公开(公告)号：US5909058A

公开(公告)日：1999-06-01

申请号：US934775

申请日：1997-09-22

Applicant: Keiichi Yano ,  Hironori Asai ,  Kaoru Koiwa ,  Nobuo Iwase

Inventor： Keiichi Yano ,  Hironori Asai ,  Kaoru Koiwa ,  Nobuo Iwase

IPC: H01L23/24 ,  H01L23/498 ,  H01L23/34 ,  H01L23/29 ,  H01L23/48

CPC classification number: H01L23/49816 ,  H01L23/24 ,  H01L23/49833 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011

Abstract: A thin type semiconductor package having a low thermal resistance and a low electric resistance is disclosed, that comprises a nitride ceramic supporting substrate having a first main surface and a second main surface, the nitride ceramic supporting substrate having via-holes that pass through from the first main surface to the second main surface, a resin film having a wiring layer, the resin film being bonded to the first main surface of the supporting substrate, the wiring layer being electrically connected to an edge portion of the via-holes on the first main surface, the resin film having an opening region, a semiconductor chip directly mounted on the first main surface of the nitride ceramic supporting substrate, disposed at the opening region of the resin film, and electrically connected to the wiring layer of the resin film, and external connection terminals disposed on the edge portion of the via-holes of the second main surface.

Abstract translation: 公开了一种具有低热阻和低电阻的薄型半导体封装，其包括具有第一主表面和第二主表面的氮化物陶瓷支撑衬底，所述氮化物陶瓷支撑衬底具有通孔， 第一主表面到第二主表面的树脂膜，具有布线层的树脂膜，树脂膜粘合到支撑基板的第一主表面，布线层电连接到第一主表面上的通孔的边缘部分 主表面，具有开口区域的树脂膜，直接安装在氮化物陶瓷支撑基板的第一主表面上的半导体芯片，设置在树脂膜的开口区域，并与树脂膜的布线层电连接， 以及设置在第二主表面的通孔的边缘部分上的外部连接端子。

公开(公告)号：US5622769A

公开(公告)日：1997-04-22

申请号：US194495

申请日：1994-02-10

Applicant: Shoji Kozuka ,  Masaru Hayashi ,  Katsuyoshi Oh-Ishi ,  Takaaki Yasumoto ,  Nobuo Iwase ,  Hiroshi Endo ,  Koji Yamakawa ,  Kaoru Koiwa ,  Kiyoshi Iyogi

Inventor： Shoji Kozuka ,  Masaru Hayashi ,  Katsuyoshi Oh-Ishi ,  Takaaki Yasumoto ,  Nobuo Iwase ,  Hiroshi Endo ,  Koji Yamakawa ,  Kaoru Koiwa ,  Kiyoshi Iyogi

IPC: H01L23/15 ,  H05K1/03 ,  H05K3/38 ,  B32B3/00

CPC classification number: H05K3/38 ,  H01L23/15 ,  H01L2924/0002 ,  H05K1/0306 ,  Y10S428/901 ,  Y10T428/24917

Abstract: According to this invention, there is disclosed a thermal conductivity substrate which includes an aluminum nitride sintered body and a coating layer formed on the body of aluminum phosphate and having a surface roughness of 1 .mu.m or less, and which has excellent humidity resistance and chemical resistance.

Abstract translation: 根据本发明，公开了一种导热性基材，其包括氮化铝烧结体和形成在磷酸铝体上的表面粗糙度为1μm以下并且具有优异的耐湿性和化学性质的涂层 抵抗性。

公开(公告)号：US5412160A

公开(公告)日：1995-05-02

申请号：US212869

申请日：1994-03-15

Applicant: Takaaki Yasumoto ,  Nobuo Iwase ,  Kaoru Koiwa ,  Koji Yamakawa ,  Kiyoshi Iyogi

Inventor： Takaaki Yasumoto ,  Nobuo Iwase ,  Kaoru Koiwa ,  Koji Yamakawa ,  Kiyoshi Iyogi

IPC: H01L23/373 ,  H05K1/02 ,  H05K1/00

CPC classification number: H01L23/3731 ,  H01L23/3732 ,  H01L23/3733 ,  H05K1/024 ,  H05K3/4605 ,  H05K3/467 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/0116 ,  H05K2201/0179

Abstract: A circuit board comprising a substrate, at least one dielectric film formed on the substrate and made of at least one selected from the group consisting of AlN, BN, diamond, diamond-like carbon, BeO and SiC, the dielectric film having pores of a porosity of 5 to 95% by volume, and at least one wiring metal film formed on the dielectric film.

