公开(公告)号：US20150321347A1

公开(公告)日：2015-11-12

申请号：US14647366

申请日：2013-11-26

Applicant: TAZMO CO., LTD. ,  NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY

Inventor： Kenji HIROTA ,  Shinichi IMAI ,  Shiro HARA ,  Hitoshi MAEKAWA

IPC: B25J9/10 ,  B25J18/04

CPC classification number: B25J9/106 ,  B25J9/104 ,  B25J9/1065 ,  B25J18/02 ,  B25J18/04 ,  H01L21/67706

Abstract: The present invention provides a transfer robot which has a simple structure and a small occupied area in an operation.A transfer robot of the present invention includes a support member fixed to a side wall or the like, a transfer arm by which a hand member is held capable of linear movement, and first and second link members. One end portions of the first and second link members are rotatably linked to the support member, respectively. Another end portions of the first and second link members are rotatably linked to the transfer arm, respectively. The hand member holds/transfers a work. A rotational driving force applied to a linking portion between the support member and the first link member is transmitted to the transfer arm by a predetermined mechanism and linearly moves the hand member. The transfer arm moves by rotating the first link member or the second link member.

Abstract translation: 本发明提供一种操作简单，占用面积小的传送机器人。 本发明的传送机器人包括：固定到侧壁等的支撑构件，能够保持直线运动的手部构件的传送臂以及第一和第二连杆构件。 第一和第二连杆构件的一个端部分别可旋转地连接到支撑构件。 第一和第二连杆构件的另一个端部分别可旋转地连接到传送臂。 手部会员持有/转移作品。 施加到支撑构件和第一连杆构件之间的连接部分的旋转驱动力通过预定机构传递到传送臂，并直线地移动手构件。 传送臂通过旋转第一连杆构件或第二连杆构件而移动。

公开(公告)号：US20150170948A1

公开(公告)日：2015-06-18

申请号：US14625508

申请日：2015-02-18

Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (AIST)

Inventor： Shiro HARA ,  Hitoshi MAEKAWA

IPC: H01L21/677

CPC classification number: H01L21/67742 ,  A47B47/0091 ,  A47B81/00 ,  B65D51/28 ,  B65D2313/04 ,  H01L21/67379 ,  H01L21/6773 ,  H01L21/67745 ,  H01L21/67751 ,  H01L21/67772 ,  H01L21/67775

Abstract: A transfer box has a sealing structure hermetically sealable by means of tight coupling of a transfer box body and a transfer box door. The transfer box is structured in such a way that magnets on the transfer box body face magnetic bodies on the transfer box door when the transfer box door is closed on the transfer box body, with these magnets and magnetic bodies forming a magnetic closed circuit.

Abstract translation: 传送箱具有密封结构，其通过传送箱主体和传送箱门的紧密连接而可气密地密封。 传送箱的结构使得当传送箱门关闭在传送箱体上时，传送箱体上的磁体面对传送箱门上的磁体，这些磁体和磁体形成磁闭合电路。

公开(公告)号：US20140154958A1

公开(公告)日：2014-06-05

申请号：US14096226

申请日：2013-12-04

Applicant: National Institute of Advanced Industrial Science and Technology ,  Fujikoshi Machinery Corp.

Inventor： Yoshio NAKAMURA ,  Yoshio OTSUKA ,  Takashi OKUBO ,  Kazutaka SHIBUYA ,  Takayuki FUSE ,  Shiro HARA ,  Sommawan KHUMPUANG ,  Shinichi IKEDA

IPC: B24B7/22 ,  B24B37/16 ,  B24B53/017

CPC classification number: B24B7/228 ,  B24B37/105 ,  B24B37/16 ,  B24B37/26 ,  B24B37/30 ,  B24B37/345 ,  B24B53/017

Abstract: The wafer polishing apparatus comprises a polishing plate, a polishing head capable of holding a wafer, and a slurry supplying section. The polishing plate includes: a plurality of concentric polishing zones, each of which has a prescribed width for polishing the wafer and on each of which a polishing cloth is adhered; and a groove for discharging slurry being formed between the polishing zones. A head cleaning section, which cleans the polishing head, or a wafer cleaning section, which cleans the polished wafer, is provided to a center part of the polishing plate and located on the inner side of the innermost polishing zone.

