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    DESIGN AND NOISE BASED CARE AREAS
    11.
    发明申请
    DESIGN AND NOISE BASED CARE AREAS 审中-公开

    公开(公告)号：US20200126212A1

    公开(公告)日：2020-04-23

    申请号：US16364161

    申请日：2019-03-25

    Applicant: KLA-Tencor Corporation

    Inventor： Brian Duffy ,  Martin Plihal ,  Santosh Bhattacharyya ,  Gordon Rouse ,  Chris Maher ,  Erfan Soltanmohammadi

    IPC: G06T7/00 ,  H01L21/66 ,  G06T7/11 ,  G01R31/308 ,  G03F7/20

    Abstract: Methods and systems for setting up inspection of a specimen with design and noise based care areas are provided. One system includes one or more computer subsystems configured for generating a design-based care area for a specimen. The computer subsystem(s) are also configured for determining one or more output attributes for multiple instances of the care area on the specimen, and the one or more output attributes are determined from output generated by an output acquisition subsystem for the multiple instances. The computer subsystem(s) are further configured for separating the multiple instances of the care area on the specimen into different care area sub-groups such that the different care area sub-groups have statistically different values of the output attribute(s) and selecting a parameter of an inspection recipe for the specimen based on the different care area sub-groups.

    Sub-Pixel Alignment of Inspection to Design
    13.
    发明申请
    Sub-Pixel Alignment of Inspection to Design 有权
    子像素对齐检验到设计

    公开(公告)号：US20160275672A1

    公开(公告)日：2016-09-22

    申请号：US15073617

    申请日：2016-03-17

    Applicant: KLA-Tencor Corporation

    Inventor： Santosh Bhattacharyya ,  Pavan Kumar ,  Lisheng Gao ,  Thirupurasundari Jayaraman ,  Raghav Babulnath ,  Srikanth Kandukuri ,  Gangadharan Sivaraman ,  Karthikeyan Subramanian ,  Raghavan Konuru ,  Rahul Lakhawat

    IPC: G06T7/00

    CPC classification number: G06T7/33 ,  G06T2207/10061 ,  G06T2207/30148

    Abstract: Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. In general, some embodiments described herein are configured for substantially accurately aligning inspection subsystem output generated for a specimen to a design for the specimen despite deformation of the design in the inspection subsystem output. In addition, some embodiments are configured for generating and/or using alignment targets that can be shared across multiple specimens of the same layer and design rule for alignment of inspection subsystem output generated for a specimen to a design for the specimen.

    Abstract translation: 提供了用于确定由检查子系统在设计数据空间中产生的输出位置的方法和系统。 通常，这里描述的一些实施例被配置成用于将检测子系统产生的样品基本上精确地对准于试样的设计，尽管检查子系统输出中的设计变形。 此外，一些实施例被配置用于生成和/或使用可以在同一层的多个样本上共享的对准目标和用于将为样本生成的检查子系统输出对准样本的设计规则的设计规则。

    Alignment of Inspection to Design Using Built in Targets
    14.
    发明申请
    Alignment of Inspection to Design Using Built in Targets 有权
    检验与使用内置目标的设计对齐

    公开(公告)号：US20160188784A1

    公开(公告)日：2016-06-30

    申请号：US14983452

    申请日：2015-12-29

    Applicant: KLA-Tencor Corporation

    Inventor： Santosh Bhattacharyya ,  Bjoern Braeuer ,  Lisheng Gao

    IPC: G06F17/50

    CPC classification number: G06F17/5081 ,  G03F7/70616

    Abstract: Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. One method includes selecting one or more alignment targets from a design for a specimen. At least a portion of the one or more alignment targets include built in targets included in the design for a purpose other than alignment of inspection results to design data space. At least the portion of the one or more alignment targets does not include one or more individual device features. One or more images for the alignment target(s) and output generated by the inspection subsystem at the position(s) of the alignment target(s) may then be used to determine design data space positions of other output generated by the inspection subsystem in a variety of ways described herein.

