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公开(公告)号:US10334334B2
公开(公告)日:2019-06-25
申请号:US15394338
申请日:2016-12-29
Applicant: INTEL CORPORATION
Inventor: Steven C. Miller , Michael Crocker , Aaron Gorius , Paul Dormitzer
IPC: G06F12/10 , H04Q11/00 , H03M7/40 , H03M7/30 , G06F16/901 , G06F3/06 , G11C7/10 , H05K7/14 , G06F1/18 , G06F13/40 , H05K5/02 , G08C17/02 , H04L12/24 , H04L29/08 , H04L12/26 , H04L12/851 , G06F9/50 , H04L12/911 , G06F12/109 , H04L29/06 , G11C14/00 , G11C5/02 , G11C11/56 , G02B6/44 , G06F8/65 , G06F12/14 , G06F13/16 , H04B10/25 , G06F9/4401 , G02B6/38 , G02B6/42 , B25J15/00 , B65G1/04 , H05K7/20 , H04L12/931 , H04L12/939 , H04W4/02 , H04L12/751 , G06F13/42 , H05K1/18 , G05D23/19 , G05D23/20 , H04L12/927 , H05K1/02 , H04L12/781 , H04Q1/04 , G06F12/0893 , H05K13/04 , G11C5/06 , G06F11/14 , G06F11/34 , G06F12/0862 , G06F15/80 , H04L12/919 , G06Q10/06 , G07C5/00 , H04L12/28 , H04L29/12 , H04L9/06 , H04L9/14 , H04L9/32 , H04L12/933 , H04L12/947 , H04L12/811 , G06F17/30 , H04W4/80 , G06Q10/08 , G06Q10/00 , G06Q50/04
Abstract: Examples may include a sled for a rack of a data center including physical storage resources. The sled comprises an array of storage devices and an array of memory. The storage devices and memory are directly coupled to storage resource processing circuits which are themselves, directly coupled to dual-mode optical network interface circuitry. The circuitry can store data on the storage devices and metadata associated with the data on non-volatile memory in the memory array.
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公开(公告)号:US10091904B2
公开(公告)日:2018-10-02
申请号:US15394321
申请日:2016-12-29
Applicant: INTEL CORPORATION
Inventor: Steven C. Miller , Michael Crocker , Aaron Gorius , Paul Dormitzer
IPC: H05K7/14
Abstract: Examples may include a sled for a rack of a data center including physical storage resources. The sled comprises an array of storage devices and an array of memory. The storage devices and memory are directly coupled to storage resource processing circuits which are themselves, directly coupled to dual-mode optical network interface circuitry. The dual-mode optical network interface circuitry can have a bandwidth equal to or greater than the storage devices.
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公开(公告)号:US20210377140A1
公开(公告)日:2021-12-02
申请号:US17404749
申请日:2021-08-17
Applicant: Intel Corporation
Inventor: Matthew Adiletta , Aaron Gorius , Myles Wilde , Michael Crocker
IPC: H04L12/26 , G06F16/901 , H04B10/25 , G02B6/38 , G02B6/42 , G02B6/44 , G06F1/18 , G06F1/20 , G06F3/06 , G06F8/65 , G06F9/30 , G06F9/4401 , G06F9/54 , G06F12/109 , G06F12/14 , G06F13/16 , G06F13/40 , G08C17/02 , G11C5/02 , G11C7/10 , G11C11/56 , G11C14/00 , H03M7/30 , H03M7/40 , H04L12/24 , H04L12/931 , H04L12/947 , H04L29/08 , H04L29/06 , H04Q11/00 , H05K7/14 , G06F15/16
Abstract: Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuity is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed.
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公开(公告)号:US12238892B2
公开(公告)日:2025-02-25
申请号:US17128620
申请日:2020-12-21
Applicant: Intel Corporation
Inventor: Raanan Sover , James Williams , Bradley Smith , Nir Peled , Paul George , Jason Armstrong , Alexey Chinkov , Meir Cohen , Je-Young Chang , Kuang Liu , Ravindranath Mahajan , Kelly Lofgreen , Kyle Arrington , Michael Crocker , Sergio Antonio Chan Arguedas
IPC: H05K7/20
Abstract: A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.
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公开(公告)号:US20220201889A1
公开(公告)日:2022-06-23
申请号:US17128620
申请日:2020-12-21
Applicant: Intel Corporation
Inventor: Raanan Sover , James Williams , Bradley Smith , Nir Peled , Paul George , Jason Armstrong , Alexey Chinkov , Meir Cohen , Je-Young Chang , Kuang Liu , Ravindranath Mahajan , Kelly Lofgreen , Kyle Arrington , Michael Crocker , Sergio Antonio Chan Arguedas
IPC: H05K7/20
Abstract: A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.
