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公开(公告)号：US20240030201A1
公开(公告)日：2024-01-25
申请号：US18477747
申请日：2023-09-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takanori UEJIMA , Hiromichi KITAJIMA , Kiyoshi AIKAWA , Yoshihiro DAIMON , Takashi YAMADA
CPC classification number: H01L25/162 , H04B1/38
Abstract: A radio frequency module includes a first module substrate that has a first main surface facing a second main surface, a second module substrate that has a third main surface facing a fourth main surface, the third main surface facing the second main surface, multiple electronic components that are disposed between the second main surface and the third main surface, on or along the first main surface, and on or along the fourth main surface, and a LC component that is disposed in the module substrate and that is an inductor or a capacitor. A relative dielectric constant of the module substrate is higher than a relative dielectric constant of the module substrate.
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公开(公告)号：US20240030166A1
公开(公告)日：2024-01-25
申请号：US18477798
申请日：2023-09-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi KITAJIMA , Takanori UEJIMA , Kiyoshi AIKAWA , Yoshihiro DAIMON , Takashi YAMADA
CPC classification number: H01L23/66 , H04B1/525 , H01L24/16 , H03F3/213 , H03F1/565 , H01L23/293 , H01L25/0652 , H03F2200/294 , H03F2200/451 , H01L2223/6677 , H01L2223/6655 , H01L2223/6672 , H01L2224/16155 , H01L2224/16225 , H01L2924/14215 , H01L2924/1205 , H01L2924/1206
Abstract: A radio-frequency module includes a module substrate having major surfaces opposite to each other; a module substrate having major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component including a filter coupled to a power amplifier via a switch; a second electronic component including a filter coupled to the power amplifier via the switch; and a third electronic component including the switch. The first electronic component is disposed one of between the major surfaces, on the major surface, and on the major surface. The second electronic component is disposed another one of between the major surfaces, on the major surface, and on the major surface. The third electronic component is disposed other one of between the major surfaces, on the major surface, and on the major surface.
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公开(公告)号：US20240015914A1
公开(公告)日：2024-01-11
申请号：US18473336
申请日：2023-09-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yoshihiro DAIMON , Takashi YAMADA , Hiromichi KITAJIMA , Kiyoshi AIKAWA , Takanori UEJIMA
CPC classification number: H05K7/026 , H05K7/1427 , H05K1/181 , H05K1/0237 , H05K1/144 , H05K7/209 , H03F3/245
Abstract: A radio-frequency module includes a module substrate having major surfaces; a module substrate having major surfaces, the major surface being disposed facing the major surface; and plural electronic components disposed between the major surfaces, on the major surface, and on the major surface. The plural electronic components include: a first electronic component including the power amplifier; a second electronic component including a low-noise amplifier; a switch that switches connection and disconnection between a first filter and the power amplifier; and a third electronic component including a PA controller to control the power amplifier or a switch controller to control the switch. The first to third electronic components are separately disposed on the major surface, between the major surfaces, and on the major surface.
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公开(公告)号：US20240014834A1
公开(公告)日：2024-01-11
申请号：US18474279
申请日：2023-09-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kiyoshi AIKAWA , Hiromichi KITAJIMA , Takashi YAMADA , Yoshihiro DAIMON , Takanori UEJIMA
CPC classification number: H04B1/036 , H04B1/0078
Abstract: A radio frequency module includes a module substrate having a first main surface facing a second main surface, and a module substrate having a third main surface facing a fourth main surface. The third main surface faces the second main surface. Multiple electronic components, including a power amplifier, are disposed between the second and third main surfaces on the first main surface, and on the fourth main surface. Multiple external connection terminals are disposed on the third main surface. The power amplifier has a fifth main surface facing a sixth main surface and includes a circuit portion formed nearer to the fifth main surface than the sixth main surface and includes an amplifier transistor. in the power amplifier, the fifth main surface faces the third main surface, and the sixth main surface faces the second main surface. A heat dissipation conductor is joined to the main surface.
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公开(公告)号：US20230261682A1
公开(公告)日：2023-08-17
申请号：US18303621
申请日：2023-04-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takanori UEJIMA , Hiromichi KITAJIMA
CPC classification number: H04B1/18 , H04B1/1607
Abstract: A radio frequency module includes a module substrate having a first principal surface and a second principal surface, a resin member covering the first principal surface and side surfaces of first and second components disposed on the first principal surface, a metal shield layer covering an upper surface of the resin member, a metal shield wall disposed on the first principal surface, a metal member disposed on the second principal surface, and a via conductor penetrating the module substrate. The metal shield wall is disposed between the first component and the second component when the first principal surface is viewed in plan. An upper end of the metal shield wall is connected to the metal shield layer. The via conductor electrically connects the metal shield wall and the metal member, and at least partially overlaps each of the metal shield wall and the metal member when viewed in plan.
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Patent Agency Ranking
公开(公告)号：US20230198556A1
公开(公告)日：2023-06-22
申请号：US18168682
申请日：2023-02-14
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takanori UEJIMA , Hiromichi KITAJIMA , Naoya MATSUMOTO , Hisanori MURASE , Nanami YUMURA , Yoichi SAWADA
CPC classification number: H04B1/03 , H04B1/18 , H04B1/04 , H04B2001/0408
Abstract: A radio-frequency module includes: a module substrate having a major face; a first circuit component and a second circuit component that are disposed over the major face; a resin component that covers the first circuit component and the second circuit component; a metal shield layer that covers a surface of the resin component; a metal shield plate that is disposed over the major face and, with the module substrate seen in plan view, located between the first circuit component and the second circuit component; and a via-conductor disposed in the module substrate and set to a ground potential. The metal shield plate is in contact with the metal shield layer, and connected at the major face with the via-conductor. The metal shield plate has a thickness greater than a thickness of the metal shield layer and less than or equal to an outside diameter (of the via-conductor.
