公开(公告)号：US5907187A

公开(公告)日：1999-05-25

申请号：US502587

申请日：1995-07-14

申请人： Kaoru Koiwa ,  Koji Yamakawa ,  Kiyoshi Iyogi ,  Takaaki Yasumoto ,  Nobuo Iwase

发明人： Kaoru Koiwa ,  Koji Yamakawa ,  Kiyoshi Iyogi ,  Takaaki Yasumoto ,  Nobuo Iwase

IPC分类号： H01L23/498 ,  H05K3/34 ,  H01L23/48 ,  H01L23/06 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K2201/094 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K3/3463 ,  H05K3/3484 ,  Y02P70/613

摘要： In such electronic components as semiconductor packages and semiconductor chips which are possessed of groups of connecting bumps as input and output terminals, the groups of connecting bumps comprise not less than two kinds of connecting bumps different in melting point or not less than two kinds of connecting bumps different in mechanical strength. The groups of connecting bumps comprise connecting bumps made of high temperature solder or connecting bumps made of a high strength In type solder in the part of formation thereof. The connecting bumps made of high temperature solder are not directly affected by the influence of displacement because they retain the shape of a ball even after the step of connection such as solder reflow. The connecting bumps made of In type solder form connecting parts of high strength. These groups of connecting bumps contribute to exalt the reliability of the connecting parts without decreasing the number of input and output terminals.

摘要翻译： 在具有作为输入和输出端子的连接凸块组的半导体封装和半导体芯片的这种电子部件中，连接凸块组包括不少于两种不同熔点的连接凸块或不少于两种连接 不同的机械强度凸起。 连接凸块的组包括在其形成部分中由高温焊料或由高强度In型焊料制成的连接凸块形成的连接凸块。 由高温焊料制成的连接凸块不受位移影响的直接影响，因为即使在诸如焊料回流的连接步骤之后，它们保持了球的形状。 由In型焊料形成的连接凸块形成高强度的连接部件。 这些连接凸块组有助于提高连接部件的可靠性，而不会减少输入和输出端子的数量。

公开(公告)号：US5326623A

公开(公告)日：1994-07-05

申请号：US10298

申请日：1993-01-28

申请人： Koji Yamakawa ,  Kaoru Koiwa ,  Takaaki Yasumoto ,  Kiyoshi Iyogi ,  Nobuo Iwase

发明人： Koji Yamakawa ,  Kaoru Koiwa ,  Takaaki Yasumoto ,  Kiyoshi Iyogi ,  Nobuo Iwase

IPC分类号： C04B37/02 ,  H01L23/12 ,  H01L23/15 ,  H01L23/498 ,  H01L23/538 ,  H05K1/09 ,  H05K3/24 ,  B32B9/00

CPC分类号： H01L23/538 ,  H01L23/49866 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A circuit board including a circuit pattern adhered firmly to a ceramic substrate and capable of eliminating an increase in resistivity due to an influence of an external environment, particularly, a thermal influence is disclosed. The circuit board comprises a ceramic substrate, and a circuit pattern formed on the substrate and having a multilayered structure in which a bonding layer comprising Ti and at least one element selected from the group consisting of N and O, a conductor layer consisting essentially of Cu, and a protective layer comprising Ti and at least one element selected from the group consisting of N and O are stacked in the order named.

摘要翻译： 公开了一种电路板，其包括牢固地粘附在陶瓷基板上的电路图形，能够消除由外部环境的影响引起的电阻率的增加，特别是热影响。 电路板包括陶瓷基板和形成在基板上并具有多层结构的电路图案，其中包含Ti和至少一种选自N和O的元素的接合层，基本上由Cu组成的导体层 ，并且以所述顺序堆叠包含Ti和从N和O组成的组中选择的至少一种元素的保护层。

公开(公告)号：US5622769A

公开(公告)日：1997-04-22

申请号：US194495

申请日：1994-02-10

申请人： Shoji Kozuka ,  Masaru Hayashi ,  Katsuyoshi Oh-Ishi ,  Takaaki Yasumoto ,  Nobuo Iwase ,  Hiroshi Endo ,  Koji Yamakawa ,  Kaoru Koiwa ,  Kiyoshi Iyogi

