公开(公告)号：US20130337654A1

公开(公告)日：2013-12-19

申请号：US13793278

申请日：2013-03-11

Applicant: LAM RESEARCH CORPORATION

Inventor： Roger Patrick ,  Gregory R. Bettencourt ,  Michael C. Kellogg

IPC: H01L21/3065

CPC classification number: H01L21/3065 ,  C23C16/45565 ,  C23C16/4557 ,  H01J37/32091 ,  H01J37/3244 ,  H01J37/32458 ,  H01J37/32532 ,  H01J37/32541 ,  H01J37/32568 ,  H01J37/32605 ,  Y10S403/12 ,  Y10S403/13

Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the electrode.

Abstract translation: 用于等离子体反应室的电极组件，用于半导体衬底处理。 该组件包括上部喷头电极，其通过一系列间隔开的凸轮锁定机械地附接到背板。 保护环围绕背板并且可移动到保护环中的开口与背板中的开口对准的位置，使得凸轮锁可以用工具旋转以释放从电极的上表面延伸的锁定销。

公开(公告)号：US20240266151A1

公开(公告)日：2024-08-08

申请号：US18617587

申请日：2024-03-26

Applicant: Lam Research Corporation

Inventor： Michael C. Kellogg ,  Adam Mace ,  Alexei Marakhtanov ,  John Holland ,  Zhigang Chen ,  Felix Kozakevich ,  Alexander Matyushkin

IPC: H01J37/32

CPC classification number: H01J37/32642

Abstract: Systems and methods for securing an edge ring to a support ring are described. The edge ring is secured to the support ring via multiple fasteners that are inserted into a bottom surface of the edge ring. The securing of the edge ring to the support ring provides stability of the edge ring during processing of a substrate within a plasma chamber. In addition, the securing of the edge ring to the support ring secures the edge ring to the plasma chamber because the support ring is secured to an insulator ring, which is connected to an insulator wall of the plasma chamber. Moreover, the support ring and the edge ring are pulled down vertically using one or more clasp mechanisms during the processing of the substrate and are pushed up vertically using the clasp mechanisms to remove the edge ring and the support ring from the plasma chamber.

公开(公告)号：US11195706B2

公开(公告)日：2021-12-07

申请号：US16384442

申请日：2019-04-15

Applicant: Lam Research Corporation

Inventor： Alexei Marakhtanov ,  Felix Kozakevich ,  Michael C. Kellogg ,  John Patrick Holland ,  Zhigang Chen ,  Kenneth Lucchesi ,  Lin Zhao

IPC: H01J37/32 ,  H01L21/3065 ,  H01L21/67 ,  H01L21/687

Abstract: Systems and methods for achieving a pre-determined factor associated with the edge region within the plasma chamber is described. One of the methods includes providing an RF signal to a main electrode within the plasma chamber. The RF signal is generated based on a frequency of operation of a first RF generator. The method further includes providing another RF signal to an edge electrode within the plasma chamber. The other RF signal is generated based on the frequency of operation of the first RF generator. The method includes receiving a first measurement of a variable, receiving a second measurement of the variable, and modifying a phase of the other RF signal based on the first measurement and the second measurement. The method includes changing a magnitude of a variable associated with a second RF generator to achieve the pre-determined factor.

公开(公告)号：US10557197B2

公开(公告)日：2020-02-11

申请号：US14884575

申请日：2015-10-15

Applicant: Lam Research Corporation

Inventor： Andrew C. Lee ,  Michael C. Kellogg ,  Christopher J. Pena ,  John E. Daugherty

IPC: C23C16/455 ,  B24B37/04 ,  C23C16/04

Abstract: A gas delivery substrate for mounting gas supply components of a gas delivery system for a semiconductor processing apparatus is provided. The substrate may include a plurality of layers having major surfaces thereof bonded together forming a laminate with openings for receiving and mounting first, second, third and fourth gas supply components on an outer major surface. The substrate may include a first gas channel extending across an interior major surface that at least partially overlaps a second gas channel extending across a different interior major surface. The substrate may include a first gas conduit including the first gas channel connecting the first gas supply component to the second gas supply component, and a second gas conduit including the second channel connecting the third gas supply component to the fourth gas supply component. Also disclosed are various techniques for manufacturing gas delivery substrates.

公开(公告)号：US10118263B2

公开(公告)日：2018-11-06

申请号：US14843775

申请日：2015-09-02

Applicant: Lam Research Corporation

Inventor： Michael C. Kellogg ,  Andrew C. Lee ,  Christopher J. Pena

IPC: B23P19/04 ,  B23P19/10 ,  B23P19/12 ,  H01L21/00 ,  H01L21/02

Abstract: Component-locating templates or masks for use with positioning fluid-flow components on monolithic ceramic substrates are provided, as well as techniques for the manufacture of such templates.

