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公开(公告)号：US20090308650A1
公开(公告)日：2009-12-17
申请号：US12222176
申请日：2008-08-04
申请人： Eung Suek Lee , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jun Heyoung Park , Jee Soo Mok
发明人： Eung Suek Lee , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jun Heyoung Park , Jee Soo Mok
CPC分类号： H05K3/4069 , B82Y10/00 , H05K3/1291 , H05K3/4647 , H05K2201/026 , H05K2201/0323 , H05K2201/0355 , H05K2201/09827 , H05K2203/1126 , Y10T29/49155
摘要： The printed circuit board is manufactured using a simple process of forming a bump on a first metal layer using fireable paste containing carbon nanotubes, firing the first metal layer including the bump, forming an insulating layer and a second metal layer on the first metal layer, and patterning the first and second metal layers, thus specific resistance of the resulting printed circuit board is decreased, and electrical conductivity and cooling performance are improved.
摘要翻译： 使用在含有碳纳米管的可燃性糊料在第一金属层上形成凸块的方法，在第一金属层上焙烧包括凸块的第一金属层，形成绝缘层和第二金属层，制造印刷电路板， 并且对第一和第二金属层进行图案化，由此降低了印刷电路板的电阻率，提高了导电性和冷却性能。
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12.发明授权公开(公告)号：US08377748B2
公开(公告)日：2013-02-19
申请号：US13137669
申请日：2011-09-01
申请人： Eung Suek Lee , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jun Heyoung Park , Jee Soo Mok
发明人： Eung Suek Lee , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jun Heyoung Park , Jee Soo Mok
IPC分类号： H01L23/467
CPC分类号： H01L23/373 , B82Y30/00 , C04B35/80 , C04B2235/3217 , C04B2235/3418 , C04B2235/407 , C04B2235/408 , C04B2235/5288 , F28F3/02 , F28F21/02 , H01L24/48 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/15311 , H01L2924/1815 , H01L2924/3025 , Y10T29/49002 , Y10T29/4935 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object.
摘要翻译： 一种冷却翅片和封装基板的制造方法，其特征在于，包括：准备模具，所述模具具有支撑基体和树脂层，所述支撑基部和树脂层形成在所述支撑基部上，并且在其一侧包括凹槽，所述凹槽被构造成形成冷却翅片; 在所述模具的侧面上印刷含有碳成分的可燃性糊料，所述成型体具有形成冷却翅片的所述凹槽; 移除支撑底座以留下冷却物体; 并发射冷却对象。
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公开(公告)号：US20120222299A1
公开(公告)日：2012-09-06
申请号：US13474388
申请日：2012-05-17
申请人： Jee Soo MOK , Je Gwang Yoo , Chang Sup Ryu
发明人： Jee Soo MOK , Je Gwang Yoo , Chang Sup Ryu
IPC分类号： H05K3/10
CPC分类号： H05K3/4069 , H05K3/06 , H05K3/107 , H05K3/28 , H05K3/4647 , H05K2201/0355 , H05K2201/0376 , H05K2201/09481 , H05K2203/0278 , H05K2203/1461 , Y10T29/49144 , Y10T29/49155
摘要： A printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The printed circuit board is made slim, and reliability and the degree of design freedom are increased.
摘要翻译： 一种印刷电路板和印刷电路板的制造方法，其中印刷电路板包括绝缘层，嵌入绝缘层中的电路层，并且具有嵌入在绝缘层中的连接焊盘，使得 所述连接垫与所述绝缘层的表面齐平，以及被配置为保护所述电路层免受外部环境并且具有所述连接焊盘暴露的开口的绝缘材料。 印刷电路板变薄，可靠性和设计自由度提高。
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公开(公告)号：US20120005894A1
公开(公告)日：2012-01-12
申请号：US13137934
申请日：2011-09-21
申请人： Jee Soo Mok , Je Gwang Yoo , Chang Sup Ryu
发明人： Jee Soo Mok , Je Gwang Yoo , Chang Sup Ryu
CPC分类号： H05K3/1258 , H01L2224/11 , H05K3/4069 , H05K3/4602 , H05K2201/0394 , H05K2201/09481 , H05K2201/09545 , H05K2201/096 , H05K2203/0568 , H05K2203/1152 , Y10T29/49156
摘要： A method of manufacturing a multilayered circuit board, including: providing a double-sided copper clad laminate including via holes formed therethrough and openings for forming circuit patterns, formed by patterning copper foil formed on one side thereof; filling the via holes and the openings with conductive paste; removing the copper foil from the double-sided copper clad laminate to form a first circuit layer including circuit patterns on one side thereof and to form a second circuit layer including connecting pads for attaching solder balls thereto on the other side thereof; forming a build-up layer on the first circuit layer, the build-up layer including a plurality of insulating layers and a plurality of circuit layers; and forming a solder resist layer on an outermost layer of the build-up layer.
