the first pad comprises a first wireless power transmitting device. Other examples may be described.
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公开(公告)号:US10906652B2
公开(公告)日:2021-02-02
申请号:US15663433
申请日:2017-07-28
Applicant: Intel Corporation
Inventor: Jeff Ku , Gavin Sung , Michael Chih-Huei Wang , Vincent Hung , Jason Y. Jiang
Abstract: Thermal management system for unmanned aerial vehicles are disclosed. An example housing for an unmanned aerial vehicle includes a central portion defining a cavity. The housing also includes a first arm to support a first propeller. The first arm has a first proximal end coupled to the central portion and a first distal end spaced from the central portion. The first distal end defines an inlet. The first arm defines a first fluid path in communication with the inlet and the central cavity. The housing also includes a second arm to support a second propeller. The second arm has a second proximal end coupled to the central portion and a second distal end spaced from the central portion. The second distal end defines an outlet. The second arm defines a second fluid path in communication with the outlet and the central cavity. The inlet and outlet are in fluid communication via the first path, the central cavity and the second path.
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14.
公开(公告)号:US20190146552A1
公开(公告)日:2019-05-16
申请号:US16083796
申请日:2016-04-01
Applicant: Intel Corporation
Inventor: Jeff Ku , Gavin Sung , Christopher J. Hamlin , Ivan BY Wang , Simon Tsai
Abstract: Methods and apparatus relating to a dual side dockable keyboard base with bidirectional wireless charging function for 2 in 1 devices are described. In an embodiment, a 2 in 1 device base provides data input functionality to a tablet portion of the 2 in 1 device and/or wireless charging functionality. Other embodiments are also disclosed and claimed.
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公开(公告)号:US20190141854A1
公开(公告)日:2019-05-09
申请号:US16231169
申请日:2018-12-21
Applicant: Intel Corporation
Inventor: Jeff Ku , Gavin Sung , Tim Liu , Gerry Juan , Jason Y. Jiang
Abstract: In one aspect, an apparatus comprises a housing, a heat-generating component, a heat spreader, and a heat-transfer pipe. The housing forms a cavity in which the heat-generating component is located. The heat spreader is operable to distribute heat over a portion of the housing. The heat-transfer pipe is pivotally coupled to the heat-generating component and the heat spreader. The heat-transfer pipe operable to transfer heat from the heat-generating component to the heat spreader. The heat-transfer pipe and the heat spreader are movable between a first configuration and a second configuration. In the first configuration, a gap separates the heat spreader and the portion of the housing based on the heat-transfer pipe being at a first orientation. In the second configuration, the heat spreader closes the gap and is thermally coupled to the portion of the housing based on the heat-transfer pipe being at a second orientation.
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公开(公告)号:US20180005397A1
公开(公告)日:2018-01-04
申请号:US15199987
申请日:2016-07-01
Applicant: Intel Corporation
Inventor: Simon Tsai , Jeff Ku , Gavin Sung , Paul M. Zagacki , Tim Liu , Ivan By Wang , Christopher J. Hamlin
Abstract: Methods and apparatus relating to a mechanical system on computer with rotational projector and RealSense™ camera are described. In an embodiment, a device includes three portions: a first portion to comprise a projector; a second portion to comprise a camera; and a third portion to comprise one or more computing system components. At least the first and second portions are rotationally engaged to allow for independent rotation of the first portion and the second portion. Other embodiments are also disclosed and claimed.
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公开(公告)号:US20170179645A1
公开(公告)日:2017-06-22
申请号:US14976170
申请日:2015-12-21
Applicant: Intel Corporation
Inventor: Gavin Sung , Jeff Ku , Lance Lin , Tim Liu , Jason Y. Jiang
CPC classification number: H01R13/64 , G06F1/1613 , H01R13/24 , H01R13/2442 , H01R13/631 , H01R2201/06
Abstract: In one example an electronic device comprises at least one electronic component, a chassis comprising a first section, a connector to connect the first section of the chassis to a second section, the connector comprising a housing defining a first shaft, a retention structure disposed in the shaft, and a plurality of electrical contacts positioned within a corresponding plurality of channels in the retention structure. Other examples may be described.
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公开(公告)号:US12284793B2
公开(公告)日:2025-04-22
申请号:US17754429
申请日:2020-12-23
Applicant: Intel Corporation
Inventor: Ritu Bawa , Ruander Cardenas , Kathiravan D , Jia Yan Go , Chin Kung Goh , Jeff Ku , Prakash Kurma Raju , Baomin Liu , Twan Sing Loo , Mikko Makinen , Columbia Mishra , Juha Paavola , Prasanna Pichumani , Daniel Ragland , Kannan Raja , Khal Ern See , Javed Shaikh , Gokul Subramaniam , George Baoci Sun , Xiyong Tian , Hua Yang , Mark Carbone , Vivek Paranjape , Nehakausar Pinjari , Hari Shanker Thakur , Christopher Moore , Gustavo Fricke , Justin Huttula , Gavin Sung , Sammi Wy Liu , Arnab Sen , Chun-Ting Liu , Jason Y. Jiang , Gerry Juan , Shih Wei Nien , Lance Lin , Evan Kuklinski
Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
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公开(公告)号:US11649993B2
公开(公告)日:2023-05-16
申请号:US16457229
申请日:2019-06-28
Applicant: INTEL CORPORATION
Inventor: Gavin Sung , Gerry Juan , Harish Jagadish , Ivan By Wang , Jason Y. Jiang , Sammi Wy Liu , Tim Liu , Jeff Ku
Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.
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公开(公告)号:US11455016B2
公开(公告)日:2022-09-27
申请号:US17173485
申请日:2021-02-11
Applicant: Intel Corporation
Inventor: Jeff Ku , Tim Liu , Yihua Lai , Lance Lin , Gavin Sung
IPC: G06F1/16 , G06F3/02 , G06F3/0354
Abstract: Apparatus, systems, articles of manufacture, and methods are disclosed for physical keyboards with multi-display computing devices. An example keyboard includes a plurality of keys and a translucent backplate having a first side and a second side. The example keyboard also includes a coating between the first side of the backplate and the plurality of keys, the coating to pass light to illuminate the plurality of keys, and the coating to obscure the plurality keys when viewed from the second side of the backplate.
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