公开(公告)号：US20120106084A1

公开(公告)日：2012-05-03

申请号：US12934996

申请日：2009-03-09

申请人： Kei Mizuta ,  Katsuya Tsuruta ,  Toshiaki Kotani ,  Kenji Ohsawa

发明人： Kei Mizuta ,  Katsuya Tsuruta ,  Toshiaki Kotani ,  Kenji Ohsawa

IPC分类号： H05K7/20 ,  B21D53/02 ,  F28D15/04

CPC分类号： H05K1/0272 ,  F28D15/0233 ,  F28D15/046 ,  H01L23/427 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/064 ,  Y10T29/4935 ,  H01L2924/00

摘要： A heat pipe for cooling an exothermic body by the vaporization and condensation of an enclosed cooling medium is disclosed. The heat pipe comprises a flat plate-like upper plate, a flat plate-like lower plate opposed to the upper plate, and a plurality of flat plate-like intermediate plates overlaid on each other between the upper plate and the lower plate and having internal through-holes. The internal through-holes formed in each of a plurality of the intermediate plates are adapted such that only part of each through-hole is overlapped on each other to form capillary tube paths, each having a cross-sectional area smaller than the cross-sectional area of the through-hole in the flat surface direction.

摘要翻译： 公开了一种通过封闭的冷却介质的蒸发和冷凝来冷却放热体的热管。 热管包括平板状的上板，与上板相对的平板状下板，以及在上板和下板之间彼此重叠的多个平板状中间板，并具有内部 通孔。 形成在多个中间板的每一个中的内部通孔适于使得每个通孔的仅一部分彼此重叠以形成毛细管路径，每个通孔的横截面积小于横截面积 通孔在平面方向的面积。

公开(公告)号：US06838368B1

公开(公告)日：2005-01-04

申请号：US09710314

申请日：2000-11-10

申请人： Kenji Ohsawa ,  Tomoshi Ohde

发明人： Kenji Ohsawa ,  Tomoshi Ohde

IPC分类号： H01L23/12 ,  H01L21/52 ,  H01L21/60 ,  H01L23/00 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H01L23/60 ,  H01L21/44

CPC分类号： H01L23/60 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： In a semiconductor device, a plurality of wiring films are formed on a front surface of a base comprising an insulating resin and having electrode-forming holes, the surfaces of the wiring films and the surface of the base being positioned on the same plane and at least parts of the wiring films overlapping with the electrode-forming holes; a conductive material is embedded into the electrode-forming holes to form external electrodes on the back surface, away from the wiring films, of the base; a semiconductor element is positioned on the front surface of the base with an insulating film therebetween, the back surface of the semiconductor element being bonded to said front surface of the base; wires bond the electrodes of the semiconductor element to the corresponding wiring films; and a resin seals the wiring films and the wires.

摘要翻译： 在半导体装置中，在包括绝缘树脂并具有电极形成孔的基底的前表面上形成多个布线膜，布线膜的表面和基底的表面位于同一平面上，并且在 布线膜的最少部分与电极形成孔重叠; 导电材料被嵌入到电极形成孔中，以在背面远离基底的布线膜形成外部电极; 半导体元件位于基座的前表面上，其间具有绝缘膜，半导体元件的背面接合到基座的前表面; 导线将半导体元件的电极连接到相应的布线膜上; 树脂密封布线膜和导线。

公开(公告)号：US06563202B1

公开(公告)日：2003-05-13

申请号：US09491444

申请日：2000-01-26

申请人： Kenji Ohsawa ,  Hidetoshi Kusano ,  Haruhiko Makino ,  Hideyuki Takahashi

发明人： Kenji Ohsawa ,  Hidetoshi Kusano ,  Haruhiko Makino ,  Hideyuki Takahashi

IPC分类号： H01L23495

CPC分类号： H01L21/4821 ,  H01L23/13 ,  H01L23/24 ,  H01L23/49816 ,  H01L2224/32245 ,  H01L2224/73269 ,  H01L2924/15311

摘要： Metal films (for instance, gold films or palladium films) to constitute bumps are formed on a metal base by electrolytic plating. Then, a circuit wiring including inner leads is formed by electrolytic plating with a metal so that the inner leads are connected to the respective metal films.