摘要翻译： 一种制造多层电路板的方法，包括：提供一种双面铜箔层压板，其包括形成的通孔和用于形成电路图案的开口，其形成在其一侧形成的铜箔; 用导电浆填充通孔和开孔; 从双面覆铜层压板上除去铜箔，以形成包括其一侧上的电路图案的第一电路层，并形成第二电路层，该第二电路层包括在其另一侧上附着焊球的连接焊盘; 在第一电路层上形成堆积层，所述堆积层包括多个绝缘层和多个电路层; 以及在积层层的最外层上形成阻焊层。
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15.发明申请公开(公告)号：US20090250259A1
公开(公告)日：2009-10-08
申请号：US12216435
申请日：2008-07-03
申请人： Jee Soo Mok , Je Gwang Yoo , Chang Sup Ryu
发明人： Jee Soo Mok , Je Gwang Yoo , Chang Sup Ryu
CPC分类号： H05K3/4007 , H01R12/523 , H05K3/0017 , H05K3/207 , H05K3/4644 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2201/096 , H05K2203/016 , H05K2203/1536
摘要： Disclosed herein is a multilayered printed circuit board, including: a build-up layer including a plurality of insulating layers and a plurality of circuit layers; an insulating resin layer, including bumps, formed on the outermost circuit layer of one side of the build-up layer; and a solder resist layer formed on the outermost layer of the other side of the build-up layer. The multilayered printed circuit board is manufactured by sequentially placing a build-up layer and a solder resist layer on one side of an insulating resin layer, the other side of which is provided with bumps. The present invention is advantageous in that the thickness of the multilayered printed circuit board is decreased, the production processes thereof is simplified, and the production efficiency is increased.
摘要翻译： 本文公开了一种多层印刷电路板，包括：包括多个绝缘层和多个电路层的堆积层; 包含凸起的绝缘树脂层，形成在构成层一侧的最外层电路层上; 以及形成在积层的另一侧的最外层上的阻焊层。 多层印刷电路板通过在绝缘树脂层的一侧依次放置积层和阻焊层，另一侧设置有凸块来制造。 本发明的优点在于，多层印刷电路板的厚度减小，其制造工艺简化，生产效率提高。
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公开(公告)号：US20100230146A1
公开(公告)日：2010-09-16
申请号：US12544959
申请日：2009-08-20
申请人： Eung Suek LEE , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jee Soo Mok
发明人： Eung Suek LEE , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jee Soo Mok
CPC分类号： H05K3/108 , B82Y10/00 , C23C18/38 , C25D5/022 , C25D5/10 , C25D9/08 , H05K3/249 , H05K2201/026 , H05K2201/0347 , H05K2203/135
摘要： Disclosed herein is a circuit layer including CNTs including an electroless copper plating layer formed on an insulating layer, and a CNT layer deposited on the electroless copper plating layer, thus the circuit layer has excellent electrical properties.
