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公开(公告)号:US20230411401A1
公开(公告)日:2023-12-21
申请号:US18459677
申请日:2023-09-01
Applicant: Japan Display Inc.
Inventor: Isao SUZUMURA
IPC: H01L27/12 , G02F1/1368 , H01L29/40 , H01L29/423 , H10K59/126
CPC classification number: H01L27/1225 , G02F1/1368 , H01L27/1248 , H01L29/401 , H01L29/42384 , H10K59/126 , H01L21/426
Abstract: The purpose of the present invention is to decrease the resistance of the drain and source in the TFT of the oxide semiconductor as well as to have stable Vd-Id characteristics of the TFT. The structure of the present invention is as follows: A display device having plural pixels including thin film transistors (TFT) having oxide semiconductor films comprising: a gate insulating film formed on the oxide semiconductor film, an aluminum oxide film formed on the gate insulating film, a gate electrode formed on the aluminum oxide film, a side spacer formed on both sides of the gate electrode, and an interlayer insulating film formed on the gate electrode, the side spacer, a drain and a source, wherein in a plan view, and in a direction from the drain to the source, a length of the gate electrode is shorter than a length of the aluminum oxide film.
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公开(公告)号:US20230083488A1
公开(公告)日:2023-03-16
申请号:US17992054
申请日:2022-11-22
Applicant: Japan Display Inc.
Inventor: Ryuji MORI , Isao SUZUMURA , Masahiro TADA , Takashi DOI
IPC: H01L27/146 , H01L27/12
Abstract: A detection device includes a substrate, a plurality of photodiodes arranged on the substrate, a plurality of transistors provided correspondingly to each of the photodiodes, an insulating film that covers the transistors, and a plurality of lower electrodes each of which is provided above the insulating film correspondingly to each of the photodiodes, and is electrically coupled to the transistors. The lower electrodes and the photodiodes are stacked in this order above the insulating film, and one of the lower electrodes and one of the photodiodes are provided so as to overlap the transistors in a plan view from a direction orthogonal to the substrate.
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公开(公告)号:US20230020074A1
公开(公告)日:2023-01-19
申请号:US17945214
申请日:2022-09-15
Applicant: Japan Display Inc.
Inventor: Yohei YAMAGUCHI , Arichika ISHIDA , Hidekazu MIYAKE , Hiroto MIYAKE , Isao SUZUMURA
IPC: G02F1/1368 , G02F1/1362 , H01L27/12 , H01L29/786 , G02F1/1343
Abstract: According to one embodiment, a semiconductor device includes an insulating substrate, a first metal layer on the insulating substrate, a first insulating layer on the insulating substrate and the first metal layer, a semiconductor layer on the first insulating layer, a second insulating layer on the semiconductor layer and the first insulating layer, a second metal layer on the second insulating layer, and a first electrode and a second electrode which are electrically connected to the semiconductor layer. The first metal layer overlaps the second metal layer. A third metal layer contacts a top surface of the second metal layer and a top surface of the first metal layer.
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公开(公告)号:US20220399403A1
公开(公告)日:2022-12-15
申请号:US17838314
申请日:2022-06-13
Applicant: Japan Display Inc.
Inventor: Isao SUZUMURA , Kento HIMOTO , Takashi NAKAMURA , Masahiro TADA , Yasushi TOMIOKA
Abstract: A photo detecting device, includes a plurality of photodiodes arranged above a substrate, a lower electrode and a first inorganic insulating film that are provided between the substrate and the photodiodes in a direction orthogonal to a surface of the substrate, and an upper electrode provided above the photodiodes. Each of the photodiodes comprises an active layer, a first carrier transport layer provided between the active layer and the lower electrode, and a second carrier transport layer provided between the active layer and the upper electrode, the first inorganic insulating film is provided between the lower electrode and the first carrier transport layer, and the first inorganic insulating film covers at least an end on an outer edge side of the lower electrode.
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公开(公告)号:US20220326581A1
公开(公告)日:2022-10-13
申请号:US17851982
申请日:2022-06-28
Applicant: Japan Display Inc.
Inventor: Fumiya KIMURA , Isao SUZUMURA
IPC: G02F1/1362 , G02F1/1368 , G02F1/1343 , G02F1/1339
Abstract: The purpose of the present invention is to obviate patterning defects of electrodes in through-holes formed in an organic passivation film for connection between TFTs and pixel electrodes in an ultra-high definition display device. To achieve the foregoing, the present invention has a configuration such as the following. This display device, in which a TFT (thin-film transistor) is formed on a substrate, an organic passivation film is formed covering the TFT, and a first pixel electrode, a first common electrode, a second pixel electrode, and a second common electrode are formed on the organic passivation film, is characterized in that the first pixel electrode is connected to the TFT via a through-hole formed in the organic passivation film, the through-hole is filled with a filler, and an end of the second pixel electrode is present on the upper side of the filler.
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公开(公告)号:US20210257402A1
公开(公告)日:2021-08-19
申请号:US17167081
申请日:2021-02-04
Applicant: Japan Display Inc.
