公开(公告)号：US20170053998A1

公开(公告)日：2017-02-23

申请号：US15118838

申请日：2014-03-24

Applicant: Intel Corporation

Inventor： Seiyon KIM ,  Daniel A. SIMON ,  Kelin J. KUHN ,  Curtis W. WARD

IPC: H01L29/66 ,  H01L29/423 ,  H01L29/786 ,  H01L29/06

CPC classification number: H01L29/66553 ,  B82Y10/00 ,  H01L21/764 ,  H01L29/0653 ,  H01L29/0673 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/66545 ,  H01L29/66742 ,  H01L29/775 ,  H01L29/78618 ,  H01L29/78696

Abstract: A nanowire device having a plurality of internal spacers and a method for forming said internal spacers are disclosed. In an embodiment, a semiconductor device comprises a nanowire stack disposed above a substrate, the nanowire stack having a plurality of vertically-stacked nanowires, a gate structure wrapped around each of the plurality of nanowires, defining a channel region of the device, the gate structure having gate sidewalls, a pair of source/drain regions on opposite sides of the channel region; and an internal spacer on a portion of the gate sidewall between two adjacent nanowires, internal to the nanowire stack. In an embodiment, the internal spacers are formed by depositing photo-definable spacer material in dimples etched adjacent to the channel region. Photo-definable material remains in the dimples by altering the etch characteristics of material outside of the dimples and selectively removing altered photo-definable material outside of the dimples.

Abstract translation: 公开了一种具有多个内部间隔物的纳米线器件和用于形成所述内部间隔物的方法。 在一个实施例中，半导体器件包括设置在衬底上方的纳米线堆叠，纳米线堆叠具有多个垂直堆叠的纳米线，围绕多个纳米线中的每一个缠绕的栅极结构，限定器件的沟道区，栅极 结构，其具有栅极侧壁，在沟道区域的相对侧上的一对源极/漏极区域; 以及位于纳米线堆叠内部的两个相邻纳米线之间的栅极侧壁的一部分上的内部间隔物。 在一个实施例中，通过在与沟道区相邻蚀刻的凹坑中沉积光可定义的间隔物材料来形成内部间隔物。 通过改变凹坑之外的材料的蚀刻特性并且选择性地去除在凹坑之外的改变的光可定义材料，可光限定的材料保留在凹坑中。

公开(公告)号：US20160211322A1

公开(公告)日：2016-07-21

申请号：US14916093

申请日：2013-10-03

Applicant: INTEL CORPORATION

Inventor： Seiyon KIM ,  Daniel A. SIMON ,  Nadia M. RAHHAL-ORABI ,  Chul-Hyun LIM ,  Kelin J. KUHN

IPC: H01L29/06 ,  H01L29/161 ,  H01L29/423 ,  H01L29/66

CPC classification number: H01L29/78696 ,  B82Y10/00 ,  H01L21/02603 ,  H01L21/823807 ,  H01L27/0886 ,  H01L27/092 ,  H01L29/0649 ,  H01L29/0669 ,  H01L29/0673 ,  H01L29/161 ,  H01L29/165 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/6653 ,  H01L29/66545 ,  H01L29/66553 ,  H01L29/6656 ,  H01L29/66742 ,  H01L29/66795 ,  H01L29/775 ,  H01L29/785 ,  H01L29/78618 ,  H01L29/78651 ,  H01L29/78684

Abstract: A nanowire transistor of the present description may be produced with internal spacers formed by using sacrificial spacers during the fabrication thereof. Once the nanowire transistor is formed, the sacrificial spacers, which are position between the transistor gate and the source and drains (respectively), may be removed. The sacrificial material between channel nanowires of the nanowire transistor may then be removed and a dielectric material may be deposited to fill the spaces between the channel nanowires. The dielectric material not between the channel nanowires may be removed to form the internal spacers. External spacers, which are position between the transistor gate and the source and drains (respectively), may then be formed adjacent the internal spacers and transistor channel nanowires.

Abstract translation: 本描述的纳米线晶体管可以在其制造期间使用牺牲间隔物形成的内部间隔物来制造。 一旦形成了纳米线晶体管，就可以去除位于晶体管栅极和源极之间的排列（分别）的牺牲间隔物。 然后可以去除纳米线晶体管的沟道纳米线之间的牺牲材料，并且可以沉积介电材料以填充沟道纳米线之间的空间。 可以除去不在通道纳米线之间的电介质材料以形成内部间隔物。 位于晶体管栅极和源极之间的位置（分别）的外部间隔物可以随后形成在内部间隔物和晶体管沟道纳米线附近。

公开(公告)号：US20200227520A1

公开(公告)日：2020-07-16

申请号：US16831692

申请日：2020-03-26

Applicant: Intel Corporation

Inventor： Kelin J. KUHN ,  Seiyon KIM ,  Rafael RIOS ,  Stephen M. CEA ,  Martin D. GILES ,  Annalisa CAPPELLANI ,  Titash RAKSHIT ,  Peter CHANG ,  Willy RACHMADY

IPC: H01L29/06 ,  B82Y10/00 ,  H01L21/762 ,  H01L29/16 ,  H01L29/417 ,  H01L29/423 ,  H01L29/66 ,  H01L29/775 ,  H01L29/78 ,  H01L29/786 ,  H01L29/165 ,  H01L27/092 ,  H01L27/12 ,  H01L29/10

Abstract: Methods of forming microelectronic structures are described. Embodiments of those methods include forming a nanowire device comprising a substrate comprising source/drain structures adjacent to spacers, and nanowire channel structures disposed between the spacers, wherein the nanowire channel structures are vertically stacked above each other.