Abstract translation: 一种电路板，包括基板，至少一个电介质膜，形成在基板上，由选自AlN，BN，金刚石，类金刚石碳，BeO和SiC中的至少一种制成，电介质膜具有孔 5〜95体积％的孔隙率和形成在电介质膜上的至少一个布线金属膜。

公开(公告)号：US4916261A

公开(公告)日：1990-04-10

申请号：US648304

申请日：1984-09-07

Applicant: Truong D. Thanh ,  Nobuo Iwase

Inventor： Truong D. Thanh ,  Nobuo Iwase

IPC: C04B35/01 ,  H05K1/03

CPC classification number: C04B35/01 ,  H05K1/0306

Abstract: A circuit substrate comprises a sintered oxide body of barium, tin and boron as an insulating body which is able to be fired at a temperature less than 1300.degree. C. The circuit substrate is further improved in moisture resistance by containing titanium or securing substantially the composition of BaSn(BO.sub.3).sub.2.

Abstract translation: 电路基板包括作为绝缘体的钡，锡和硼的烧结氧化物体，其能够在低于1300℃的温度下被烧制。电路基板通过包含钛或基本上确保组合物进一步改善耐湿性 的BaSn（BO3）2。

公开(公告)号：US4855251A

公开(公告)日：1989-08-08

申请号：US267707

申请日：1988-11-03

Applicant: Kiyoshi Iyogi ,  Koji Yamakawa ,  Nobuo Iwase

Inventor： Kiyoshi Iyogi ,  Koji Yamakawa ,  Nobuo Iwase

IPC: H01L21/60 ,  H01L23/485

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10T29/49121

Abstract: According to the present invention, a method is provided of manufacturing electronic parts, comprising a first step of forming on the surface of a substrate a bump wherein the metal particles of that portion of the bump which contacts the surface of the substrate have a larger diameter than the metal particles of that portion of the bump which does not contact the surface of the substrate, a second step of transferring the bump to an electrode lead, and a third step of connecting an electrode lead to a predetermined electrode section of the semiconductor chip, by means of the transferred bump. The method of the present invention ensures that the bump does not fall off during the electroplating and washing steps, and ensures a high-strength bond between the transferred bump and the electrode section of a semiconductor chip.

Abstract translation: 根据本发明，提供了一种制造电子部件的方法，该方法包括：在基板的表面上形成凸块的第一步骤，其中与基板表面接触的该凸块部分的金属颗粒具有较大的直径 比不与基板表面接触的部分凸块的金属颗粒，将凸点转移到电极引线的第二步骤，以及将电极引线连接到半导体芯片的预定电极部分的第三步骤 ，通过转移的凸块。 本发明的方法确保了在电镀和洗涤步骤期间凸起不会脱落，并确保了转印凸块与半导体芯片的电极部分之间的高强度结合。

公开(公告)号：US4835344A

公开(公告)日：1989-05-30

申请号：US154273

申请日：1988-02-10

Applicant: Kiyoshi Iyogi ,  Takaaki Yasumoto ,  Toshirou Yanazawa ,  Nobuo Iwase ,  Masako Nakahashi ,  Hiromitsu Takeda

Inventor： Kiyoshi Iyogi ,  Takaaki Yasumoto ,  Toshirou Yanazawa ,  Nobuo Iwase ,  Masako Nakahashi ,  Hiromitsu Takeda

IPC: H01R43/02 ,  B23K35/363 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K3/46

CPC classification number: H01L23/49827 ,  H01L21/4853 ,  H01L2924/00013 ,  H01L2924/0002 ,  Y10T29/49149

Abstract: The present invention provides an electronic component part with terminal pins very closely and very strongly bonded to a high thermal conductivity ceramics circuit board and a method for simply and continuously manufacturing electronic component parts, with a high operability, each with terminal pins bonded to a high thermal conductivity ceramics circuit board. According to the present invention, an electronic component part is provided in which terminal pins are bonded to a high thermal conductivity ceramics circuit board by a brazing metal, containing at least one kind of Group IVa elements. In another aspect of the present invention a method is provided for manufacturing electronic component parts, which comprises the step of attaching terminal pins to a high thermal conductivity ceramics circuit board by a brazing paste layer comprised of brazing metal powder containing at least one kind of Group IVa elements, an acrylic binder with a carboxylic group as a substituent group and organic solvent, and heating the resultant structure in an atmosphere containing nitrogen as a principal element so that terminal pins are firmly bonded to a circuit board.