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公开(公告)号:US20210058308A1
公开(公告)日:2021-02-25
申请号:US17015479
申请日:2020-09-09
Applicant: Intel Corporation
Inventor: Matthew Adiletta , Aaron Gorius , Myles Wilde , Michael Crocker
IPC: H04L12/26 , G06F16/901 , H04B10/25 , G02B6/38 , G02B6/42 , G02B6/44 , G06F1/18 , G06F1/20 , G06F3/06 , G06F8/65 , G06F9/30 , G06F9/4401 , G06F9/54 , G06F12/109 , G06F12/14 , G06F13/16 , G06F13/40 , G08C17/02 , G11C5/02 , G11C7/10 , G11C11/56 , G11C14/00 , H03M7/30 , H03M7/40 , H04L12/24 , H04L12/931 , H04L12/947 , H04L29/08 , H04L29/06 , H04Q11/00 , H05K7/14
Abstract: Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuitry is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed.
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公开(公告)号:US10757487B2
公开(公告)日:2020-08-25
申请号:US15396151
申请日:2016-12-30
Applicant: INTEL CORPORATION
Inventor: Mohan J. Kumar , Murugasamy K. Nachimuthu , Aaron Gorius , Michael Crocker
IPC: G06F9/46 , H04Q11/00 , G06F1/20 , G06F16/901 , G02B6/38 , G02B6/42 , G02B6/44 , G06F1/18 , G06F3/06 , G06F8/65 , G06F9/30 , G06F9/38 , G06F9/4401 , G06F9/50 , G06F9/54 , G06F12/109 , G06F12/14 , G06F13/16 , G06F13/40 , G08C17/02 , G11C5/02 , G11C7/10 , G11C11/56 , G11C14/00 , H03M7/30 , H03M7/40 , H04B10/25 , H04L12/24 , H04L12/26 , H04L12/851 , H04L12/811 , H04L12/931 , H04L29/08 , H04L29/06 , H05K5/02 , H05K7/14 , H04L12/911 , B25J15/00 , B65G1/04 , H05K7/20 , H04L12/939 , H04W4/02 , H04L12/751 , G06F13/42 , H05K1/18 , G05D23/19 , G05D23/20 , H04L12/927 , H05K1/02 , H04L12/781 , H04Q1/04 , G06F12/0893 , H05K13/04 , G11C5/06 , G06F11/14 , G06F11/34 , G06F12/0862 , G06F15/80 , H04L12/919 , G06F12/10 , G06Q10/06 , G07C5/00 , H04L12/28 , H04L29/12 , H04L9/06 , H04L9/14 , H04L9/32 , H04L12/933 , H04L12/947 , H04W4/80 , G06Q10/08 , G06Q10/00 , G06Q50/04
Abstract: Examples may include techniques to allocate physical accelerator resources from pools of accelerator resources. In particular, virtual computing devices can be composed from physical resources and physical accelerator resources dynamically allocated to the virtual computing devices. The present disclosure provides that physical accelerator resources can be dynamically allocated, or composed, to a virtual computing device despite not being physically coupled to other components in the virtual device.
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公开(公告)号:US20190062053A1
公开(公告)日:2019-02-28
申请号:US16023803
申请日:2018-06-29
Applicant: Intel Corporation
Inventor: Ralph Jensen , Michael Crocker , Brendan Pavelek , David Payne
IPC: B65G1/137
Abstract: Racks for operation in a data center, robots for use with racks of a data center, and methods of removing sleds from, and inserting sleds into, racks of a data center are disclosed herein. A rack includes a plurality of sled spaces and a plurality of sleds. Each sled is mounted in a corresponding sled space such that the plurality of sleds are spaced from one another in a vertical direction. A robot is configured to interface with any of the plurality of sleds mounted in the sled spaces.
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公开(公告)号:US10045098B2
公开(公告)日:2018-08-07
申请号:US15395203
申请日:2016-12-30
Applicant: Intel Corporation
Inventor: Matthew Adiletta , Aaron Gorius , Myles Wilde , Michael Crocker
Abstract: Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuity is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed.
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公开(公告)号:US10034407B2
公开(公告)日:2018-07-24
申请号:US15394392
申请日:2016-12-29
Applicant: INTEL CORPORATION
Inventor: Steven C. Miller , Michael Crocker , Aaron Gorius , Paul Dormitzer
Abstract: Examples may include a sled for a rack of a data center including physical storage resources. The sled comprises mounting flanges to enable robotic insertion and removal from a rack and storage device mounting slots to enable robotic insertion and removal of storage devices into the sled. The storage devices are coupled to an optical fabric through storage resource controllers and a dual-mode optical network interface.
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