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11.发明授权公开(公告)号：US09555606B1
公开(公告)日：2017-01-31
申请号：US14963681
申请日：2015-12-09
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Michael J. Fisher , David C. Long , Donald Merte , Robert Weiss , Thomas Weiss
CPC classification number: H05K3/284 , F16B11/006
Abstract: Assembly apparatuses and processes are provided which include a pressure cure fixture. The pressure cure fixture is sized to reside within a container, such as an electronic enclosure, and facilitate applying pressure to an adhesive disposed over an inner surface of the container. The pressure cure fixture is formed of a material with a higher coefficient of thermal expansion (CTE) than the container, and is sized to correspond, at least in part, to an inner space of the container while allowing for the adhesive and a surface-mount element to be disposed between the pressure cure fixture and the inner surface of the container. When heated, the pressure cure fixture expands greater than the container and imparts the pressure to the surface-mount element and the adhesive to facilitate securing the surface-mount element to the inner surface of the container.
Abstract translation: 提供了包括压力固化夹具的组装装置和工艺。 压力固化夹具的尺寸设置成容纳在诸如电子外壳的容器内，并且有助于将压力施加到设置在容器的内表面上的粘合剂。 压力固化夹具由具有比容器更高的热膨胀系数（CTE）的材料形成，并且其尺寸设计成至少部分地对应于容器的内部空间，同时允许粘合剂和表面 - 安装元件设置在压力固化夹具和容器的内表面之间。 当加热时，压力固化夹具比容器膨胀得更大，并将压力赋予表面安装元件和粘合剂，以便于将表面安装元件固定到容器的内表面。
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公开(公告)号：US11147158B2
公开(公告)日：2021-10-12
申请号：US16596941
申请日：2019-10-09
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , John R. Dangler , Michael J. Fisher , David C. Long
IPC: H05K1/02 , H05K1/11 , H05K1/18 , H05K5/02 , G01N27/04 , G06F21/87 , G06F21/86 , H01L23/00 , H05K1/09
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. The at least one interconnect element is undetectable by x-ray, and the conductive lines are detectable by x-ray. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.
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公开(公告)号：US10932374B2
公开(公告)日：2021-02-23
申请号：US16792233
申请日：2020-02-15
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Arthur Higby , James Busby , David C. Long , Robert Weiss , Michael Fisher , Tristen Gaudette
IPC: H05K1/02 , H05K3/32 , H05K3/36 , H01L21/56 , H01L23/13 , H01L23/34 , H01L23/36 , B29C33/00 , B29C33/12 , B29C44/02 , B29C44/08 , B29C44/12 , B29C70/00 , B29C70/02 , B29C70/84 , H05K3/46 , G06F21/87 , H01L23/31
Abstract: A process for deforming a flex circuit using a fixture assembly including a base plate having a recess, a wrinkle reducer plate, a stiffening block and a punch. The process including heating the fixture assembly; applying a force to the punch deforming the flex circuit into the recess in the base plate; holding the punch in contact with the flex circuit while heating the fixture assembly; cooling the fixture assembly with the punch in contact with the flex circuit; subsequent to cooling the fixture assembly, removing the force of the punch; and removing the flex circuit from the fixture assembly. The flex circuit having a recessed portion resulting from deforming the flex circuit into the recess in the base plate and a flat portion surrounding the recessed portion.
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公开(公告)号：US10595401B1
公开(公告)日：2020-03-17
申请号：US16424874
申请日：2019-05-29
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , Arthur J. Higby , David C. Long , Michael J. Fisher , Russell A. Budd , Michel Turgeon , Sylvain Tetreault
Abstract: Tamper-respondent assemblies are provided which include an enclosure assembly mounted to a circuit board and enclosing an electronic component(s) within a secure volume. The enclosure assembly includes an enclosure with an edge surface coupled to the circuit board, and a tamper-respondent sensor. The tamper-respondent sensor covers the edge surface and an inner surface of the enclosure. The sensor includes multiple layers, and at least one tamper-detect circuit. The tamper-detect circuit(s) includes a conductive trace(s) in a tamper-detect pattern covered, at least in part, by at least one layer of the multiple layers. The at least one layer is partially removed to provide exposed regions and unexposed regions of the conductive trace(s) at the edge surface of the enclosure. The conductive trace(s) is contacted where exposed by an adhesive securing the sensor to the circuit board. A monitor circuit monitors the tamper-detect circuit(s) for a tamper event.
