Abstract:
A composition for pattern formation includes a block copolymer and a solvent. The block copolymer is capable of forming a phase separation structure through directed self-assembly. The block copolymer includes a first block and a second block. The first block includes a first repeating unit which includes at least two silicon atoms. The second block includes a second repeating unit which does not include a silicon atom. A sum of the atomic weight of atoms constituting the first repeating unit is no greater than 700.
Abstract:
A pattern-forming method includes providing a metal-containing film directly or indirectly on a substrate. A directed self-assembling film is provided directly or indirectly on the metal-containing film such that a plurality of phases of the directed self-assembling film is formed. At least a part of the plurality of phases of the directed self-assembling film is removed such that a pattern of the directed self-assembling film is formed. The metal-containing film and the substrate are sequentially etched using the pattern of the directed self-assembling film as a mask.
Abstract:
A directed self-assembling composition for pattern formation includes a block copolymer. The block copolymer includes a polystyrene block having a styrene unit, and a polyalkyl (meth)acrylate block having an alkyl (meth)acrylate unit. The block copolymer has a group that is bound to at least one end of a main chain of the block copolymer and that includes a hetero atom.
Abstract:
A radiation-sensitive composition contains: a compound that includes a metal and an oxygen atom, the metal and the oxygen atom being bonded by a covalent bond; and a solvent composition. The metal is a metal of an element belonging to any one of period 4 to period 7 of group 3 to group 15 in periodic table. The solvent contains: a first solvent having a viscosity at 20° C. of no greater than 10 mPa·s and a vapor pressure at 20° C. of no greater than 5 kPa; and a second solvent having a van der Waals volume of no greater than 150 Å3, and being different from the first solvent. The second solvent is: water; a monovalent alcohol represented by R1—OH; R2—COOH; or a combination thereof.
Abstract:
A base film-forming composition includes a compound including a group capable of reacting with Si—OH or Si—H, and a solvent. The base film-forming composition is for forming a base film provided between a layer including a silicon atom and a directed self-assembling film in a directed self-assembly lithography process. The receding contact angle of the base film for pure water is no less than 70° and no greater than 90°. The compound is preferably represented by formula (1). In the formula (1), A represents a linking group having a valency of (m+n); D represents a monovalent organic group having at least 10 carbon atoms; E represents the group capable of reacting with Si—OH or Si—H; and m and n are each independently an integer of 1 to 200. (En-AD)m (1)
Abstract:
A pattern-forming method includes providing a coating film using a composition that includes: a first polymer which is a block copolymer; and a second polymer having a surface free energy lower than a surface free energy of the first polymer, such that the second polymer is unevenly distributed to be localized into a superficial layer region of the coating film. Phase separation is caused in the coating film along a direction substantially perpendicular to a thickness direction of the coating film such that at least a part of the coating film is converted into a directed self-assembling film which includes a plurality of phases. A part of the plurality of phases of the directed self-assembling film is removed.
Abstract:
A composition includes a polymer component including a first polymer having a first structural unit represented by a following formula (1), and a solvent. In the formula (1), R1 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms. R2 represents a single bond or a divalent organic group having 1 to 20 carbon atoms. R3 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms. RQ represents a perfluoroalkyl group having 1 to 5 carbon atoms. RX represents a hydrogen atom or a monovalent base-labile group.
Abstract:
A pattern-forming method includes providing a resist underlayer film on a substrate using a resist underlayer film-forming composition. The resist underlayer film-forming composition includes a first polymer having a glass transition temperature of 0 to 180° C. A silicon-based oxide film is provided on a surface of the resist underlayer film. A resist pattern is provided on a surface of the silicon-based oxide film using a resist composition. The silicon-based oxide film and the resist underlayer film are sequentially dry-etched using the resist pattern as a mask. The substrate is dry-etched using the dry-etched resist underlayer film as a mask.
Abstract:
A composition for forming a liquid immersion upper layer film includes a polymer component including a polymer having a structural unit represented by a formula (1); and a solvent. R1 represents a carboxy group or a group represented by a formula (2); X represents a single bond, a divalent hydrocarbon group having 1 to 20 carbon atoms or a divalent fluorinated hydrocarbon group having 1 to 20 carbon atoms; R2 represents a hydrocarbon group having 1 to 20 carbon atoms and a valency of (n+1), a fluorinated hydrocarbon group having 1 to 20 carbon atoms and a valency of (n+1), or one of these groups each including between adjacent two carbon atoms thereof —CO—, —COO—, —O—, —NR′—, —CS—, —S—, —SO—, —SO2— or a combination thereof; and R3 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms.
Abstract translation:用于形成液浸上层膜的组合物包括含有具有由式(1)表示的结构单元的聚合物的聚合物组分; 和溶剂。 R1表示羧基或由式(2)表示的基团。 X表示单键,碳原子数1〜20的二价烃基或碳原子数1〜20的二价氟代烃基。 R 2表示碳原子数1〜20的烃基,(n + 1)的化合价,碳原子数1〜20的氟代烃基,(n + 1)的化合价, -CO - , - CO-, - O - , - NR' - , - S-,-S - , - SO - , - SO 2 - 或其组合的两个碳原子; R3表示氢原子或碳原子数1〜20的1价有机基团。
Abstract:
A resist pattern-forming method capable of forming a resist pattern excellent in pattern collapse resistance in the case of development with the organic solvent in multilayer resist processes. The method has the steps of: (1) providing a resist underlayer film on a substrate using a composition for forming a resist underlayer film; (2) providing a resist film on the resist underlayer film using a photoresist composition; (3) exposing the resist film; and (4) developing the exposed resist film using a developer solution containing no less than 80% by mass of an organic solvent, in which the composition for forming a resist underlayer film contains (A) a component that includes a polysiloxane chain and that has a carboxyl group, a group that can generate a carboxyl group by an action of an acid, an acid anhydride group or a combination thereof.