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公开(公告)号：US20210111486A1
公开(公告)日：2021-04-15
申请号：US17129705
申请日：2020-12-21
Applicant: Intel Corporation
Inventor： Maruti Tamrakar , Sagar Gupta , Jayprakash Thakur , Rakhi Singh
Abstract: Various embodiments provide an antenna assembly and associated systems, devices, and methods. The antenna assembly may include two or more antennas, including a first antenna and a second antenna, coupled to a ground plane. The antenna assembly may further include an isolation network coupled to the ground plane between the first and second antennas. The isolation network may include a conductive structure between conductive antenna portions of the first and second antennas, and an isolation circuit coupled between the conductive structure and the ground plane. The isolation circuit may include a resistor, an inductor, and/or a capacitor (e.g., coupled in parallel with one another). Other embodiments may be described and claimed.
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公开(公告)号：US20210111481A1
公开(公告)日：2021-04-15
申请号：US17129698
申请日：2020-12-21
Applicant: Intel Corporation
Inventor： Jayprakash Thakur , Maruti Tamrakar , Sagar Gupta , Prasanna Pichumani , Sudheera Sudhakar
IPC: H01Q1/24 , H04B1/3827 , H04B1/401 , H04W52/36
Abstract: Various embodiments utilize part of an existing antenna pattern in a computing device to implement a specific absorption rate (SAR) sensor element using a radio frequency (RF) filter circuit. The integrated solutions of the present disclosure help to eliminate the external SAR sensor pad requirement and further help to improve wireless performance. The embodiments of the present disclosure may be implemented with a variety of different types of antenna (e.g., slot, metal ring/aperture, PCB, etc.). Other embodiments may be described and claimed.
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公开(公告)号：US20190252770A1
公开(公告)日：2019-08-15
申请号：US15897682
申请日：2018-02-15
Applicant: Intel Corporation
Inventor： Jayprakash Thakur
Abstract: An antenna isolation circuit configured to provide an isolation between two adjacent antennas in a wireless communication device is disclosed. The antenna isolation circuit comprises a partition line circuit comprising a conductive element configured to be placed between the two adjacent antennas; and a matching circuit having a first end and a second end. In some embodiments, the matching circuit is coupled to the partition line circuit at the first end and to a ground circuit at the second end. In some embodiments, the matching circuit is configured to provide an impedance. In some embodiments, a dimension of the conductive element and the impedance of the matching circuit are configured to result in an isolation between the two adjacent antennas.
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公开(公告)号：US20160380356A1
公开(公告)日：2016-12-29
申请号：US15156961
申请日：2016-05-17
Applicant: Intel Corporation
Inventor： Jayprakash Thakur , Praveen Kumar
CPC classification number: H01Q9/0442 , H01Q1/243 , H01Q1/36 , H01Q1/48
Abstract: An antenna having a radiator, a ground plane, and a stub configured to couple the radiator to the ground plane. The radiator may have nested radiators. The antenna covers frequency bands in a range of approximately 680 MHz to approximately 20 GHz. Lower and higher operational frequencies of the antenna may be varied by adjusting the physical parameters of the antenna, such as length and width of the radiator, gaps between the nested radiators, number of nested radiators, ground plane size, and stub size.
Abstract translation: 具有散热器，接地平面和短截线的天线，其被配置为将散热器耦合到接地平面。 散热器可能有嵌套散热器。 该天线覆盖在大约680MHz至大约20GHz的范围内的频带。 天线的较低和较高的工作频率可以通过调节天线的物理参数来改变，例如散热器的长度和宽度，嵌套散热器之间的间隙，嵌套散热器的数量，接地平面尺寸和短截线尺寸。
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公开(公告)号：US12087995B2
公开(公告)日：2024-09-10
申请号：US17455928
申请日：2021-11-22
Applicant: Intel Corporation
Inventor： Jayprakash Thakur , Prasanna Pichumani , Maruti Tamrakar , Doddi Raghavendra , Sagar Gupta
CPC classification number: H01Q1/02 , H01Q1/12 , H01Q9/04 , H01Q9/0407
Abstract: Examples relate to concepts for antenna arrangement and particular to an antenna for an electronic device. An electronic device comprises, a case, a lid and a heat spreading structure. Further, an electronic device comprises a hinge arrangement between the case and the lid. The hinge arrangement comprises at least one hinge structure connecting the lid to the case. Further, the electronic device comprises an antenna. The antenna is arranged in an area of the hinge arrangement. The heat spreading structure extends from the case through the area of the hinge arrangement to the lid.
