公开(公告)号：US09450160B2

公开(公告)日：2016-09-20

申请号：US14831305

申请日：2015-08-20

Applicant: NITTO DENKO CORPORATION

Inventor： Yasunari Ooyabu ,  Tsutomu Nishioka ,  Hisataka Ito ,  Toshiki Naito

IPC: H01L33/00 ,  H01L33/60 ,  H01L33/54 ,  H01L33/50 ,  H01L33/56 ,  H01L23/00 ,  H01L25/075

CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/81

Abstract: A reflecting resin sheet provides a reflecting resin layer at the side of a light emitting diode element. The reflecting resin sheet includes a release substrate and the reflecting resin layer provided on one surface in a thickness direction of the release substrate. The reflecting resin layer is formed corresponding to the light emitting diode element so as to be capable of being in close contact with the light emitting diode element.

公开(公告)号：US09080103B2

公开(公告)日：2015-07-14

申请号：US14030698

申请日：2013-09-18

Applicant: NITTO DENKO CORPORATION

Inventor： Masahiro Shirakawa ,  Hironaka Fujii ,  Hisataka Ito

IPC: H01L33/00 ,  C09K11/77 ,  C09J183/04 ,  C09J183/08 ,  H01L33/50 ,  C09K11/08 ,  C09J7/02 ,  C08G77/26

CPC classification number: C09K11/7721 ,  C08G77/26 ,  C09J7/22 ,  C09J7/38 ,  C09J183/04 ,  C09J183/08 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2483/00 ,  C09K11/08 ,  C09K11/7774 ,  H01L33/50 ,  H01L33/505 ,  H01L2924/0002 ,  H01L2933/0041 ,  Y10T428/2852 ,  C08K5/14 ,  C08K5/5415 ,  C08K5/29 ,  H01L2924/00

Abstract: A phosphor layer attaching kit includes a phosphor layer and a silicone pressure-sensitive adhesion composition for attaching the phosphor layer to an optical semiconductor element or an optical semiconductor element package. A percentage of the peel strength of the silicone pressure-sensitive adhesion composition is 30% or more.

Abstract translation: 荧光体层附着试剂盒包括荧光体层和用于将荧光体层附着到光学半导体元件或光学半导体元件封装的硅氧烷压敏粘合组合物。 硅氧烷压敏粘合组合物的剥离强度的百分比为30％以上。

公开(公告)号：US09117984B2

公开(公告)日：2015-08-25

申请号：US14141607

申请日：2013-12-27

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki Katayama ,  Hiroshi Noro ,  Hisataka Ito

IPC: H01L33/50 ,  H01L33/52 ,  H01L33/60

CPC classification number: H01L33/52 ,  H01L33/50 ,  H01L33/501 ,  H01L33/60 ,  H01L2224/96 ,  H01L2933/0041 ,  H01L2933/005

Abstract: A method for producing an encapsulating layer-covered optical semiconductor element includes a disposing step of disposing an encapsulating layer at one side in a thickness direction of a support and a covering step of, after the disposing step, covering an optical semiconductor element with the encapsulating layer so as to expose one surface thereof to obtain an encapsulating layer-covered optical semiconductor element.

Abstract translation: 一种封装层覆盖的光学半导体元件的制造方法，其特征在于，具有在支撑体的厚度方向的一侧设置密封层的配置工序和在所述配置工序后的覆盖工序， 以露出其一个表面以获得覆盖封装层的光学半导体元件。