Inventor: Hajime WATAKABE , Akihiro HANADA , Marina MOCHIZUKI , Ryo ONODERA , Fumiya KIMURA , Isao SUZUMURA
IPC: H01L27/146
Abstract: The present invention provides a technology which realizes a reliable semiconductor device including a photosensor device by preventing pent roofs of edges of a P+ layer from being generated and a metal wiring installed over the P+ layer from coming down while securing the electrical conductivity of the P+ layer. The semiconductor device includes a photosensor including a photodiode formed on a substrate. The photodiode includes: a cathode electrode; a laminated structure that is formed on the cathode electrode and in which an N+ layer, an I layer, and a P+ layer are laminated in this order; an anode electrode formed on the P+ layer; a first insulating film formed so as to cover a portion of the anode electrode and edges of the laminated structure; and a metal wiring connected to the anode electrode. The edges of the laminated structure are formed in forward tapered shapes in a cross-sectional view.
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公开(公告)号:US20200251505A1
公开(公告)日:2020-08-06
申请号:US16852925
申请日:2020-04-20
Applicant: Japan Display Inc.
Inventor: Hajime WATAKABE , Isao SUZUMURA , Akihiro HANADA , Yohei YAMAGUCHI
IPC: H01L27/12 , H01L29/24 , H01L29/786 , H01L29/66
Abstract: A display device including a substrate having thin film transistors (TFT) comprising: the TFT including an oxide semiconductor film, a gate electrode and an insulating film formed between the oxide semiconductor film and the gate electrode, wherein a first aluminum oxide film and a second aluminum oxide film, which is formed on the first aluminum oxide film, are formed between the insulating film and the gate electrode, an oxygen concentration in the first aluminum oxide film is bigger than an oxygen concentration in the second aluminum oxide film.
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公开(公告)号:US20190244979A1
公开(公告)日:2019-08-08
申请号:US15929125
申请日:2019-04-18
Applicant: Japan Display Inc.
Inventor: Isao SUZUMURA , Yohei YAMAGUCHI , Hajime WATAKABE , Akihiro HANADA , Hirokazu WATANABE , Marina SHIOKAWA
IPC: H01L27/12 , H01L29/49 , H01L21/02 , H01L29/786 , H01L29/66 , H01L21/4763 , H01L21/465
CPC classification number: H01L27/1225 , G02F1/133305 , G02F1/13452 , G02F1/136227 , G02F1/136286 , G02F1/1368 , G02F2001/136295 , G02F2202/10 , H01L21/02164 , H01L21/0217 , H01L21/02178 , H01L21/02565 , H01L21/465 , H01L21/47635 , H01L27/1218 , H01L27/124 , H01L27/1248 , H01L27/1266 , H01L27/127 , H01L27/3248 , H01L27/3262 , H01L27/3276 , H01L29/42384 , H01L29/4908 , H01L29/4983 , H01L29/66969 , H01L29/78648 , H01L29/7869
Abstract: A display device to improve reliability of the TFT of the oxide semiconductor, including: a substrate including a display area where plural pixels are formed, the pixel includes a first TFT of a first oxide semiconductor; a first gate insulating film is formed on the first oxide semiconductor, a gate electrode is formed on the first gate insulating film, an interlayer insulating film is formed over the gate electrode; the gate insulating film includes a first silicon oxide film, the gate electrode includes a first gate layer made of a second oxide semiconductor and a second gate layer made of metal or alloy; the interlayer insulating film has a first interlayer insulating film including a second silicon oxide film, and a second interlayer insulating film including a first aluminum oxide film on the first interlayer insulating film.
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公开(公告)号:US20160163741A1
公开(公告)日:2016-06-09
申请号:US15015445
申请日:2016-02-04
Applicant: Japan Display Inc.
Inventor: Isao SUZUMURA , Norihiro UEMURA , Hidekazu MIYAKE , Yohei YAMAGUCHI
IPC: H01L27/12
CPC classification number: H01L27/1225 , H01L21/02071 , H01L21/02164 , H01L21/02211 , H01L21/02274 , H01L21/32138 , H01L21/32139 , H01L21/473 , H01L27/1248 , H01L27/127 , H01L29/66969 , H01L29/7869 , H01L29/78693
Abstract: There is provided a bottom gate channel etched thin film transistor that can suppress initial Vth depletion and a Vth shift. A thin film transistor is formed, including a gate electrode interconnection disposed on a substrate, a gate insulating film, an oxide semiconductor layer to be a channel layer, a stacked film of a source electrode interconnection and a first hard mask layer, a stacked film of a drain electrode interconnection and a second hard mask layer, and a protective insulating film.
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公开(公告)号:US20160043232A1
公开(公告)日:2016-02-11
申请号:US14920647
申请日:2015-10-22
Applicant: Japan Display Inc.
Inventor: Norihiro UEMURA , Takeshi NODA , Hidekazu MIYAKE , Isao SUZUMURA
IPC: H01L29/786 , G02F1/1335 , G02F1/1368 , H01L27/12
CPC classification number: H01L29/78606 , G02F1/133602 , G02F1/1368 , H01L27/1225 , H01L29/7869
Abstract: A thin film transistor includes, an insulating substrate, a gate electrode provided on an upper surface of the insulating substrate, a gate insulating film formed so as to cover the gate electrode, an oxide semiconductor layer provided on the gate insulating film, a channel protective layer provided at least on an upper surface of the oxide semiconductor layer, and a source electrode and a drain electrode provided so as to come into contact with the oxide semiconductor layer, wherein the channel protective layer is formed such that the film density of a portion provided so as to come into contact with the oxide semiconductor layer is higher than the film density of a portion distant from the oxide semiconductor layer.
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