Abstract translation: 晶片抛光装置包括抛光板，能够保持晶片的抛光头和浆料供应部分。 抛光板包括：多个同心抛光区，每个同心抛光区具有用于抛光晶片的规定宽度，并且其中每个抛光区附着有抛光布; 以及用于在抛光区之间形成的用于排出浆料的槽。 清洗抛光头的清洁部分或清洁抛光晶片的晶片清洁部分设置在抛光板的中心部分并位于最内侧抛光区的内侧。

公开(公告)号：US20140154870A1

公开(公告)日：2014-06-05

申请号：US14087883

申请日：2013-11-22

Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY ,  Fujikoshi Machinery Corp.

Inventor： Yoshio NAKAMURA ,  Daizo ICHIKAWA ,  Haruo SUMIZAWA ,  Shiro HARA ,  Sommawan KHUMPUANG ,  Shinichi IKEDA

IPC: H01L21/78

CPC classification number: H01L21/78 ,  H01L21/02005 ,  H01L21/02008

Abstract: A method of manufacturing semiconductor wafers is provided which facilitates formation of orientation flat lines and allows beveling work without problems.The method of manufacturing semiconductor wafers according to the present invention is a method of manufacturing semiconductor wafers, in which a plurality of small-diameter wafers is cut out from a large-diameter semiconductor wafer, the method including: a marking step of forming straight groove-like orientation flat lines by a laser beam so as to cross the respective small-diameter wafers in each row in the large-diameter semiconductor wafer, wherein cutout positions of the small-diameter wafers are aligned in rows in a specific direction, collectively for each of the rows; and a cutting step of cutting out the small-diameter wafers separately from the large-diameter semiconductor wafer by a laser beam after the marking step.

Abstract translation: 提供了制造半导体晶片的方法，其有助于形成取向平线，并且允许斜切加工没有问题。 根据本发明的制造半导体晶片的方法是一种半导体晶片的制造方法，其中从大直径半导体晶片切出多个小直径晶片，该方法包括：标记步骤，形成直槽 通过激光束的方位扁平线与大直径半导体晶片中的每一行中的各个小直径晶片交叉，其中小直径晶片的切割位置沿特定方向排成一行，共同为 每行 以及在标记步骤之后通过激光束与大直径半导体晶片分开切割小直径晶片的切割步骤。

公开(公告)号：US20170330741A1

公开(公告)日：2017-11-16

申请号：US15531237

申请日：2015-11-16

Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY

Inventor： Michihiro INOUE ,  Shiro HARA ,  Fumito IMURA ,  Arami SARUWATARI ,  Sommawan KHUMPUANG

IPC: H01L21/02 ,  H01L21/677 ,  H01L21/673 ,  H01L23/544

CPC classification number: H01L21/02 ,  H01L21/6734 ,  H01L21/6773 ,  H01L21/67736 ,  H01L23/544 ,  H01L24/19 ,  H01L24/20 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244

Abstract: A semiconductor manufacturing system has a series of steps, from manufacturing of a semiconductor on a wafer until packaging, that can be easily linked. A semiconductor chip manufacturing device manufactures a semiconductor chip, and a semiconductor packaging device packages the semiconductor chip by attaching the semiconductor chip to a package substrate which is larger than the wafer. The semiconductor chip manufacturing device includes a PLAD system for loading the wafer into and out of the semiconductor chip manufacturing device through a shuttle which is capable of housing the wafer. The semiconductor packaging device includes a PLAD system capable of loading the package substrate into and out of the semiconductor packaging device through a shuttle which is capable of housing the package substrate. The shuttles have container bodies of a same shape.

公开(公告)号：US20170098557A1

公开(公告)日：2017-04-06

申请号：US15126087

申请日：2015-03-10

Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY ,  DESIGN NETWORK CO., LTD.

