公开(公告)号：US20160380160A1

公开(公告)日：2016-12-29

申请号：US15259691

申请日：2016-09-08

Applicant: NICHIA CORPORATION

Inventor： Suguru BEPPU

IPC: H01L33/50 ,  H01L33/62 ,  H01L33/60 ,  H01L33/54 ,  H01L33/56

CPC classification number: H01L33/50 ,  H01L33/0095 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A method for manufacturing a light emitting device, having mounting a light emitting element on a board, forming a phosphor layer that contains a phosphor by spraying on surfaces of the board and the light emitting element after the mounting of the light emitting element; and forming a cover layer that contains at least one type of light reflecting material and light blocking material on a surface of the phosphor layer over the board.

Abstract translation: 一种制造发光器件的方法，该发光器件具有将发光元件安装在基板上，在安装发光元件之后，通过喷涂在基板和发光元件的表面上形成含有荧光体的荧光体层; 以及在所述基板上的所述荧光体层的表面上形成包含至少一种类型的光反射材料和遮光材料的覆盖层。

公开(公告)号：US20160372644A1

公开(公告)日：2016-12-22

申请号：US15257067

申请日：2016-09-06

Applicant: NICHIA CORPORATION

Inventor： Takeshi IKEGAMI ,  Suguru BEPPU ,  Tatsuya KANAZAWA ,  Yoichi BANDO

IPC: H01L33/58 ,  H01L33/56 ,  H01L33/50 ,  H01L27/15 ,  H01L33/62

CPC classification number: H01L33/58 ,  H01L27/156 ,  H01L33/486 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2924/18161 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A method of producing a light emitting device includes providing a light emitting element on a base member, the base member including an insulating member and a pair of connection terminals at least on an upper surface thereof. The connection terminals have an exposed portion exposed to outside, with the light emitting element electrically connected to the connection terminals. A covering member is disposed to cover at least a portion of the upper surface of the light emitting element, and a protective layer is disposed to cover at least a portion of the exposed portions of the connection terminals. The covering member is removed, and material from the upper surface side of the base member is supplied to dispose a light-transmissive member on the upper surface of the light emitting element. At least a portion of the light-transmissive member present on the protective layer is then removed.

公开(公告)号：US20160351760A1

公开(公告)日：2016-12-01

申请号：US15167570

申请日：2016-05-27

Applicant: NICHIA CORPORATION

Inventor： Tadao HAYASHI ,  Teruhito AZUMA ,  Suguru BEPPU ,  Kunihiro IZUNO ,  Tsuyoshi OKAHISA

IPC: H01L33/50 ,  H01L33/58 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L33/507 ,  H01L33/48 ,  H01L33/505 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A method of manufacturing a covering member includes providing a first light-reflective member having a through-hole, the through-hole having first and second openings; arranging a light-transmissive resin containing a wavelength-conversion material within the through-hole; distributing the wavelength-conversion material predominantly on a side of the first opening of the through-hole within the light-transmissive resin; and after the distributing of the wavelength-conversion material, removing a portion of the light-transmissive resin from a side of the second opening of the through-hole.

Abstract translation: 一种制造覆盖部件的方法包括提供具有通孔的第一光反射部件，所述通孔具有第一和第二开口; 在所述通孔内配置含有波长转换材料的透光性树脂; 所述波长转换材料主要在所述透光树脂内的所述通孔的第一开口的一侧分布; 并且在分配波长转换材料之后，从通孔的第二开口的一侧去除一部分透光树脂。

公开(公告)号：US20160268481A1

公开(公告)日：2016-09-15

申请号：US15149640

申请日：2016-05-09

Applicant: NICHIA CORPORATION

Inventor： Suguru BEPPU

IPC: H01L33/50 ,  H01L33/56 ,  H01L33/54 ,  H01L33/60

CPC classification number: H01L33/50 ,  H01L33/0095 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A light emitting device includes a board, a light emitting element, a phosphor layer and a cover layer. The light emitting element is mounted on the board. The phosphor layer is in a substantially uniform thickness composed of a plurality of layers formed on a surface of the light emitting element. The cover layer contains light reflecting material at a place on the board where the light emitting element is not mounted. The cover layer covers the phosphor layer.

Abstract translation: 发光装置包括板，发光元件，荧光体层和覆盖层。 发光元件安装在板上。 荧光体层是由形成在发光元件的表面上的多个层构成的基本均匀的厚度。 覆盖层在板上没有安装发光元件的位置处包含光反射材料。 覆盖层覆盖磷光体层。

公开(公告)号：US20150155447A1

公开(公告)日：2015-06-04

申请号：US14554202

申请日：2014-11-26

Applicant: NICHIA CORPORATION

Inventor： Suguru BEPPU

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/00

CPC classification number: H01L33/50 ,  H01L33/0095 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A method for manufacturing a light emitting device, having; a die bonding step of mounting a light emitting element on a board; a phosphor layer formation step of forming a phosphor layer that contains a phosphor by spraying on surfaces of the board and the light emitting element after the die bonding step; and a cover layer formation step of forming a cover layer that contains at least one type of light reflecting material and light blocking material on a surface of the phosphor layer over the board.

Abstract translation: 一种制造发光器件的方法，具有： 将发光元件安装在基板上的芯片接合工序; 荧光体层形成步骤，在晶片接合步骤之后，通过喷涂在所述基板和所述发光元件的表面上形成含有荧光体的荧光体层; 以及覆盖层形成步骤，在所述基板上的所述荧光体层的表面上形成包含至少一种类型的光反射材料和遮光材料的覆盖层。