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公开(公告)号：US20160057862A1
公开(公告)日：2016-02-25
申请号：US14933268
申请日：2015-11-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi KITAJIMA
CPC classification number: H05K1/116 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/50 , H01L23/66 , H01L2223/6666 , H01L2223/6677 , H01L2224/16225 , H01L2224/73204 , H01L2924/1305 , H01L2924/15311 , H04M1/0202 , H05K1/0298 , H05K1/09 , H05K1/113 , H05K1/114 , H05K3/244 , H05K3/4611 , H05K2201/09781 , H05K2201/10015 , H05K2201/1003 , H05K2201/10098 , H01L2924/00
Abstract: A method reduces an area of a mounting electrode provided on a first surface of a multilayer body and connected to a specific component is reduced and decreases a pitch between mounting electrodes. A plating film is formed on the mounting electrodes with the reduced area. The mounting electrodes for connection to specific components are defined by first end surfaces of first via conductors, and hence, the areas of the mounting electrodes are significantly reduced, and the pitch between the mounting electrodes is significantly decreased. Also, the mounting electrodes defined by the first end surfaces of the first via conductors are connected to plane electrodes at end surfaces of second via conductors exposed from a surface of the multilayer body with internal wiring electrodes interposed therebetween. Thus, a plating film is able to be reliably provided on the mounting electrodes.
Abstract translation: 一种减小设置在多层体的第一表面上并连接到特定部件的安装电极的面积减小并减小安装电极之间的间距。 在安装电极上形成有减薄面积的镀膜。 用于连接到特定部件的安装电极由第一通孔导体的第一端表面限定，因此，安装电极的面积显着减小，并且安装电极之间的间距显着降低。 此外，由第一通孔导体的第一端面限定的安装电极在其间插入有内部布线电极的多层体的表面露出的第二通孔导体的端面处连接到平面电极。 因此，能够可靠地在安装电极上设置电镀膜。
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公开(公告)号：US20150216033A1
公开(公告)日：2015-07-30
申请号：US14489555
申请日：2014-09-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi KITAJIMA
CPC classification number: H05K1/0216 , H01P3/16 , H04M1/026 , H05K1/0218 , H05K1/024 , H05K1/0242 , H05K1/0243 , H05K1/181 , H05K2201/09327
Abstract: A high frequency module includes a ground mounting electrode connected to a ground terminal of a component, a first ground in-plane conductor in a multilayer substrate on a portion under the component and connected to the ground mounting electrode with a first ground interlayer connecting conductor, a signal mounting electrode connected to a signal terminal of the component, and a signal in-plane conductor provided in the multilayer substrate on a portion under the first ground in-plane conductor and connected to the specific signal mounting electrode with a signal interlayer connecting conductor. The first ground in-plane conductor is between the component and the signal in-plane conductor, and the signal interlayer connecting conductor is on an outer side portion of the first ground in-plane conductor when seen from above.
Abstract translation: 高频模块包括连接到部件的接地端子的接地安装电极，在部件下方的多个基板中的第一接地面内导体，并且与第一接地层间连接导体连接到接地安装电极， 连接到部件的信号端子的信号安装电极，以及设置在第一接地面内导体下的部分上的多层基板中的信号面内导体，并且与信号层间连接导体连接到特定信号安装电极 。 第一接地面内导体位于组件和信号面内导体之间，并且当从上方观察时，信号层间连接导体位于第一接地面内导体的外侧部分。
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公开(公告)号：US20240057247A1
公开(公告)日：2024-02-15
申请号：US18493069
申请日：2023-10-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takanori UEJIMA , Hiromichi KITAJIMA , Dai NAKAGAWA
CPC classification number: H05K1/0219 , H05K1/0206 , H05K3/28 , H05K2201/1006 , H05K2201/10098 , H05K2201/10053
Abstract: A high-frequency module includes a mounting board, a first electronic component, a first resin layer, and a first ground electrode. The mounting board has a first principal surface and a second principal surface facing each other. The first electronic component is disposed on the first principal surface of the mounting board. The first resin layer is disposed on the first principal surface of the mounting board, and covers at least a part of an outer peripheral surface of the first electronic component. The first ground electrode covers at least a part of the first resin layer. A principal surface of the first electronic component opposite to the mounting board is connected to the first ground electrode. The mounting board includes a second ground electrode inside the mounting board. The first ground electrode is connected to the second ground electrode.
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公开(公告)号：US20240030956A1
公开(公告)日：2024-01-25
申请号：US18474289
申请日：2023-09-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi KITAJIMA , Takanori UEJIMA , Kiyoshi AIKAWA , Yoshihiro DAIMON , Takashi YAMADA
CPC classification number: H04B1/38 , H03H9/25 , H01Q1/38 , H01Q1/2283 , H01Q15/24 , H01Q1/2208
Abstract: A radio-frequency module includes: plural electronic components that include plural bare SAW devices and that are disposed between a major surface of a module substrate and a major surface of a module substrate, on a major surface of the module substrate, and on a major surface of the module substrate; plural external connection terminals disposed on the major surface; and resin members. The resin member covers the plural SAW devices but does not fill between central regions of the plural bare SAW devices in which the IDT electrodes are disposed and the major surface to which plural bump electrodes are joined. The plural bare SAW devices are disposed on the major surface, and no bare SAW devices are disposed between the major surfaces and on the major surface.
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