公开(公告)号：US20200152797A1

公开(公告)日：2020-05-14

申请号：US16740089

申请日：2020-01-10

Applicant: Intel Corporation

Inventor： Stephen M. CEA ,  Annalisa CAPPELLANI ,  Martin D. GILES ,  Rafael RIOS ,  Seiyon KIM ,  Kelin J. KUHN

IPC: H01L29/786 ,  H01L29/66 ,  H01L29/08 ,  H01L29/423 ,  H01L29/06 ,  H01L21/268 ,  H01L29/78

Abstract: Nanowire structures having non-discrete source and drain regions are described. For example, a semiconductor device includes a plurality of vertically stacked nanowires disposed above a substrate. Each of the nanowires includes a discrete channel region disposed in the nanowire. A gate electrode stack surrounds the plurality of vertically stacked nanowires. A pair of non-discrete source and drain regions is disposed on either side of, and adjoining, the discrete channel regions of the plurality of vertically stacked nanowires.

公开(公告)号：US20190214461A1

公开(公告)日：2019-07-11

申请号：US16358613

申请日：2019-03-19

Applicant: Intel Corporation

Inventor： Seiyon KIM ,  Kelin J. KUHN ,  Tahir GHANI ,  Anand S. MURTHY ,  Mark ARMSTRONG ,  Rafael RIOS ,  Abhijit Jayant PETHE ,  Willy RACHMADY

IPC: H01L29/06 ,  H01L29/423 ,  H01L29/66 ,  H01L29/08 ,  H01L29/78 ,  H01L21/3105 ,  H01L21/306 ,  H01L29/786 ,  H01L21/3115

CPC classification number: H01L29/0673 ,  B82Y40/00 ,  H01L21/30604 ,  H01L21/3105 ,  H01L21/31155 ,  H01L29/0847 ,  H01L29/42392 ,  H01L29/66545 ,  H01L29/66553 ,  H01L29/78 ,  H01L29/78696

Abstract: A nanowire device having a plurality of internal spacers and a method for forming said internal spacers are disclosed. In an embodiment, a semiconductor device comprises a nanowire stack disposed above a substrate, the nanowire stack having a plurality of vertically-stacked nanowires, a gate structure wrapped around each of the plurality of nanowires, defining a channel region of the device, the gate structure having gate sidewalls, a pair of source/drain regions on opposite sides of the channel region; and an internal spacer on a portion of the gate sidewall between two adjacent nanowires, internal to the nanowire stack. In an embodiment, the internal spacers are formed by depositing spacer material in dimples etched adjacent to the channel region. In an embodiment, the dimples are etched through the channel region. In another embodiment, the dimples are etched through the source/drain region.

公开(公告)号：US20170271501A1

公开(公告)日：2017-09-21

申请号：US15505558

申请日：2014-09-24

Applicant: Intel Corporation

Inventor： Uygar E. AVCI ,  Rafael RIOS ,  Kelin J. KUHN ,  Ian A. YOUNG ,  Justin R. WEBER

IPC: H01L29/78 ,  H01L29/20 ,  H01L29/16 ,  H01L29/24 ,  H01L29/66 ,  H01L29/06

CPC classification number: H01L29/785 ,  B82Y10/00 ,  H01L29/0669 ,  H01L29/0673 ,  H01L29/068 ,  H01L29/16 ,  H01L29/2003 ,  H01L29/24 ,  H01L29/66795 ,  H01L29/7391

Abstract: Described is a TFET comprising: a nanowire having doped regions for forming source and drain regions, and an un-doped region for coupling to a gate region; and a first termination material formed over the nanowire; and a second termination material formed over a section of the nanowire overlapping the gate and source regions. Described is another TFET comprising: a first section of a nanowire having doped regions for forming source and drain regions, and an undoped region for coupling to a gate region; a second section of the nanowire extending orthogonal to the first section, the second section formed next to the gate and source regions; and a termination material formed over the first and second sections of the nanowire.

