公开(公告)号：US09117984B2

公开(公告)日：2015-08-25

申请号：US14141607

申请日：2013-12-27

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki Katayama ,  Hiroshi Noro ,  Hisataka Ito

IPC: H01L33/50 ,  H01L33/52 ,  H01L33/60

CPC classification number: H01L33/52 ,  H01L33/50 ,  H01L33/501 ,  H01L33/60 ,  H01L2224/96 ,  H01L2933/0041 ,  H01L2933/005

Abstract: A method for producing an encapsulating layer-covered optical semiconductor element includes a disposing step of disposing an encapsulating layer at one side in a thickness direction of a support and a covering step of, after the disposing step, covering an optical semiconductor element with the encapsulating layer so as to expose one surface thereof to obtain an encapsulating layer-covered optical semiconductor element.

Abstract translation: 一种封装层覆盖的光学半导体元件的制造方法，其特征在于，具有在支撑体的厚度方向的一侧设置密封层的配置工序和在所述配置工序后的覆盖工序， 以露出其一个表面以获得覆盖封装层的光学半导体元件。

公开(公告)号：US08937329B2

公开(公告)日：2015-01-20

申请号：US13784013

申请日：2013-03-04

Applicant: Nitto Denko Corporation

Inventor： Hiroyuki Katayama

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/56

CPC classification number: H01L33/52 ,  H01L33/005 ,  H01L33/50 ,  H01L33/501 ,  H01L33/54 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/005 ,  Y10T428/24521 ,  H01L2924/00

Abstract: An encapsulating sheet includes a transparent layer in which a concave portion that is dented from the surface inwardly is formed and a phosphor encapsulating layer which fills the concave portion. The transparent layer is formed from a transparent composition containing a first silicone resin composition and the phosphor encapsulating layer is formed from a phosphor encapsulating composition containing a phosphor and a second silicone resin composition.

Abstract translation: 封装片包括形成从表面向内凹陷的凹部的透明层和填充凹部的荧光体封装层。 透明层由含有第一有机硅树脂组合物的透明组合物形成，并且磷光体封装层由含有磷光体和第二有机硅树脂组合物的荧光体封装组合物形成。

公开(公告)号：US20130341671A1

公开(公告)日：2013-12-26

申请号：US13912450

申请日：2013-06-07

Applicant: NITTO DENKO CORPORATION

Inventor： Haruka ONA ,  Hiroyuki Katayama ,  Sadahiro Nakanishi

IPC: H01L33/56

CPC classification number: H01L33/56 ,  C08G77/16 ,  C08G77/20 ,  C08L83/04 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

Abstract: A silicone resin composition contains a polysiloxane containing at least one pair of condensable substituted groups capable of condensation by heating and at least one pair of addable substituted groups capable of addition by an active energy ray.

公开(公告)号：US20130228803A1

公开(公告)日：2013-09-05

申请号：US13778515

申请日：2013-02-27

Applicant: NITTO DENKO CORPORATION

Inventor： Shinsuke Wakiya ,  Toshikazu Takagi ,  Hirofumi Fukutsuka ,  Yasunari Ooyabu ,  Hiroyuki Katayama ,  Takashi Kondo ,  Hiroki Kono

IPC: H01L33/50

CPC classification number: H01L33/508 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A light-emitting device includes a substrate including a mirror surface region on its upper surface, a semiconductor light-emitting element disposed in the mirror surface region, and an encapsulating layer joined onto the upper surface of the substrate. The encapsulating layer includes a lower layer that is in contact with the upper surface of the substrate, covers the surrounding of the semiconductor light-emitting element, and contains phosphor; and an upper layer that is positioned on the lower layer, and has a larger phosphor content per unit area than that of the lower layer.

Abstract translation: 发光装置包括其上表面上具有镜面区域的基板，配置在镜面区域的半导体发光元件和与基板的上表面接合的封装层。 封装层包括与基板的上表面接触的下层，覆盖半导体发光元件的周围，并含有荧光体; 以及位于下层上的上层，并且每单位面积的荧光体含量比下层高。

公开(公告)号：US08969910B2

公开(公告)日：2015-03-03

申请号：US14186014

申请日：2014-02-21

Applicant: Nitto Denko Corporation

Inventor： Hiroyuki Katayama

IPC: C08L83/07 ,  H01L33/56 ,  B32B37/14 ,  C09D183/04 ,  C08L83/04 ,  G02B1/04 ,  H01L23/29 ,  C08K5/19 ,  C08G77/12 ,  C08G77/20

CPC classification number: C09D183/04 ,  C08G77/12 ,  C08G77/20 ,  C08K5/19 ,  C08L83/04 ,  G02B1/04 ,  H01L23/296 ,  H01L2924/0002 ,  Y10T156/10 ,  H01L2924/00

Abstract: A silicone resin composition includes (1) an organopolysiloxane having at least two alkenylsilyl groups in one molecule, (2) an organopolysiloxane having at least two hydrosilyl groups in one molecule, (3) a hydrosilylation catalyst, and (4) a curing retarder, wherein the curing retarder contains tetraalkylammonium hydroxide.

Abstract translation: 有机硅树脂组合物包括（1）在一个分子中具有至少两个烯基甲硅烷基的有机聚硅氧烷，（2）在一个分子中具有至少两个氢化硅烷基的有机聚硅氧烷，（3）氢化硅烷化催化剂和（4）固化延迟剂， 其中所述固化缓凝剂含有四烷基氢氧化铵。