发明人： Shoji Kozuka ,  Masaru Hayashi ,  Katsuyoshi Oh-Ishi ,  Takaaki Yasumoto ,  Nobuo Iwase ,  Hiroshi Endo ,  Koji Yamakawa ,  Kaoru Koiwa ,  Kiyoshi Iyogi

IPC分类号： H01L23/15 ,  H05K1/03 ,  H05K3/38 ,  B32B3/00

CPC分类号： H05K3/38 ,  H01L23/15 ,  H01L2924/0002 ,  H05K1/0306 ,  Y10S428/901 ,  Y10T428/24917

摘要： According to this invention, there is disclosed a thermal conductivity substrate which includes an aluminum nitride sintered body and a coating layer formed on the body of aluminum phosphate and having a surface roughness of 1 .mu.m or less, and which has excellent humidity resistance and chemical resistance.

摘要翻译： 根据本发明，公开了一种导热性基材，其包括氮化铝烧结体和形成在磷酸铝体上的表面粗糙度为1μm以下并且具有优异的耐湿性和化学性质的涂层 抵抗性。

公开(公告)号：US5412160A

公开(公告)日：1995-05-02

申请号：US212869

申请日：1994-03-15

申请人： Takaaki Yasumoto ,  Nobuo Iwase ,  Kaoru Koiwa ,  Koji Yamakawa ,  Kiyoshi Iyogi

发明人： Takaaki Yasumoto ,  Nobuo Iwase ,  Kaoru Koiwa ,  Koji Yamakawa ,  Kiyoshi Iyogi

IPC分类号： H01L23/373 ,  H05K1/02 ,  H05K1/00

CPC分类号： H01L23/3731 ,  H01L23/3732 ,  H01L23/3733 ,  H05K1/024 ,  H05K3/4605 ,  H05K3/467 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/0116 ,  H05K2201/0179

摘要： A circuit board comprising a substrate, at least one dielectric film formed on the substrate and made of at least one selected from the group consisting of AlN, BN, diamond, diamond-like carbon, BeO and SiC, the dielectric film having pores of a porosity of 5 to 95% by volume, and at least one wiring metal film formed on the dielectric film.

摘要翻译： 一种电路板，包括基板，至少一个电介质膜，形成在基板上，由选自AlN，BN，金刚石，类金刚石碳，BeO和SiC中的至少一种制成，电介质膜具有孔 5〜95体积％的孔隙率和形成在电介质膜上的至少一个布线金属膜。

公开(公告)号：US4906341A

公开(公告)日：1990-03-06

申请号：US247619

申请日：1988-09-22

申请人： Koji Yamakawa ,  Kaoru Koiwa ,  Nobuo Iwase

发明人： Koji Yamakawa ,  Kaoru Koiwa ,  Nobuo Iwase

IPC分类号： H01L21/60

CPC分类号： H01L24/11 ,  H01L2224/1147 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082

摘要： A plating solution is stored in an annular plating solution storage. A plating solution tank having an open upper portion is arranged in a hollow portion of the storage. A mesh-like anode electrode is arranged on the bottom portion of the plating tank. Hold members are attached to an upper side wall of the plating tank. One of the hold members is in contact with a portion to be plated of a semiconductor member and serves as a cathode electrode. The anode and cathode electrodes are connected to a DC power source. The plating solution in the plating solution tank is brought into contact with the portion to be plated and is isolated therefrom by an driving pump intermittently driven at predetermined intervals using an intermittent drive unit. The power source is kept in the ON state while the plating solution is in contact with the portion to be plated, there-by forming a plated layer on the portion to be plated.

