ULTRASOUND TRANSDUCER ASSEMBLY WITH IMPROVED THERMAL BEHAVIOR
    11.
    发明申请
    ULTRASOUND TRANSDUCER ASSEMBLY WITH IMPROVED THERMAL BEHAVIOR 审中-公开
    超声波传感器组件具有改进的热行为

    公开(公告)号:US20120143060A1

    公开(公告)日:2012-06-07

    申请号:US12810346

    申请日:2008-12-22

    IPC分类号: A61B8/00 H05K13/00

    摘要: A transducer assembly (10) is provided that includes a housing (12), a lens (14), an array of transducer elements (18), an interposer assembly (22), a transducer array 5 control assembly (30), and a heat sink assembly (32). The interposer assembly (22) includes a plurality of signals tracks (56) that provide electrical connections between the array of transducer elements (18) and the transducer array control assembly (30). The interposer assembly (22) further includes heat transporter bars (50) for transporting heat within the interposer (22) to the heat sink assembly (32). A flexible interconnection 10 assembly (28) is disposed between the interposer assembly (22) and the transducer array control assembly (30) providing re-workable electrical connections between the signal tracks (56) of the interposer assembly (22) and the transducer array control assembly (30).

    摘要翻译: 提供了一种换能器组件(10),其包括壳体(12),透镜(14),换能器元件阵列(18),插入件组件(22),换能器阵列5控制组件(30)和 散热器组件(32)。 插入器组件(22)包括提供换能器元件阵列(18)和换能器阵列控制组件(30)之间的电连接的多个信号轨道(56)。 插入器组件(22)还包括用于将内插器(22)内的热传递到散热器组件(32)的热运送棒(50)。 柔性互连10组件(28)设置在插入器组件(22)和换能器阵列控制组件(30)之间,从而在插入器组件(22)的信号轨道(56)和换能器阵列之间提供可重新工作的电连接 控制组件(30)。

    METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE COMPRISING A SILICON MEMS MICROPHONE
    12.
    发明申请
    METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE COMPRISING A SILICON MEMS MICROPHONE 审中-公开
    制造包含硅MEMS麦克风的微电子封装的方法

    公开(公告)号:US20100155863A1

    公开(公告)日:2010-06-24

    申请号:US12063117

    申请日:2006-08-04

    IPC分类号: H01L29/84 H01L21/02 H04R25/00

    摘要: A method for manufacturing a microelectronic package comprising a silicon MEMS microphone comprises the following steps: providing a basic panel (100) having several rows of interconnected substrates (90), wherein the substrates (90) are provided with electrically conductive connection pads (31), electrically conductive tracks (33), and a grid (40) comprising tiny holes (41); arranging an IC chip (50), a silicon MEMS microphone (60) and a ring-shaped element (95) on the substrates (90), wherein the ring-shaped element (95) is arranged around the microphone (60); and folding the substrates (90) in three, wherein an open side of the ring-shaped element (95) is closed. The IC chip (50) and the microphone (60) are safely accommodated in the package (5) that is obtained in this way. The connection pads (31) allow for easy connection of the package (5) to another device, while 32 electrical connections to the IC chip (50) are also easily realized through these connection pads (31). An electrical connection of the microphone (60) to the IC chip (50) is realized through the electrically conductive tracks (33).

    摘要翻译: 一种用于制造包括硅MEMS麦克风的微电子封装的方法包括以下步骤:提供具有多行互连基板(90)的基板(100),其中所述基板(90)设置有导电连接焊盘(31) ,导电轨道(33)和包括微小孔(41)的格栅(40); 在所述基板(90)上布置IC芯片(50),硅MEMS麦克风(60)和环形元件(95),其中所述环形元件(95)围绕所述麦克风(60)布置; 并将基板(90)折叠成三个,其中环形元件(95)的开放侧被封闭。 IC芯片(50)和麦克风(60)被安全地容纳在以这种方式获得的封装(5)中。 连接焊盘(31)允许将封装(5)容易地连接到另一个器件,而通过这些连接焊盘(31)也容易实现与IC芯片(50)的32个电连接。 通过导电轨道(33)实现麦克风(60)与IC芯片(50)的电连接。

    Lighting assembly With Air Cooling
    18.
    发明申请
    Lighting assembly With Air Cooling 审中-公开
    照明组件与空气冷却

    公开(公告)号:US20110122610A1

    公开(公告)日:2011-05-26

    申请号:US13055503

    申请日:2009-07-24

    IPC分类号: F21L13/00

    摘要: A lighting device (2) generating excess heat has a cooling area cooled by a fluid flow generated by a fan device (10). A fan motor (6) driving the fan device has an electromagnetic motor circuit. Part of the electromagnetic motor circuit forms part of an electromagnetic generator circuit. The electromagnetic generator circuit supplies the lighting device. The combination of the electromagnetic motor and generator circuits provides a compact and low-cost construction which can be connected to a mains voltage without electric conversion. The lighting device may be an LED device.

    摘要翻译: 产生过热的照明装置(2)具有由风扇装置(10)产生的流体流冷却的冷却区域。 驱动风扇装置的风扇电机(6)具有电磁电动机电路。 电磁电机电路的一部分构成电磁发电机电路的一部分。 电磁发电机电路供应照明装置。 电磁电机和发电机电路的组合提供了一种紧凑且低成本的结构,其可以连接到没有电转换的电源电压。 照明装置可以是LED装置。

    Fluid sample transport device with reduced dead volume for processing, controlling and/or detecting a fluid sample
    19.
    发明授权
    Fluid sample transport device with reduced dead volume for processing, controlling and/or detecting a fluid sample 失效
    减少死体积的流体样品输送装置用于处理,控制和/或检测流体样品

    公开(公告)号:US07892493B2

    公开(公告)日:2011-02-22

    申请号:US12298951

    申请日:2007-04-23

    IPC分类号: G01N33/00

    摘要: A fluid sample transport device with reduced dead volume for processing, controlling and/or detecting a fluid sample, includes a substrate having an upper surface with at least one processing, controlling and/or detecting element. At least one flexible membrane is arranged on the upper surface of the substrate. The fluid sample transport device further includes at least one plunger and/or actuating element for actuating an up and/or down movement of the flexible membrane to cause a fluid flow and/or to stop a fluid flow. A cover plate is arranged on the upper outer surface or lower outer surface of the flexible membrane. The cover plate includes at least one through going hole and/or cut-out for receiving a plunger and/or actuating element, so that movement of the plunger and/or actuating element causes a pump and/or valve action of the adjacent arranged flexible membrane area to cause a fluid flow in a channel temporally formed by expansion of the flexible membrane. The temporally formed channel is between the upper surface of the substrate and the lower surface of the flexible membrane.

    摘要翻译: 用于处理,控制和/或检测流体样品的死体积减小的流体样品输送装置包括具有至少一个处理,控制和/或检测元件的上表面的基底。 至少一个柔性膜布置在基板的上表面上。 流体样品输送装置还包括至少一个柱塞和/或致动元件,用于致动柔性膜的向上和/或向下运动以引起流体流动和/或停止流体流动。 盖板设置在柔性膜的上外表面或下外表面上。 盖板包括用于接收柱塞和/或致动元件的至少一个穿孔和/或切口,使得柱塞和/或致动元件的运动导致相邻布置的柔性的泵和/或阀动作 膜区域,以在由柔性膜的膨胀暂时形成的通道中引起流体流动。 时间上形成的通道位于基板的上表面和柔性膜的下表面之间。