公开(公告)号：US20170047400A1

公开(公告)日：2017-02-16

申请号：US15333123

申请日：2016-10-24

Applicant: Intel Corporation

Inventor： Seiyon Kim ,  Kelin J. KUHN ,  Tahir GHAN! ,  Anand S. MURTHY ,  Mark ARMSTRONG ,  Rafael RIOS ,  Abhijit Jayant PETHE ,  Willy RACHMADY

IPC: H01L29/06 ,  H01L21/3105 ,  H01L21/306 ,  H01L21/3115 ,  H01L29/66 ,  H01L29/08

CPC classification number: H01L29/0673 ,  B82Y40/00 ,  H01L21/30604 ,  H01L21/3105 ,  H01L21/31155 ,  H01L29/0847 ,  H01L29/42392 ,  H01L29/66545 ,  H01L29/66553 ,  H01L29/78 ,  H01L29/78696

Abstract: A nanowire device having a plurality of internal spacers and a method for forming said internal spacers are disclosed. In an embodiment, a semiconductor device comprises a nanowire stack disposed above a substrate, the nanowire stack having a plurality of vertically-stacked nanowires, a gate structure wrapped around each of the plurality of nanowires, defining a channel region of the device, the gate structure having gate sidewalls, a pair of source/drain regions on opposite sides of the channel region; and an internal spacer on a portion of the gate sidewall between two adjacent nanowires, internal to the nanowire stack. In an embodiment, the internal spacers are formed by depositing spacer material in dimples etched adjacent to the channel region. In an embodiment, the dimples are etched through the channel region. In another embodiment, the dimples are etched through the source/drain region.

Abstract translation: 公开了一种具有多个内部间隔物的纳米线器件和用于形成所述内部间隔物的方法。 在一个实施例中，半导体器件包括设置在衬底上方的纳米线堆叠，纳米线堆叠具有多个垂直堆叠的纳米线，围绕多个纳米线中的每一个缠绕的栅极结构，限定器件的沟道区，栅极 结构，其具有栅极侧壁，在沟道区域的相对侧上的一对源极/漏极区域; 以及位于纳米线堆叠内部的两个相邻纳米线之间的栅极侧壁的一部分上的内部间隔物。 在一个实施例中，内部间隔物通过在与沟道区相邻蚀刻的凹坑中沉积间隔物形成。 在一个实施例中，通过沟道区蚀刻凹坑。 在另一个实施例中，通过源/漏区蚀刻凹坑。

公开(公告)号：US20160276484A1

公开(公告)日：2016-09-22

申请号：US15024714

申请日：2013-12-19

Applicant: INTEL CORPORATION

Inventor： Seiyon KIM ,  Rafael RIOS ,  Fahmida FERDOUSI ,  Kelin J. KUHN

IPC: H01L29/78 ,  H01L29/786 ,  H01L29/10 ,  H01L21/306 ,  H01L21/02 ,  H01L29/06 ,  H01L29/16 ,  H01L29/66

Abstract: Non-planar semiconductor devices having hybrid geometry-based active regions are described. For example, a semiconductor device includes a hybrid channel region including a nanowire portion disposed above an omega-FET portion disposed above a fin-FET portion. A gate stack is disposed on exposed surfaces of the hybrid channel region. The gate stack includes a gate dielectric layer and a gate electrode disposed on the gate dielectric layer. Source and drain regions are disposed on either side of the hybrid channel region.

Abstract translation: 描述了具有基于混合几何的有源区域的非平面半导体器件。 例如，半导体器件包括混合沟道区域，其包括设置在鳍状FET部分上方的Ω-FET部分上方的纳米线部分。 栅极叠层设置在混合沟道区域的暴露表面上。 栅极堆叠包括栅极电介质层和设置在栅极介电层上的栅电极。 源极和漏极区域设置在混合沟道区域的两侧。

公开(公告)号：US20150303258A1

公开(公告)日：2015-10-22

申请号：US14789856

申请日：2015-07-01

Applicant: Intel Corporation

Inventor： Kelin J. KUHN ,  Seiyon KIM ,  Rafael RIOS ,  Stephen M. Cea ,  Martin D. GILES ,  Annalisa CAPPELLANI ,  Titash RAKSHIT ,  Peter CHANG ,  Willy RACHMADY

IPC: H01L29/06 ,  H01L29/10 ,  H01L29/423 ,  H01L29/78 ,  H01L27/12 ,  H01L29/165 ,  H01L27/092 ,  H01L29/16

CPC classification number: H01L29/0673 ,  B82Y10/00 ,  H01L21/76224 ,  H01L27/0922 ,  H01L27/1203 ,  H01L29/0676 ,  H01L29/1033 ,  H01L29/16 ,  H01L29/165 ,  H01L29/41733 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/66742 ,  H01L29/66795 ,  H01L29/775 ,  H01L29/7848 ,  H01L29/785 ,  H01L29/78618 ,  H01L29/78654 ,  H01L29/78684 ,  H01L29/78696

Abstract: Methods of forming microelectronic structures are described. Embodiments of those methods include forming a nanowire device comprising a substrate comprising source/drain structures adjacent to spacers, and nanowire channel structures disposed between the spacers, wherein the nanowire channel structures are vertically stacked above each other.

Abstract translation: 描述形成微电子结构的方法。 这些方法的实施例包括形成纳米线装置，其包括基板，该基板包括与间隔物相邻的源极/漏极结构，以及设置在间隔物之间​​的纳米线通道结构，其中纳米线通道结构在彼此之上垂直堆叠。