摘要翻译： 通过电解电镀在金属基体上形成构成凸块的金属膜（例如，金膜或钯膜）。 然后，通过用金属进行电解电镀形成包括内部引线的电路布线，使得内部引线连接到各个金属膜。

公开(公告)号：US06351025B1

公开(公告)日：2002-02-26

申请号：US09702457

申请日：2000-10-31

申请人： Kenji Ohsawa ,  Hidetoshi Kusano

发明人： Kenji Ohsawa ,  Hidetoshi Kusano

IPC分类号： H01L23495

CPC分类号： H01L23/49582 ,  H01L21/4828 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/485 ,  H01L23/49524 ,  H01L23/49531 ,  H01L23/49534 ,  H01L23/49572 ,  H01L24/48 ,  H01L2224/48095 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  Y10T29/49121 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： To enable readily forming the etching stop layer of a lead frame with multilayer structure by plating without using a large-scale device, enhance adhesive strength between the etching stop layer and an adjacent metal layer and prevent peeling caused by deterioration caused by the invasion of a chemical between the etching stop layer and each adjacent metal layer from occurring, an etching stop layer is formed by nickel or a nickel alloy in a method of manufacturing a lead frame at least provided with an etching process for selectively etching metal layers using an etching stop layer as an etching stopper in a state in which a thick metal layer is formed on one side of the etching stop layer as an intermediate layer and a thin metal layer is formed on the other side and a process for etching the etching stop layer using the metal layers on both sides as a mask.

公开(公告)号：US6078097A

公开(公告)日：2000-06-20

申请号：US787659

申请日：1997-01-21

申请人： Kenji Ohsawa

发明人： Kenji Ohsawa

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/24 ,  H01L23/495 ,  H01L23/50 ,  H05K1/16 ,  H05K3/00 ,  H05K3/46 ,  H01L23/48

CPC分类号： H01L23/24 ,  H01L23/49572 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181

摘要： In a lead frame, leads are formed on a surface of protective insulation film having a device hole. Protruding electrodes (solder balls) are formed on the surface of the leads opposite the surface closer to the protective insulation film. A reinforcement plate is also formed on the rear surface of the protective insulation film.

摘要翻译： 在引线框架中，在具有器件孔的保护绝缘膜的表面上形成引线。 突起电极（焊球）形成在与靠近保护绝缘膜的表面相对的引线的表面上。 加强板也形成在保护绝缘膜的后表面上。

公开(公告)号：US5982033A

公开(公告)日：1999-11-09

申请号：US850800

申请日：1997-05-02

申请人： Kenji Ohsawa ,  Makoto Ito

发明人： Kenji Ohsawa ,  Makoto Ito

IPC分类号： H01L23/12 ,  H01L23/495 ,  H05K3/20 ,  H05K3/34 ,  H01L23/48

CPC分类号： H01L24/50 ,  H01L23/49572 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K3/20 ,  H05K3/3473

摘要： According to a method of manufacturing a semiconductor package of the present invention, a plurality of leads and a large number of minute convex portions are respectively formed by plating on a surface of a metal base and in an outer peripheral area of the leads thereon. An insulative film for holding each of the leads is formed. A solder resist film is formed selectively on a portion including the outer peripheral area having the minute convex portions thereon. A projecting electrode is formed on an outer lead portion of each of the leads through an opening of the solder resist film on an outer lead portion of each of the leads. The metal base is selectively removed except a joint portion thereof on an outer periphery to separate the respective leads. Inner lead portions of the leads and a semiconductor chip are jointed together. The joint portion of the metal base is cut off.

摘要翻译： 根据本发明的半导体封装的制造方法，通过在金属基体的表面和引线的外周区域中电镀分别形成多个引线和大量微小的凸部。 形成用于保持每个引线的绝缘膜。 在包括其上具有微小凸部的外周区域的部分上选择性地形成阻焊膜。 通过每个引线的外引线部分上的阻焊膜的开口，在每个引线的外引线部分上形成突出电极。 选择性地除去金属基底，除了外围的接合部分以分离各个引线。 引线的内引线部分和半导体芯片接合在一起。 切断金属基座的接合部分。

公开(公告)号：US5901436A

公开(公告)日：1999-05-11

申请号：US730782

申请日：1996-10-16

申请人： Kenji Ohsawa ,  Makoto Ito

发明人： Kenji Ohsawa ,  Makoto Ito

IPC分类号： C23F1/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/50 ,  H01R43/00

CPC分类号： H01L21/4828 ,  Y10T29/49121

摘要： Leads are formed on a surface of an etching stop film of a base, and holes are defined in the base and a region of a substrate which corresponds to a lead-forming region is thinned by selective etching on both upper and lower surfaces of the base. A lead holder film having a device hole and an outer lead bonding slit is applied to the upper surface of the base. The thinned region of the substrate is removed by selective etching on the lower surface of the base, and the etching stop film is etched away.

摘要翻译： 引线形成在基底的蚀刻停止膜的表面上，并且在基底中限定孔，并且通过在基底的上表面和下表面上的选择性蚀刻使对应于引线形成区的基底的区域变薄 。 具有器件孔和外部引线接合狭缝的引线保持器膜被施加到基座的上表面。 通过在基底的下表面上的选择性蚀刻去除衬底的变薄区域，蚀刻掉蚀刻停止膜。

公开(公告)号：US5349238A

公开(公告)日：1994-09-20

申请号：US950659

申请日：1992-09-23

申请人： Kenji Ohsawa ,  Mutsumi Nagano ,  Akira Kojima ,  Hideyuki Takahashi

发明人： Kenji Ohsawa ,  Mutsumi Nagano ,  Akira Kojima ,  Hideyuki Takahashi

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/495 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52 ,  H01L29/60