    Abstract translation: 提供了用于确定由检查子系统在设计数据空间中产生的输出位置的方法和系统。 一种方法包括从样本的设计中选择一个或多个对准目标。 一个或多个对准目标的至少一部分包括设计中包括的内置目标，用于除了检查结果对齐以设计数据空间之外的目的。 至少一个或多个对准目标的部分不包括一个或多个单独的装置特征。 然后可以使用用于对准目标的一个或多个图像和由检查子系统在对准目标的位置产生的输出来确定由检查子系统生成的其他输出的设计数据空间位置 本文描述的各种方式。

    Defect-location determination using correction loop for pixel alignment
    15.
    发明授权
    Defect-location determination using correction loop for pixel alignment 有权

    公开(公告)号：US11049745B2

    公开(公告)日：2021-06-29

    申请号：US16417645

    申请日：2019-05-21

    Applicant: KLA-Tencor Corporation

    Inventor： David Dowling ,  Tarunark Singh ,  Bjorn Brauer ,  Santosh Bhattacharyya ,  Bryant Mantiply ,  Hucheng Lee ,  Xiaochun Li ,  Sangbong Park

    IPC: H01L21/67 ,  G06T7/00

    Abstract: A method of semiconductor-wafer image alignment is performed at a semiconductor-wafer defect-inspection system. In the method, a semiconductor wafer is loaded into the semiconductor-wafer defect-inspection system. Pre-inspection alignment is performed for the semiconductor wafer. After performing the pre-inspection alignment, a first swath is executed to generate a first image of a first region on the semiconductor wafer. An offset of a target structure in the first image with respect to a known point is determined. Defect identification is performed for the first image, using the offset. After executing the first swath and determining the offset, a second swath is executed to generate a second image of a second region on the semiconductor wafer. While executing the second swath, run-time alignment of the semiconductor wafer is performed using the offset.

    And noise based care areas
    17.
    发明授权
    And noise based care areas 有权

    公开(公告)号：US10832396B2

    公开(公告)日：2020-11-10

    申请号：US16364161

    申请日：2019-03-25

    Applicant: KLA-Tencor Corporation

    Inventor： Brian Duffy ,  Martin Plihal ,  Santosh Bhattacharyya ,  Gordon Rouse ,  Chris Maher ,  Erfan Soltanmohammadi

    IPC: G03F1/84 ,  G06T7/00 ,  H01L21/66 ,  G06T7/11 ,  G03F7/20 ,  G01R31/308

    Abstract: Methods and systems for setting up inspection of a specimen with design and noise based care areas are provided. One system includes one or more computer subsystems configured for generating a design-based care area for a specimen. The computer subsystem(s) are also configured for determining one or more output attributes for multiple instances of the care area on the specimen, and the one or more output attributes are determined from output generated by an output acquisition subsystem for the multiple instances. The computer subsystem(s) are further configured for separating the multiple instances of the care area on the specimen into different care area sub-groups such that the different care area sub-groups have statistically different values of the output attribute(s) and selecting a parameter of an inspection recipe for the specimen based on the different care area sub-groups.

    High sensitivity repeater defect detection
    18.
    发明授权
    High sensitivity repeater defect detection 有权

    公开(公告)号：US10395358B2

    公开(公告)日：2019-08-27

    申请号：US15804980

    申请日：2017-11-06

    Applicant: KLA-Tencor Corporation

    Inventor： Bjorn Brauer ,  Eugene Shifrin ,  Ashok Mathew ,  Chetana Bhaskar ,  Lisheng Gao ,  Santosh Bhattacharyya ,  Hucheng Lee ,  Benjamin Murray

    IPC: G06T7/00 ,  G01N21/95

    Abstract: Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) that include one or more image processing components that acquire images generated by an inspection subsystem for a wafer, a main user interface component that provides information generated for the wafer and the reticle to a user and receives instructions from the user, and an interface component that provides an interface between the one or more image processing components and the main user interface. Unlike currently used systems, the one or more image processing components are configured for performing repeater defect detection by applying a repeater defect detection algorithm to the images acquired by the one or more image processing components, and the repeater defect detection algorithm is configured to detect defects on the wafer using a hot threshold and to identify the defects that are repeater defects.

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