公开(公告)号：US09174323B2

公开(公告)日：2015-11-03

申请号：US13671478

申请日：2012-11-07

Applicant: Intermolecular, Inc.

Inventor： Kim Van Berkel ,  Aaron T. Francis ,  Frank C. Ma ,  George Mirth

IPC: B24B37/26 ,  B24B37/10

CPC classification number: B24B37/26 ,  B24B37/10

Abstract: Polishing and cleaning techniques are combinatorially processed and evaluated. A polishing system can include a reactor assembly having multiple reaction chambers, with at least a reaction chamber including a rotatable polishing head, slurry and chemical distribution, chemical and water rinse, and slurry and fluid removal. Different downward forces can be applied to the polishing heads for evaluating optimum process conditions. Channels in the polishing pads can redistribute slurry and chemical to the polishing area.

Abstract translation: 抛光和清洁技术被组合处理和评估。 抛光系统可以包括具有多个反应室的反应器组件，其中至少一个反应室包括可旋转的抛光头，浆料和化学分布，化学和水冲洗以及淤浆和流体的去除。 可以向抛光头施加不同的向下的力以评估最佳工艺条件。 抛光垫中的通道可以将浆料和化学品重新分配到抛光区域。

公开(公告)号：US09082608B2

公开(公告)日：2015-07-14

申请号：US13692206

申请日：2012-12-03

Applicant: Intermolecular, Inc.

Inventor： Aaron T. Francis

IPC: B01L3/00 ,  H01L21/00 ,  H01L21/67

CPC classification number: H01L21/00 ,  H01L21/6719 ,  Y10T29/49998

Abstract: In some embodiments of the present disclosure, an apparatus for combinatorial wet processing includes: a chuck, a substrate located on the chuck, a cell located over the substrate; and a height adjustment mechanism for the cell above the substrate wherein applying compressed air on an O-ring in a gland prevents vertical movement of the cell relative to the position of the substrate.

Abstract translation: 在本公开的一些实施例中，用于组合湿法处理的装置包括：卡盘，位于卡盘上的基板，位于基板上方的单元; 以及用于基板上方的单元的高度调节机构，其中在压盖中的O形环上施加压缩空气防止单元相对于基板的位置的垂直移动。

公开(公告)号：US08835329B2

公开(公告)日：2014-09-16

申请号：US13669664

申请日：2012-11-06

Applicant: Intermolecular, Inc.

Inventor： Sandeep Mariserla ,  Aaron T. Francis ,  Jeffrey Chih-Hou Lowe ,  Robert Anthony Sculac

IPC: H01L21/302

CPC classification number: H01L21/67 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/67253 ,  H01L21/68785 ,  H01L22/20 ,  Y10T137/0396

Abstract: Methods for combinatorially processing semiconductor substrates are provided. The methods may involve receiving a substrate into a combinatorial processing chamber and sealing a plurality of flow cells against a surface of the substrate. The plurality of flow cells is enclosed within the combinatorial processing chamber to define an enclosed external environment for the plurality of flow cells. A pressure differential is created between a reaction area of the plurality of flow cells of the combinatorial processing chamber and the external environment, wherein each flow cells of the plurality of flow cells defines a site isolating region of the substrate. The regions the substrate are then combinatorially processed.

Abstract translation: 提供了组合处理半导体衬底的方法。 所述方法可以包括将基底接收到组合处理室中并将多个流动池密封抵靠基板的表面。 多个流动池被封闭在组合处理室内以限定多个流动池的封闭的外部环境。 在组合处理室的多个流动池的反应区域和外部环境之间产生压力差，其中多个流动池中的每个流动池限定基板的位置隔离区域。 然后将基底的区域组合处理。

公开(公告)号：US20140166840A1

公开(公告)日：2014-06-19

申请号：US13716044

申请日：2012-12-14

Applicant: INTERMOLECULAR, INC.

Inventor： Wayne R. French ,  Kent Riley Child ,  Alonzo T. Collins ,  Jay B. Dedontney ,  Richard R. Endo ,  Aaron T. Francis ,  Zachary Fresco ,  Edward L. Haywood ,  Ashley David Lacey ,  Monica Sawkar Mathur ,  James Tsung ,  Danny Wang ,  Kenneth A. Williams ,  Maosheng Zhao

IPC: H01L21/687

CPC classification number: H01L21/68728 ,  H01L21/68757

Abstract: A substrate carrier is provided. The substrate carrier includes a base for supporting a substrate. A plurality of support tabs is affixed to a surface of the base. The plurality of support tabs have a cavity defined within an inner region of each support tab of the plurality of support tabs. A plurality of protrusions extends from the surface of the base, wherein one of the plurality of protrusions mates with one cavity to support one of the plurality of support tabs. A film is deposited over the surface of the base, surfaces of the plurality of support tabs and surfaces of the plurality of protrusions.