CPC分类号： H01L21/4821 ,  H01L23/49524 ,  H01L24/50

摘要： Disclosed is a semiconductor device comprising a lead frame which includes a metal layer forming an outer lead, a thin metal layer forming an inner lead, an intermediate layer held between the thick metal layer and the thin metal layer for forming a connection portion between the outer lead and the inner lead and a bump positioned at the extreme end of the lead frame, whereby making the lead frame as an electrode leading means by directly connecting the bump to each electrode of a semiconductor element, wherein the lead formed of the thick metal layer has a thickness of 30 to 300 .mu.m, the lead formed of the thin metal layer has a thickness of 10 to 50 .mu.m, and the bump has thickness of 5 to 50 .mu.m.

摘要翻译： 公开了一种半导体器件，其包括引线框架，引线框架包括形成外部引线的金属层，形成内部引线的薄金属层，保持在厚金属层和薄金属层之间的中间层，用于形成外部引线之间的连接部分 引线和内引线和位于引线框架的末端的凸块，由此通过将凸块直接连接到半导体元件的每个电极来使引线框架作为电极引导装置，其中由厚金属层形成的引线 厚度为30〜300μm，由薄金属层形成的铅的厚度为10〜50μm，凸块的厚度为5〜50μm。

公开(公告)号：US08611089B2

公开(公告)日：2013-12-17

申请号：US12934996

申请日：2009-03-09

申请人： Kei Mizuta ,  Katsuya Tsuruta ,  Toshiaki Kotani ,  Kenji Ohsawa

发明人： Kei Mizuta ,  Katsuya Tsuruta ,  Toshiaki Kotani ,  Kenji Ohsawa

IPC分类号： H05K7/20

CPC分类号： H05K1/0272 ,  F28D15/0233 ,  F28D15/046 ,  H01L23/427 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/064 ,  Y10T29/4935 ,  H01L2924/00

摘要： A heat pipe for cooling an exothermic body by the vaporization and condensation of an enclosed cooling medium is disclosed. The heat pipe comprises a flat plate-like upper plate, a flat plate-like lower plate opposed to the upper plate, and a plurality of flat plate-like intermediate plates overlaid on each other between the upper plate and the lower plate and having internal through-holes. The internal through-holes formed in each of a plurality of the intermediate plates are adapted such that only part of each through-hole is overlapped on each other to form capillary tube paths, each having a cross-sectional area smaller than the cross-sectional area of the through-hole in the flat surface direction.

摘要翻译： 公开了一种通过封闭的冷却介质的蒸发和冷凝来冷却放热体的热管。 热管包括平板状的上板，与上板相对的平板状下板，以及在上板和下板之间彼此重叠的多个平板状中间板，并具有内部 通孔。 形成在多个中间板的每一个中的内部通孔适于使得每个通孔的仅一部分彼此重叠以形成毛细管路径，每个通孔的横截面积小于横截面积 通孔在平面方向的面积。

公开(公告)号：US08534348B2

公开(公告)日：2013-09-17

申请号：US10583504

申请日：2006-01-31

申请人： Kenji Ohsawa ,  Katsuya Tsuruta

发明人： Kenji Ohsawa ,  Katsuya Tsuruta

IPC分类号： H05K7/20

CPC分类号： F28D15/0233 ,  B23P15/26 ,  B23P2700/09 ,  F28D15/046 ,  F28F3/048 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  Y10T29/49366 ,  H01L2924/00

摘要： A thin and flat type heat pipe with enhanced conductivity. Between an upper member 22 having a rectangular area 24b on a lower surface and a lower member 20 having a rectangular area 24a on an upper area are provided intermediate plate members 32, 30. The members 32, 30 are each formed with slits 8, constructing a vapor path extending a planar direction, communicating with the rectangular areas 24a, 24b of the members 22, 20, respectively. Thus, a sealed space is defined by the slits 8 and the rectangular areas 24a, 24b so that a refrigerant is enclosed in the sealed space. Capillary holes 10 are formed through non-slitted portions of the intermediate plate members 32, 30 so that each capillary hole 10 serves as a capillary path of flow extending vertically to communicate with the rectangular areas 24a, 24b of the members 22, 20.

摘要翻译： 一种具有增强导电性的薄型扁平型热管。 在下表面具有矩形区域24b的上部构件22和在上部区域具有矩形区域24a的下部构件20之间设置有中间板构件32,30。构件32,30各自形成有狭缝8，构造 蒸汽路径，其延伸平面方向，分别与构件22,20的矩形区域24a，24b连通。 因此，由狭缝8和矩形区域24a，24b限定密封空间，使得制冷剂被封闭在密封空间中。 毛细孔10通过中间板构件32,30的非切口部分形成，使得每个毛细孔10用作垂直延伸的流动通道，以与构件22,20的矩形区域24a，24b连通。