公开(公告)号：US10115568B2

公开(公告)日：2018-10-30

申请号：US15825021

申请日：2017-11-28

Applicant: Lam Research Corporation

Inventor： Michael C. Kellogg ,  Alexei Marakhtanov ,  John Patrick Holland ,  Zhigang Chen ,  Felix Kozakevich ,  Kenneth Lucchesi

IPC: H01J37/32 ,  H01J37/147

Abstract: Systems and methods for controlling directionality of ion flux at an edge region within a plasma chamber are described. One of the systems includes a radio frequency (RF) generator that is configured to generate an RF signal, an impedance matching circuit coupled to the RF generator for receiving the RF signal to generate a modified RF signal, and a plasma chamber. The plasma chamber includes an edge ring and a coupling ring located below the edge ring and coupled to the first impedance matching circuit to receive the modified RF signal. The coupling ring includes an electrode that generates a capacitance between the electrode and the edge ring to control the directionality of the ion flux upon receiving the modified RF signal.

公开(公告)号：US10049862B2

公开(公告)日：2018-08-14

申请号：US15068508

申请日：2016-03-11

Applicant: Lam Research Corporation

Inventor： Daniel Arthur Brown ,  John Patrick Holland ,  Michael C. Kellogg ,  James E. Tappan ,  Jerrel K. Antolik ,  Ian Kenworthy ,  Theo Panagopoulos ,  Zhigang Chen

IPC: H01J37/32

Abstract: A plasma chamber is provided to increase conductance within the plasma chamber and to increase uniformity of the conductance. A radio frequency (RF) path for supplying power to the plasma chamber is symmetric with respect to a center axis of the plasma chamber. Moreover, pumps used to remove materials from the plasma chamber are located symmetric with respect to the center axis. The symmetric arrangements of the RF paths and the pumps facilitate an increase in conductance uniformity within the plasma chamber.

公开(公告)号：US20180082822A1

公开(公告)日：2018-03-22

申请号：US15825021

申请日：2017-11-28

Applicant: Lam Research Corporation

Inventor： Michael C. Kellogg ,  Alexei Marakhtanov ,  John Patrick Holland ,  Zhigang Chen ,  Felix Kozakevich ,  Kenneth Lucchesi

IPC: H01J37/32 ,  H01J37/147

CPC classification number: H01J37/32155 ,  H01J37/1471 ,  H01J37/32091 ,  H01J37/32366 ,  H01J37/32642

Abstract: Systems and methods for controlling directionality of ion flux at an edge region within a plasma chamber are described. One of the systems includes a radio frequency (RF) generator that is configured to generate an RF signal, an impedance matching circuit coupled to the RF generator for receiving the RF signal to generate a modified RF signal, and a plasma chamber. The plasma chamber includes an edge ring and a coupling ring located below the edge ring and coupled to the first impedance matching circuit to receive the modified RF signal. The coupling ring includes an electrode that generates a capacitance between the electrode and the edge ring to control the directionality of the ion flux upon receiving the modified RF signal.

公开(公告)号：US20170057028A1

公开(公告)日：2017-03-02

申请号：US14843775

申请日：2015-09-02

Applicant: Lam Research Corporation

Inventor： Michael C. Kellogg ,  Andrew C. Lee ,  Christopher J. Pena

IPC: B23P19/10

CPC classification number: B23P19/10 ,  B23P19/04 ,  B23P19/12 ,  H01L21/00 ,  H01L21/02 ,  Y10T29/49895 ,  Y10T29/49899 ,  Y10T29/49902

Abstract: Component-locating templates or masks for use with positioning fluid-flow components on monolithic ceramic substrates are provided, as well as techniques for the manufacture of such templates.

Abstract translation: 提供了用于在单片陶瓷基板上定位流体流动组件的组件定位模板或掩模，以及用于制造这种模板的技术。

公开(公告)号：US20160307743A1

公开(公告)日：2016-10-20

申请号：US15068508

申请日：2016-03-11

Applicant: Lam Research Corporation

Inventor： Daniel Arthur Brown ,  John Patrick Holland ,  Michael C. Kellogg ,  James E. Tappan ,  Jerrel K. Antolik ,  Ian Kenworthy ,  Theo Panagopoulos ,  Zhigang Chen

IPC: H01J37/32

CPC classification number: H01J37/32816 ,  H01J37/32082 ,  H01J37/32183 ,  H01J37/32651 ,  H01J37/32724

Abstract: A plasma chamber is provided to increase conductance within the plasma chamber and to increase uniformity of the conductance. A radio frequency (RF) path for supplying power to the plasma chamber is symmetric with respect to a center axis of the plasma chamber. Moreover, pumps used to remove materials from the plasma chamber are located symmetric with respect to the center axis. The symmetric arrangements of the RF paths and the pumps facilitate an increase in conductance uniformity within the plasma chamber.

Abstract translation: 提供等离子体室以增加等离子体室内的电导并增加电导的均匀性。 用于向等离子体室供电的射频（RF）路径相对于等离子体室的中心轴对称。 此外，用于从等离子体室移除材料的泵相对于中心轴线对称。 RF路径和泵的对称布置有助于提高等离子体室内的电导均匀性。