Inventor： Yoshiki SHIMIZU ,  Shiro HARA ,  Hiroyuki TANAKA ,  Shizuka NAKANO ,  Hisato OGISO ,  Sommawan KHUMPUANG ,  Shinji FUTAGAWA ,  Hideaki YOSHIOKA ,  Takahiro FUKUDA ,  Yoshinori UCHIYAMA

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/3065

CPC classification number: H01L21/67069 ,  H01J37/32082 ,  H01J37/32192 ,  H01J37/32715 ,  H01J2237/334 ,  H01L21/3065 ,  H01L21/6719

Abstract: To provide a plasma device that all functions required for a plasma etching process are incorporated into a narrow space of a minimal fabrication manufacturing device. A plasma processing chamber for performing the plasma etching process on a semiconductor wafer is provided, and a micro-plasma supply section and a lower electrode that superimposes RF on supplied micro-plasma are provided in the plasma processing chamber. A wafer support device that supports the semiconductor wafer supports the semiconductor wafer in the plasma processing chamber during the etching process. The wafer support device is coupled to and supported by a drive section that is arranged outside the plasma processing chamber. The drive section makes the wafer support device repetitively move scanningly in the plasma processing chamber in parallel with a wafer processing surface during the etching process.

公开(公告)号：US20170072438A1

公开(公告)日：2017-03-16

申请号：US15260691

申请日：2016-09-09

Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY ,  LITHO TECH JAPAN CORPORATION ,  ORIENTAL MOTOR CO., LTD.

Inventor： Shuuji OKUDA ,  Sommawan KHUMPUANG ,  Shiro HARA ,  Sho TAKEUCHI ,  Yoshihisa SENSU ,  Takahiro ITO

IPC: B08B5/02 ,  H01L21/02

CPC classification number: B08B5/02 ,  B08B15/00 ,  H01L21/67017 ,  H01L21/6715

Abstract: A columnar laminar flow generation device includes: a placement part on which to place a processing target; a gas blow-out part having an opening; and a gas suction path; wherein the placement part is positioned in a space whose outer periphery surface is constituted by extending the interior wall of the opening in the direction vertical to the opening; the opening has, in its interior wall, a gas blow-out port through which a gas is blown out in one direction vertical to the opening; and the gas suction path is formed in such a way that it suctions the gas in the direction opposite to the one in which the gas is blown out. The columnar laminar generation device is capable of generating columnar laminar flows.

Abstract translation: 柱状层流产生装置包括：放置部件，用于放置处理目标; 具有开口的气体吹出部; 和气体吸入路径; 其中所述放置部分位于通过使所述开口的内壁沿垂直于所述开口的方向延伸而构成外周表面的空间中; 所述开口在其内壁中具有气体吹出口，通过所述气体吹出口沿垂直于所述开口的一个方向吹出气体; 并且气体吸入路径形成为使得气体沿与气体吹出的方向相反的方向吸入气体。 柱状层流发生装置能够产生柱状层流。

公开(公告)号：US20160293401A1

公开(公告)日：2016-10-06

申请号：US15037886

申请日：2014-12-01

Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY

Inventor： Shiro HARA ,  Sommawan KHUMPUANG ,  Shinichi IKEDA ,  Akihiro GOTO ,  Hiroshi AMANO

IPC: H01L21/02 ,  B08B3/12 ,  B08B3/08 ,  B08B3/10 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/02057 ,  B08B3/08 ,  B08B3/10 ,  B08B3/12 ,  H01L21/02052 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67115 ,  H01L21/68764

Abstract: A wafer cleaner and a method therefor that efficiently cleans a wafer with a little amount of a cleaning liquid and efficiently performs a heating wet cleaning processing. The present invention includes a stage where a wafer is placed, a rotary driving unit that rotates the stage in a circumferential direction, a liquid discharge nozzle disposed facing the wafer placed on the stage and supplies a cleaning liquid on the wafer placed on the stage, and a control unit that causes the liquid discharge nozzle to supply a space between the wafer placed on the stage and the liquid discharge nozzle with a predetermined amount of the cleaning liquid to fill the space. The present invention also includes a lamp disposed on a position facing the wafer placed on the stage to heat at least an interface portion of the wafer and a cleaning liquid.