摘要翻译： 本发明公开了一种电路层，其包括在绝缘层上形成的化学镀铜层的CNT和沉积在化学镀铜层上的CNT层，因此电路层具有优异的电性能。
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17.发明申请公开(公告)号：US20090236131A1
公开(公告)日：2009-09-24
申请号：US12222055
申请日：2008-07-31
申请人： Jee Soo Mok , Je Gwang Yoo , Chang Sup Ryu
发明人： Jee Soo Mok , Je Gwang Yoo , Chang Sup Ryu
CPC分类号： H05K3/1258 , H01L2224/11 , H05K3/4069 , H05K3/4602 , H05K2201/0394 , H05K2201/09481 , H05K2201/09545 , H05K2201/096 , H05K2203/0568 , H05K2203/1152 , Y10T29/49156
摘要： Disclosed herein is a multilayered circuit board, including: a multilayered printed circuit board manufactured using the method includes an insulating resin layer having via holes, on one side of which a first circuit layer including circuit patterns is formed, and on the other side of which a second circuit layer, including connecting pads, is formed, the pads protruding over the via holes; a build-up layer formed on the first circuit layer, the build-up layer including a plurality of insulating layers and a plurality of circuit layers; and a solder resist layer formed on an outermost layer of the build-up layer.
摘要翻译： 本文公开了一种多层电路板，包括：使用该方法制造的多层印刷电路板，包括具有通孔的绝缘树脂层，其一侧形成有包括电路图案的第一电路层，另一侧 形成包括连接焊盘的第二电路层，焊盘在通孔上方突出; 形成在所述第一电路层上的积聚层，所述堆积层包括多个绝缘层和多个电路层; 以及形成在积层层的最外层上的阻焊层。
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公开(公告)号：US08592135B2
公开(公告)日：2013-11-26
申请号：US13403380
申请日：2012-02-23
申请人： Jee Soo Mok , Je Gwang Yoo , Eung Suek Lee , Chang Sup Ryu
发明人： Jee Soo Mok , Je Gwang Yoo , Eung Suek Lee , Chang Sup Ryu
IPC分类号： G03F7/26
CPC分类号： H05K3/4007 , B82Y10/00 , H05K1/095 , H05K2201/026 , H05K2201/0367 , H05K2203/0514
摘要： A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps.
摘要翻译： 一种制造印刷电路板的方法，包括：在具有用于传送电信号的电路层的电路基板的凸起形成区域上涂覆包括碳纳米管和感光性粘合剂的导电浆料; 并图案化导电膏，从而形成凸块。
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公开(公告)号：US20120148960A1
公开(公告)日：2012-06-14
申请号：US13403380
申请日：2012-02-23
申请人： Jee Soo Mok , Je Gwang Yoo , Eung Suek Lee , Chang Sup Ryu
发明人： Jee Soo Mok , Je Gwang Yoo , Eung Suek Lee , Chang Sup Ryu
CPC分类号： H05K3/4007 , B82Y10/00 , H05K1/095 , H05K2201/026 , H05K2201/0367 , H05K2203/0514
摘要： A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps.
摘要翻译： 一种制造印刷电路板的方法，包括：在具有用于传送电信号的电路层的电路基板的凸起形成区域上涂覆包括碳纳米管和感光性粘合剂的导电浆料; 并图案化导电膏，从而形成凸块。
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公开(公告)号：US08198550B2
公开(公告)日：2012-06-12
申请号：US12385003
申请日：2009-03-27
申请人： Jee Soo Mok , Je Gwang Yoo , Chang Sup Ryu
发明人： Jee Soo Mok , Je Gwang Yoo , Chang Sup Ryu
IPC分类号： H01R12/04
CPC分类号： H05K3/4069 , H05K3/06 , H05K3/107 , H05K3/28 , H05K3/4647 , H05K2201/0355 , H05K2201/0376 , H05K2201/09481 , H05K2203/0278 , H05K2203/1461 , Y10T29/49144 , Y10T29/49155
摘要： A printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The manufacturing process includes a step of pressing the circuit layer and the insulating material into the insulating layer to form a level surface while leaving the connection pads flush at the surface. The method makes the printed circuit board slim, and increases reliability and the degree of design freedom.
摘要翻译： 一种印刷电路板和印刷电路板的制造方法，其中印刷电路板包括绝缘层，嵌入绝缘层中的电路层，并且具有嵌入在绝缘层中的连接焊盘，使得 所述连接垫与所述绝缘层的表面齐平，以及被配置为保护所述电路层免受外部环境并且具有所述连接焊盘暴露的开口的绝缘材料。 该制造方法包括将电路层和绝缘材料压入绝缘层中以形成水平表面，同时使连接垫在表面平齐的步骤。 该方法使印刷电路板变薄，提高了可靠性和设计自由度。
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