公开(公告)号：US6068872A

公开(公告)日：2000-05-30

申请号：US412324

申请日：1999-10-05

Applicant: Toshio Hashiguchi ,  Nobuo Myojin ,  Nobuo Iwase ,  Tetsuya Hayashi

Inventor： Toshio Hashiguchi ,  Nobuo Myojin ,  Nobuo Iwase ,  Tetsuya Hayashi

IPC: A23L3/015 ,  A23L3/16 ,  A23L3/40 ,  A23L3/42 ,  A23L5/10 ,  A47J27/08 ,  A47J37/12 ,  A23L1/01

CPC classification number: A23L3/40 ,  A23L3/015 ,  A23L3/165 ,  A23L3/42 ,  A23L5/11 ,  A23L5/17 ,  A47J27/0817 ,  A47J37/1214

Abstract: The vacuum-heat processing apparatus according to the present invention includes: a vacuum container forming a vacuum chamber; a hopper into which an object to be processed and a processing liquid adjusted to a first temperature are thrown, the hopper being arranged above and communicating with an intake port formed in an upper end portion of the vacuum container; a sealing member arranged between the hopper and the intake port of the vacuum container to keep the vacuum chamber airtight; a transport conveyor installed in the vacuum chamber below the intake port to receive at one end side thereof the object flowing down the hopper from the intake port through the sealing member and carry it to the other end side; a processing liquid showering nozzles installed in the vacuum chamber immediately above the transport conveyor to shower a processing liquid adjusted to a second temperature over the object on the transport conveyor; a processing liquid tank containing a processing liquid adjusted to a third temperature and installed in the vacuum chamber immediately below the transport conveyor to receive the object dropped from the transport conveyor; at least one liquid removing device provided immediately below and communicating with a discharge port formed in a lower end portion of the vacuum container to remove the processing liquid from the object; and a transport device installed in the vacuum chamber to carry the object in the processing liquid tank to the liquid removing device.

Abstract translation: 根据本发明的真空热处理装置包括：形成真空室的真空容器; 将被处理物和调整到第一温度的处理液投入其中的料斗，料斗布置在真空容器的上端部中形成的进气口的上方并连通; 设置在所述料斗和所述真空容器的进气口之间以密封所述真空室的密封构件; 运送输送机，其安装在所述进气口下方的所述真空室中，以在所述真空室的一端侧从所述进气口通过所述密封构件接收从所述料斗下流的物体，并将其运送到所述另一端侧; 处理液体喷淋喷嘴，其安装在运输输送机正上方的真空室中，以便在运输输送机上淋浴被调节到物体上的第二温度的处理液体; 处理液罐，其容纳调整到第三温度的处理液体，并且安装在运输输送机正下方的真空室中，以接收从运输输送机掉落的物体; 至少一个液体去除装置，其紧靠下方设置并与形成在真空容器的下端部中的排出口连通，以从处理物体中除去处理液体; 以及安装在真空室中的运送装置，用于将处理液罐中的物体运送到液体移除装置。

公开(公告)号：US5988051A

公开(公告)日：1999-11-23

申请号：US106305

申请日：1998-06-29

Applicant: Toshio Hashiguchi ,  Nobuo Myojin ,  Nobuo Iwase ,  Tetsuya Hayashi

Inventor： Toshio Hashiguchi ,  Nobuo Myojin ,  Nobuo Iwase ,  Tetsuya Hayashi

IPC: A23L3/015 ,  A23L3/16 ,  A23L3/40 ,  A23L3/42 ,  A23L5/10 ,  A47J27/08 ,  A47J37/12

CPC classification number: A23L3/40 ,  A23L3/015 ,  A23L3/165 ,  A23L3/42 ,  A23L5/11 ,  A23L5/17 ,  A47J27/0817 ,  A47J37/1214

Abstract: The vacuum-heat processing apparatus according to the present invention includes: a vacuum container forming a vacuum chamber; a hopper into which an object to be processed and a processing liquid adjusted to a first temperature are thrown, the hopper being arranged above and communicating with an intake port formed in an upper end portion of the vacuum container; a sealing member arranged between the hopper and the intake port of the vacuum container to keep the vacuum chamber airtight; a transport conveyor installed in the vacuum chamber below the intake port to receive at one end side thereof the object flowing down the hopper from the intake port through the sealing member and carry it to the other end side; a processing liquid showering nozzles installed in the vacuum chamber immediately above the transport conveyor to shower a processing liquid adjusted to a second temperature over the object on the transport conveyor; and a processing liquid tank containing a processing liquid adjusted to a third temperature and installed in the vacuum chamber immediately below the transport conveyor to receive the object dropped from the transport conveyor.