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公开(公告)号：US20190384942A1
公开(公告)日：2019-12-19
申请号：US16007408
申请日：2018-06-13
Applicant: International Business Machines Corporation
Inventor： Silvio Dragone , Michael Fisher , William Santiago Fernandez , Ryan Elsasser , James Busby , John R. Dangler , William L. Brodsky , David C. Long , Stefano S. Oggioni
IPC: G06F21/87 , H01L41/04 , H01L41/047 , H01L41/053 , H01L41/113 , H01L41/18 , H01L41/23 , H01L41/37
Abstract: The present invention relates to a method to fabricate a tamper respondent assembly. The tamper respondent assembly includes an electronic component and an enclosure fully enclosing the electronic component. The method includes printing, by a 3-dimensional printer, a printed circuit board that forms a bottom part of the enclosure and includes a first set of embedded detection lines for detecting tampering events and signal lines for transferring signals between the electronic component and an external device. The electronic component is assembled on the printed circuit board, and a cover part of the enclosure is printed on the printed circuit board. The cover part includes a second set of embedded detection lines. Sensing circuitry can be provided for sensing the conductance of the first set of embedded detection lines and the second set of embedded detection lines to detect tampering events.
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Patent Agency Ranking
公开(公告)号：US10331915B2
公开(公告)日：2019-06-25
申请号：US15819540
申请日：2017-11-21
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. Brodsky , John R. Dangler , Phillip Duane Isaacs , David C. Long , Michael T. Peets
Abstract: Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.
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公开(公告)号：US10172232B2
公开(公告)日：2019-01-01
申请号：US15827275
申请日：2017-11-30
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. Brodsky , James A. Busby , Edward N. Cohen , Silvio Dragone , Michael J. Fisher , David C. Long , Michael T. Peets , William Santiago-Fernandez , Thomas Weiss
Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.
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公开(公告)号：US09913389B2
公开(公告)日：2018-03-06
申请号：US14955283
申请日：2015-12-01
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Michael J. Fisher , David C. Long , Michael T. Peets , Robert Weiss , Thomas Weiss , James E. Tersigni
CPC classification number: H05K5/0208 , G06F21/00 , G06F21/86
Abstract: Tamper-respondent assemblies, electronic packages and fabrication methods are provided which incorporate a vent structure. The tamper-respondent assembly includes an electronic enclosure to enclose, at least in part, an electronic component(s) to be protected. The electronic enclosure includes an inner surface, and an air vent. A tamper-respondent electronic circuit structure is provided which includes a tamper-respondent sensor disposed to cover, at least part, the inner surface of the electronic enclosure, and define, at least in part, a secure volume about the electronic component(s). The vent structure includes at least one air passage coupling in fluid communication the secure volume and the air vent of the electronic enclosure to allow air pressure within the secure volume to equalize with air pressure external to the tamper-respondent assembly.
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公开(公告)号：US09911012B2
公开(公告)日：2018-03-06
申请号：US14865572
申请日：2015-09-25
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. Brodsky , John R. Dangler , Phillip Duane Isaacs , David C. Long , Michael T. Peets
CPC classification number: G06F21/87 , G06F21/75 , H01R12/59 , H05K1/0275 , H05K5/0208 , H05K5/03 , H05K2201/055 , H05K2201/056
Abstract: Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.
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公开(公告)号：US11122682B2
公开(公告)日：2021-09-14
申请号：US15944898
申请日：2018-04-04
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , John R. Dangler , Mark K. Hoffmeyer , William L. Brodsky , William Santiago-Fernandez , David C. Long , Silvio Dragone , Michael J. Fisher , Arthur J. Higby
Abstract: Tamper-respondent assemblies and fabrication methods are provided which utilize liquid crystal polymer layers in solid form. The tamper-respondent assemblies include a circuit board, and an enclosure assembly mounted to the circuit board to enclose one or more electronic components coupled to the circuit board within a secure volume. The assembly includes a tamper-respondent sensor that is a three-dimensional multilayer sensor structure, which includes multiple liquid crystal polymer layers, and at least one tamper-detect circuit. The at least one tamper-detect circuit includes one or more circuit lines in a tamper-detect pattern disposed on at least one liquid crystal polymer layer of the multiple liquid crystal polymer layers. Further, a monitor circuit is provided disposed within the secure volume to monitor the at least one tamper-detect circuit of the tamper-respondent sensor for a tamper event.
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