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Patent Agency Ranking
16.发明授权公开(公告)号：US12046819B2
公开(公告)日：2024-07-23
申请号：US17448724
申请日：2021-09-24
Applicant: Intel Corporation
Inventor： Maruti Tamrakar , Sagar Gupta , Jayprakash Thakur , Prasanna Pichumani
CPC classification number: H01Q21/064 , H01Q1/38 , H01Q13/106
Abstract: A slot antenna assembly for a portable electronic device is disclosed. The assembly includes a first slot antenna having a first slot through a substrate from an outer surface of the substrate to an inner surface of the substrate. The assembly also includes a second slot antenna including a second slot through the substrate from the outer surface of the substrate to the inner surface of the substrate. An isolator includes at least one of an isolation slot and a conductor. The isolation slot includes a substrate isolation slot which extends through the substrate between the first and second slot antennas; and a conductor. The conductor connects the inner surface of the substrate between the first and second antennas to an opposite inner surface of an opposite substrate opposite the inner surface between the first and second antennas.
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公开(公告)号：US11876304B2
公开(公告)日：2024-01-16
申请号：US17448722
申请日：2021-09-24
Applicant: Intel Corporation
Inventor： Maruti Tamrakar , Jayprakash Thakur
CPC classification number: H01Q5/40 , H01Q5/378 , H01Q5/392 , H01Q9/0414 , H01Q9/0435 , H01Q9/0457 , H01Q21/065
Abstract: Examples relate to concepts for patch antennas and particular to a method for forming a multiband patch antenna. A multiband patch antenna may comprise a ground layer and an excitation layer, comprising a first excitation patch, a second excitation patch and a feeding patch, wherein the patch is arranged to excite the first excitation patch and the second excitation simultaneously.
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公开(公告)号：US20230216453A1
公开(公告)日：2023-07-06
申请号：US18121315
申请日：2023-03-14
Applicant: Intel Corporation
Inventor： Yagnesh V. Waghela , Sumod Cherukkate , Sagar Gupta , Sudhakar Arehole Narayana Manja , Soumya Prakash Mishra , Bala Subramanya , Jayprakash Thakur
CPC classification number: H03F3/189 , H04R9/06 , H03F2200/451 , H03F2200/03
Abstract: The speaker coil in a dynamic speaker in a mobile computing device can be used to generate radio frequency (RF) signals having a frequency of about 100 kHz or greater. A speaker amplifier drives the dynamic speaker to produce sound and RF circuitry drives the speaker amplifier to generate the RF signals having a frequency of about 100 kHz or greater. The speaker coil can comprise a tap at an appropriate point between the ends of the coil to cause the coil to operate at resonance over a desired RF frequency band. A low-pass filter can be positioned at the speaker amplifier output to protect the speaker amplifier from RF energy generated by the RF circuitry and a high-pass filter can be positioned at the output of the RF circuitry to protect the RF circuitry from audio energy generated by the speaker amplifier.
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公开(公告)号：US20220384956A1
公开(公告)日：2022-12-01
申请号：US17734529
申请日：2022-05-02
Applicant: Intel Corporation
Inventor： Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asi , Kaushik Dasgupta , Kunal Datta , Brandon Davis , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Yossi Tsfati , Marian Verhelst , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC: H01Q9/04 , H01Q5/47 , H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q21/24 , H03L7/14 , H04B1/3827 , H04B7/0456 , H04B7/06 , H04B15/04
Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
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公开(公告)号：US11424539B2
公开(公告)日：2022-08-23
申请号：US16472830
申请日：2017-12-20
Applicant: Intel Corporation
Inventor： Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asl , Kaushik Dasgupta , Kunal Datta , Brandon Davis , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Yossi Tsfati , Marian Verhelst , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC: H01Q5/47 , H01Q9/04 , H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q21/24 , H03L7/14 , H04B1/3827 , H04B7/0456 , H04B7/06 , H04B15/04
Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
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