Abstract translation: 提供衬底载体。 衬底载体包括用于支撑衬底的基底。 多个支撑片固定到基座的表面上。 多个支撑突片具有限定在多个支撑突片中的每个支撑突片的内部区域内的空腔。 多个突起从基座的表面延伸，其中多个突起中的一个与一个空腔配合，以支撑多个支撑突片中的一个。 薄膜沉积在基底的表面上，多个支撑突片的表面和多个突起的表面。

公开(公告)号：US20140166050A1

公开(公告)日：2014-06-19

申请号：US13719136

申请日：2012-12-18

Applicant: INTERMOLECULAR, INC.

Inventor： Rajesh Kelekar ,  Glen Eric Egami ,  Aaron T. Francis

IPC: H01L21/683

CPC classification number: H01L21/6838 ,  G03F7/707 ,  H01L21/68735 ,  H01L21/68757 ,  Y10T279/11

Abstract: Chucks for mounting and retaining semiconductor wafers during processing are described, particularly suited for wafer processing involving total immersion of the wafer-chuck structure in a liquid. Chuck structures are disclosed for preventing or hindering processing chemicals from contacting and contaminating large portions of the underside of the wafer undergoing processing, limiting such chemical contact to readily cleaned, relatively small annular regions on the periphery of the wafer. Embodiments include structures with supplemental gas flows on the underside of the wafer as well as the creation of gas/liquid meniscusci to prevent chemical penetration of the wafer's underside. Methods of processing semiconductor wafers employing such chucks are also described.

Abstract translation: 描述了用于在加工期间安装和保持半导体晶片的卡盘，特别适用于涉及将晶片卡盘结构完全浸入液体中的晶片加工。 公开了用于防止或阻碍处理化学品接触和污染正在进行处理的晶片的下侧的大部分的卡盘结构，将这种化学接触限制在晶片周边上容易清洁的相对较小的环形区域。 实施例包括在晶片的下侧上具有补充气体流动的结构，以及产生气体/液体弯月面以防止晶片下侧的化学渗透。 还描述了使用这种卡盘处理半导体晶片的方法。

公开(公告)号：US20140127974A1

公开(公告)日：2014-05-08

申请号：US13671478

申请日：2012-11-07

Applicant: INTERMOLECULAR, INC.

Inventor： Kim Van Berkel ,  Aaron T. Francis ,  Frank C. Ma ,  George Mirth

IPC: B24B37/00 ,  B24B37/10 ,  B24B37/26

CPC classification number: B24B37/26 ,  B24B37/10

Abstract: Polishing and cleaning techniques are combinatorially processed and evaluated. A polishing system can include a reactor assembly having multiple reaction chambers, with at least a reaction chamber including a rotatable polishing head, slurry and chemical distribution, chemical and water rinse, and slurry and fluid removal. Different downward forces can be applied to the polishing heads for evaluating optimum process conditions. Channels in the polishing pads can redistribute slurry and chemical to the polishing area.

Abstract translation: 抛光和清洁技术被组合处理和评估。 抛光系统可以包括具有多个反应室的反应器组件，其中至少一个反应室包括可旋转的抛光头，浆料和化学分布，化学和水冲洗以及淤浆和流体的去除。 可以向抛光头施加不同的向下的力以评估最佳工艺条件。 抛光垫中的通道可以将浆料和化学品重新分配到抛光区域。

公开(公告)号：US20130065796A1

公开(公告)日：2013-03-14

申请号：US13664119

申请日：2012-10-30

Applicant: INTERMOLECULAR, INC.

Inventor： Aaron T. Francis ,  Tony P. Chiang ,  John Schmidt ,  Kurt H. Weiner

IPC: C40B60/00

CPC classification number: C23C16/45514 ,  C23C16/45574 ,  C23C16/52 ,  H01L21/67017 ,  H01L21/67276 ,  Y10S438/907 ,  Y10S438/908 ,  Y10S438/913 ,  Y10T137/4673 ,  Y10T137/469 ,  Y10T137/87249 ,  Y10T137/87265 ,  Y10T137/87281

Abstract: An integrated processing tool is described comprising a full-wafer processing module and a combinatorial processing module. Chemicals for use in the combinatorial processing module are fed from a delivery system including a set of first manifolds. An output of each first manifold is coupled to at least one mixing vessel. An output of each mixing vessel feeds more than one of a set of second manifolds. An output of each set of second manifolds feeds one of multiple site-isolated reactors of the combinatorial processing module.

Abstract translation: 描述了一种集成处理工具，其包括全晶片处理模块和组合处理模块。 用于组合处理模块的化学品从包括一组第一歧管的递送系统进料。 每个第一歧管的输出端连接至至少一个混合容器。 每个混合容器的输出馈送一组第二歧管中的多于一个。 每组第二歧管的输出馈送组合处理模块的多个位置隔离反应器中的一个。