Abstract translation: 一种晶片清洁器及其方法，其用少量清洗液有效地清洗晶片，并有效地执行加湿湿式清洗处理。 本发明包括一个放置晶片的台阶，一个沿圆周方向转动台面的旋转驱动单元，一个面对设置在台架上的晶圆设置的液体排出喷嘴，并将清洗液体提供在放在平台上的晶片上， 以及控制单元，其使得所述液体排出喷嘴在预定量的所述清洁液体之间提供放置在所述台架上的所述晶片与所述液体排出喷嘴之间的空间以填充所述空间。 本发明还包括一个灯，其设置在面向设置在台架上的晶片的位置上，以加热至少晶片的接口部分和清洁液体。

公开(公告)号：US20160211218A1

公开(公告)日：2016-07-21

申请号：US14913176

申请日：2014-07-24

Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY

Inventor： Shiro HARA ,  Sommawan KHUMPUANG ,  Shinichi IKEDA

IPC: H01L23/544 ,  H01L21/67 ,  G01B11/14 ,  H01L29/04

CPC classification number: H01L23/544 ,  G01B11/14 ,  H01L21/67259 ,  H01L21/67282 ,  H01L21/67294 ,  H01L29/045 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/54493 ,  H01L2924/0002 ,  H01L2924/00

Abstract: To provide a crystal orientation mark which can be formed easily and inexpensively, and which enables to perform high precision alignment and allows information other than crystal orientation to be included, even for a small diameter process substrate. A crystal orientation mark is drawn on the surface of the process substrate. The crystal orientation mark includes a marking region for crystal orientation detection, and a marking region for information. The marking region for crystal orientation detection is provided at two locations in an outer edge portion of the process substrate to be used for the alignment of the process substrate. The marking region for information is provided on a straight-line region connecting the marking regions for crystal orientation detection at the two locations, and includes a pattern for demonstrating predetermined information relating to the process substrate.

Abstract translation: 为了提供可以容易且廉价地形成的晶体取向标记，并且即使对于小直径处理基板，也能够进行高精度取向并且允许包含晶体取向以外的信息。 在处理基板的表面上绘制晶体取向标记。 晶体取向标记包括用于晶体取向检测的标记区域和用于信息的标记区域。 用于晶体取向检测的标记区域设置在处理基板的外边缘部分的两个位置处，以用于处理基板的对准。 用于信息的标记区域设置在连接两个位置处的晶体取向检测用标记区域的直线区域上，并且包括用于示出与处理基板有关的预定信息的图案。

公开(公告)号：US20150311101A1

公开(公告)日：2015-10-29

申请号：US14647685

申请日：2013-10-29

Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY

Inventor： Shiro HARA ,  Hitoshi MAEKAWA

IPC: H01L21/677

CPC classification number: H01L21/67742 ,  B25J9/0027 ,  B25J18/02 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67772 ,  H01L21/67778

Abstract: There is provided a substrate transfer antechamber mechanism for a compact manufacturing apparatus that produces various types of devices in small volume using a small-diameter processing substrate at low cost. A container placement table, on which a wafer transfer container housing a semiconductor wafer is placed, is provided on an upper surface of an apparatus antechamber for a compact semiconductor manufacturing apparatus, and the apparatus antechamber includes therein a wafer elevating mechanism and a horizontal transfer mechanism. The wafer elevating mechanism moves down while holding from below a delivery bottom of the wafer transfer container, on which the semiconductor wafer remains placed, to transfer the semiconductor wafer into the apparatus antechamber. The horizontal transfer mechanism transfers the semiconductor wafer into a processing chamber using a transfer arm that receives the semiconductor wafer from the delivery bottom and extends.

Abstract translation: 提供了一种用于小型制造装置的基板转移前室机构，其使用小直径处理基板以低成本产生小体积的各种类型的装置。 在紧凑型半导体制造装置的装置前厅的上表面上设置有容纳有半导体晶片的晶片转移容器的容器放置台，该装置前后室包括晶片升降机构和水平输送机构 。 晶片升降机构向下移动，同时保持半导体晶片保持放置的晶片转移容器的输送底部的下方，以将半导体晶片转移到装置前室中。 水平传送机构使用从传送底部接收半导体晶片并延伸的传送臂将半导体晶片传送到处理室。