公开(公告)号：US5736790A

公开(公告)日：1998-04-07

申请号：US710769

申请日：1996-09-20

申请人： Kiyoshi Iyogi ,  Kaoru Koiwa ,  Keiichi Yano ,  Hironori Asai

发明人： Kiyoshi Iyogi ,  Kaoru Koiwa ,  Keiichi Yano ,  Hironori Asai

IPC分类号： H01L23/485 ,  H05K1/11 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/10 ,  H01L24/13 ,  H05K1/111 ,  H05K3/3436 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/181 ,  H05K2201/0212 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2203/041 ,  Y02P70/611 ,  Y02P70/613

摘要： Disclosed is a bump formed on a pad which is provided on either a semiconductor chip or a package or a wiring substrate for input or output thereof, for making electric connection on the pad. The bump has: a projection projecting from the pad; a ball having conductivity and located above the pad; and a conductive bonding material for bonding the pad for and the ball, wherein creep strength of the ball is larger than strength of the conductive bonding material. With another conductive bonding material provided on the other pad of a wiring substrate or a package, the ball of the bump of the semiconductor chip or the package is placed close to another pad of the wiring substrate or package. The conductive bonding material of the other pad is heated and melted to connect the ball and the other pad of the wiring substrate or package by the conductive bonding material.

摘要翻译： 公开了一种形成在焊盘上的凸块，其设置在半导体芯片或封装或其输入或输出的布线基板上，用于在焊盘上进行电连接。 凸起具有：从该垫突出的突起; 具有导电性并位于垫上方的球; 以及用于接合焊盘和球的导电接合材料，其中球的蠕变强度大于导电接合材料的强度。 通过设置在布线基板或封装的另一个焊盘上的另一个导电接合材料，将半导体芯片或封装的凸块的球放置成靠近布线基板或封装的另一个焊盘。 另一个焊盘的导电接合材料被加热熔化，以通过导电接合材料将接线衬底或封装的球和另一焊盘连接起来。

公开(公告)号：US5909058A

公开(公告)日：1999-06-01

申请号：US934775

申请日：1997-09-22

申请人： Keiichi Yano ,  Hironori Asai ,  Kaoru Koiwa ,  Nobuo Iwase

发明人： Keiichi Yano ,  Hironori Asai ,  Kaoru Koiwa ,  Nobuo Iwase

IPC分类号： H01L23/24 ,  H01L23/498 ,  H01L23/34 ,  H01L23/29 ,  H01L23/48

CPC分类号： H01L23/49816 ,  H01L23/24 ,  H01L23/49833 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011

摘要： A thin type semiconductor package having a low thermal resistance and a low electric resistance is disclosed, that comprises a nitride ceramic supporting substrate having a first main surface and a second main surface, the nitride ceramic supporting substrate having via-holes that pass through from the first main surface to the second main surface, a resin film having a wiring layer, the resin film being bonded to the first main surface of the supporting substrate, the wiring layer being electrically connected to an edge portion of the via-holes on the first main surface, the resin film having an opening region, a semiconductor chip directly mounted on the first main surface of the nitride ceramic supporting substrate, disposed at the opening region of the resin film, and electrically connected to the wiring layer of the resin film, and external connection terminals disposed on the edge portion of the via-holes of the second main surface.

摘要翻译： 公开了一种具有低热阻和低电阻的薄型半导体封装，其包括具有第一主表面和第二主表面的氮化物陶瓷支撑衬底，所述氮化物陶瓷支撑衬底具有通孔， 第一主表面到第二主表面的树脂膜，具有布线层的树脂膜，树脂膜粘合到支撑基板的第一主表面，布线层电连接到第一主表面上的通孔的边缘部分 主表面，具有开口区域的树脂膜，直接安装在氮化物陶瓷支撑基板的第一主表面上的半导体芯片，设置在树脂膜的开口区域，并与树脂膜的布线层电连接， 以及设置在第二主表面的通孔的边缘部分上的外部连接端子。

公开(公告)号：US20070080351A1

公开(公告)日：2007-04-12

申请号：US11609350

申请日：2006-12-12

申请人： Miki MORI ,  Kaoru Koiwa

发明人： Miki MORI ,  Kaoru Koiwa

IPC分类号： H01L29/04

CPC分类号： H01J31/127 ,  H01J29/92 ,  H01J2329/92

摘要： A display device comprises a first substrate which has a line-forming surface, a second substrate which is arranged opposite to the line-forming surface by a gap interposed and has peripheral edge bonded to the first substrate, a plurality of display elements which are provided between the first substrate and the second substrate, a plurality of lines which are formed on the line-forming surface, extend to the peripheral edge of the line-forming surface and supply a drive voltage to the display elements, and a drive circuit substrate which is arranged at the peripheral edge of the line-forming surface and on which drive circuit is mounted.

