PACKAGE-INTEGRATED PIEZOELECTRIC OPTICAL GRATING SWITCH ARRAY

    公开(公告)号:US20190033500A1

    公开(公告)日:2019-01-31

    申请号:US16072173

    申请日:2016-04-01

    Abstract: Embodiments of the invention include an optical grating switch integrated into an organic substrate and methods of forming such devices. According to an embodiment, the optical grating switch may include a cavity formed into an organic substrate. Additionally, the optical grating switch may include an array of moveable beams anchored to the organic substrate and suspended over the cavity. In an embodiment of the invention, each of the moveable beams in the optical grating switch may include a piezoelectric region formed over end portions of the moveable beam and a top electrode formed over a top surface of each of the piezoelectric regions. In order to reflect or diffract light, embodiments of the invention may include moveable beams that include a reflective surface formed over a central portion of the moveable beam.

    ACTIVE VENTING GARMENT USING PIEZOELECTRIC ELEMENTS

    公开(公告)号:US20190297975A1

    公开(公告)日:2019-10-03

    申请号:US16303386

    申请日:2016-07-02

    Abstract: Embodiments of the invention include an active venting system. According to an embodiment of the invention, the active venting system may include a substrate having one or more seams formed through the substrate. In order to open the vents defined by the seams through the substrate, a piezoelectric layer may be formed proximate to one or more of the seams. Additional embodiments may include a first electrode and a second electrode that contact the piezoelectric layer in order to provide a voltage differential across the piezoelectric layer. In an embodiment the active venting system may be integrated into a garment. In such an embodiment, the garment may also include an electronics module for controlling the actuators. Additionally, conductive traces may be printed on the garment or sewn into the garment to provide electrical connections from the electronics module to each of the piezoelectric actuators.

    INTEGRATED INDUCTOR FOR INTEGRATED CIRCUIT DEVICES
    18.
    发明申请
    INTEGRATED INDUCTOR FOR INTEGRATED CIRCUIT DEVICES 审中-公开
    集成电路集成电路

    公开(公告)号:US20160276424A1

    公开(公告)日:2016-09-22

    申请号:US15169665

    申请日:2016-05-31

    Abstract: A three-dimensional inductor is formed in an integrated circuit die using conductive through-body-vias which pass through the body of the die and contact one or more metal interconnect layers on the front side of the die and terminate on the back side of the die. In another embodiment, the through-body-vias may pass through a dielectric material disposed in a plug in the body of the die. In yet another aspect, a transformer may be formed by coupling multiple inductors formed using through-body-vias. In still another aspect, a three-dimensional inductor may include conductors formed of stacks of on chip metallization layers and conductive through-layer-vias disposed in insulation layers between metallization layers. Other embodiments are described.

    Abstract translation: 使用导电贯穿体通孔在集成电路管芯中形成三维电感器,该穿通体通孔穿过管芯的主体并与管芯前侧上的一个或多个金属互连层接触并终止在管芯的背面 死。 在另一个实施例中,通孔通孔可以穿过设置在管芯主体中的插塞中的电介质材料。 另一方面,变压器可以通过耦合使用通孔通孔形成的多个电感器来形成。 在另一方面,三维电感器可以包括由片上金属化层的堆叠形成的导体和设置在金属化层之间的绝缘层中的导电贯通层通孔。 描述其他实施例。

    ALIGNMENT OF SINGLE AND MULTI-MODE OPTICAL FIBERS USING PIEZOELECTRIC ACTUATORS

    公开(公告)号:US20190121038A1

    公开(公告)日:2019-04-25

    申请号:US16098406

    申请日:2016-07-01

    Abstract: Embodiments of the invention include an optoelectronic package that allows for in situ alignment of optical fibers. In an embodiment, the optoelectronic package may include an organic substrate. Embodiments include a cavity formed into the organic substrate. Additionally, the optoelectronic package may include an actuator formed on the organic substrate that extends over the cavity. In one embodiment, the actuator may include a first electrode, a piezoelectric layer formed on the first electrode, and a second electrode formed on the piezoelectric layer. According to an additional embodiment of the invention, the actuator may include a first portion and a second portion. In order to allow for resistive heating and actuation driven by thermal expansion, a cross-sectional area of the first portion of the beam may be greater than a cross-sectional area of the second portion of the beam.

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