Abstract translation: 根据本发明的真空热处理装置包括：形成真空室的真空容器; 将被处理物和调整到第一温度的处理液投入其中的料斗，料斗布置在真空容器的上端部中形成的进气口的上方并连通; 设置在所述料斗和所述真空容器的进气口之间以密封所述真空室的密封构件; 运送输送机，其安装在所述进气口下方的所述真空室中，以在所述真空室的一端侧从所述进气口通过所述密封构件接收从所述料斗下流的物体，并将其运送到所述另一端侧; 处理液体喷淋喷嘴，其安装在运输输送机正上方的真空室中，以便在运输输送机上淋浴被调节到物体上的第二温度的处理液体; 以及处理液罐，其含有调整到第三温度的处理液，并且安装在运送输送机正下方的真空室中，以接收从运送输送机掉落的物体。

公开(公告)号：US5907187A

公开(公告)日：1999-05-25

申请号：US502587

申请日：1995-07-14

Applicant: Kaoru Koiwa ,  Koji Yamakawa ,  Kiyoshi Iyogi ,  Takaaki Yasumoto ,  Nobuo Iwase

Inventor： Kaoru Koiwa ,  Koji Yamakawa ,  Kiyoshi Iyogi ,  Takaaki Yasumoto ,  Nobuo Iwase

IPC: H01L23/498 ,  H05K3/34 ,  H01L23/48 ,  H01L23/06 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K2201/094 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K3/3463 ,  H05K3/3484 ,  Y02P70/613

Abstract: In such electronic components as semiconductor packages and semiconductor chips which are possessed of groups of connecting bumps as input and output terminals, the groups of connecting bumps comprise not less than two kinds of connecting bumps different in melting point or not less than two kinds of connecting bumps different in mechanical strength. The groups of connecting bumps comprise connecting bumps made of high temperature solder or connecting bumps made of a high strength In type solder in the part of formation thereof. The connecting bumps made of high temperature solder are not directly affected by the influence of displacement because they retain the shape of a ball even after the step of connection such as solder reflow. The connecting bumps made of In type solder form connecting parts of high strength. These groups of connecting bumps contribute to exalt the reliability of the connecting parts without decreasing the number of input and output terminals.

Abstract translation: 在具有作为输入和输出端子的连接凸块组的半导体封装和半导体芯片的这种电子部件中，连接凸块组包括不少于两种不同熔点的连接凸块或不少于两种连接 不同的机械强度凸起。 连接凸块的组包括在其形成部分中由高温焊料或由高强度In型焊料制成的连接凸块形成的连接凸块。 由高温焊料制成的连接凸块不受位移影响的直接影响，因为即使在诸如焊料回流的连接步骤之后，它们保持了球的形状。 由In型焊料形成的连接凸块形成高强度的连接部件。 这些连接凸块组有助于提高连接部件的可靠性，而不会减少输入和输出端子的数量。

公开(公告)号：US5326623A

公开(公告)日：1994-07-05

申请号：US10298

申请日：1993-01-28

Applicant: Koji Yamakawa ,  Kaoru Koiwa ,  Takaaki Yasumoto ,  Kiyoshi Iyogi ,  Nobuo Iwase

Inventor： Koji Yamakawa ,  Kaoru Koiwa ,  Takaaki Yasumoto ,  Kiyoshi Iyogi ,  Nobuo Iwase

IPC: C04B37/02 ,  H01L23/12 ,  H01L23/15 ,  H01L23/498 ,  H01L23/538 ,  H05K1/09 ,  H05K3/24 ,  B32B9/00

CPC classification number: H01L23/538 ,  H01L23/49866 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A circuit board including a circuit pattern adhered firmly to a ceramic substrate and capable of eliminating an increase in resistivity due to an influence of an external environment, particularly, a thermal influence is disclosed. The circuit board comprises a ceramic substrate, and a circuit pattern formed on the substrate and having a multilayered structure in which a bonding layer comprising Ti and at least one element selected from the group consisting of N and O, a conductor layer consisting essentially of Cu, and a protective layer comprising Ti and at least one element selected from the group consisting of N and O are stacked in the order named.

Abstract translation: 公开了一种电路板，其包括牢固地粘附在陶瓷基板上的电路图形，能够消除由外部环境的影响引起的电阻率的增加，特别是热影响。 电路板包括陶瓷基板和形成在基板上并具有多层结构的电路图案，其中包含Ti和至少一种选自N和O的元素的接合层，基本上由Cu组成的导体层 ，并且以所述顺序堆叠包含Ti和从N和O组成的组中选择的至少一种元素的保护层。