摘要翻译： 一种显示装置，包括具有线形成表面的第一衬底，通过插入的间隙与线形成表面相对布置并具有结合到第一衬底的周缘的第二衬底，设置有多个显示元件 在第一基板和第二基板之间，形成在线形成表面上的多条线延伸到线形成表面的周缘并向显示元件提供驱动电压;以及驱动电路基板， 布置在线形成表面的周边边缘并且安装有驱动电路。

公开(公告)号：US06852451B2

公开(公告)日：2005-02-08

申请号：US09945808

申请日：2001-09-05

申请人： Asako Satoh ,  Masashi Fujiwara ,  Kaoru Koiwa ,  Masahiro Sekino ,  Nao Shimura ,  Hiroyuki Hasebe ,  Masayuki Oguchi ,  Masayuki Onuma

发明人： Asako Satoh ,  Masashi Fujiwara ,  Kaoru Koiwa ,  Masahiro Sekino ,  Nao Shimura ,  Hiroyuki Hasebe ,  Masayuki Oguchi ,  Masayuki Onuma

IPC分类号： H01M10/04 ,  H01M2/02 ,  H01M4/133 ,  H01M4/58 ,  H01M4/587 ,  H01M6/16 ,  H01M10/0525 ,  H01M10/0569 ,  H01M10/36 ,  H01M10/42 ,  H01M10/44

CPC分类号： H01M10/0525 ,  H01M2/0207 ,  H01M2/0287 ,  H01M4/133 ,  H01M4/587 ,  H01M10/0569 ,  H01M10/44 ,  H01M2010/4292

摘要： Disclosed is a nonaqueous electrolyte secondary battery, comprising a case having a wall thickness not larger than 0.3 mm, a positive electrode provided in the case, a negative electrode provided in the case and the negative electrode containing a carbonaceous material capable of absorbing-desorbing lithium ions, and a nonaqueous electrolyte provided in the case and the nonaqueous electrolyte containing a nonaqueous solvent including γ-butyrolactone and a solute dissolved in the nonaqueous solvent, wherein after being discharged to 3V with a current of 0.2 C at room temperature, the voltage reduction caused by the self-discharge at 60° C. is not larger than 1.5V in 3 weeks.

摘要翻译： 公开了一种非水电解质二次电池，其包括壁厚不大于0.3mm的壳体，设置在壳体中的正极，设置在壳体中的负极和含有能够吸收解吸锂的碳质材料的负极 离子和非水电解质，非水电解质含有包含γ-丁内酯和溶解在非水溶剂中的溶质的非水溶剂，其中在室温下以0.2℃的电流放电至3V后，电压降低 由60℃自放电引起的3周内不大于1.5V。

公开(公告)号：US08169133B2

公开(公告)日：2012-05-01

申请号：US11961765

申请日：2007-12-20

申请人： Takashi Date ,  Kaoru Koiwa ,  Takahiro Oguchi ,  Keiji Suzuki

发明人： Takashi Date ,  Kaoru Koiwa ,  Takahiro Oguchi ,  Keiji Suzuki

IPC分类号： H01J1/62 ,  H01J63/04

CPC分类号： H01J29/085 ,  H01J9/20 ,  H01J31/127

摘要： There is provided an image display apparatus including: a first substrate having an electron-emitting device; a second substrate having an anode electrode that is opposed to the electron-emitting device; and a conductive layer that is provided on the side of a second face of the second substrate, the second face being an opposite face to a first face of the second substrate, the first face being located on the first substrate side, wherein a potential of the conductive layer is set to be lower than a potential of the anode electrode when displaying an image; and a surface resistance of the conductive layer is higher than a surface resistance of the anode electrode.

摘要翻译： 提供了一种图像显示装置，包括：具有电子发射装置的第一基板; 具有与电子发射器件相对的阳极电极的第二衬底; 以及导电层，其设置在所述第二基板的第二面的一侧，所述第二面是与所述第二基板的第一面相反的面，所述第一面位于所述第一基板侧， 当显示图像时，将导电层设定为低于阳极电位; 并且导电层的表面电阻高于阳极电极的表面电阻。