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公开(公告)号：US20180248074A1
公开(公告)日：2018-08-30
申请号：US15963408
申请日：2018-04-26
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
CPC classification number: H01L33/0079 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: A method of producing an optoelectronic semiconductor component includes providing a carrier, arranging at least one optoelectronic semiconductor chip at a top side of the carrier, applying a phosphor layer at the at least one semiconductor chip, forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip, and removing the carrier, wherein the phosphor layer is applied before forming the shaped body.
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Patent Agency Ranking
公开(公告)号：US09985171B2
公开(公告)日：2018-05-29
申请号：US15632544
申请日：2017-06-26
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L29/18 , H01L33/00 , H01L31/02 , H01L31/0232 , H01L31/18 , H01L33/62 , H01L33/60 , H01L33/50
CPC classification number: H01L33/0079 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, and side areas connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the optoelectronic semiconductor chip is a flip-chip having the electrical contract locations only at one side, either the underside or the top side, the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the shaped body is free of a via that electrically connects the optoelectronic semiconductor chip.
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公开(公告)号：US09490396B2
公开(公告)日：2016-11-08
申请号：US14931246
申请日：2015-11-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L29/18 , H01L33/48 , H01L33/62 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L23/31 , H01L33/54
CPC classification number: H01L33/0079 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas, a surface at a top side of the semiconductor chip, and a surface at a bottom side of the semiconductor chip; a shaped body having a surface at a top side of the shaped body and a surface at an underside of the shaped body; at least one plated-through hole including an electrically conductive material; and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein the side areas of the optoelectronic semiconductor chip are covered by the shaped body, and the surface at the top side and/or the surface at the bottom side of the optoelectronic semiconductor chip are completely free of the shaped body.
Abstract translation: 光电子半导体部件包括：具有侧面区域的光电子半导体芯片，半导体芯片顶面的表面以及半导体芯片底面的表面; 成形体，其具有在成形体的顶侧的表面和成形体的下侧的表面; 至少一个包括导电材料的电镀通孔; 以及与半导体芯片和镀通孔导电连接的导电连接，其中光电子半导体芯片的侧面被成形体覆盖，并且在顶部和/或底部的表面处的表面 光电半导体芯片的一侧完全没有成形体。
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公开(公告)号：US20160056343A1
公开(公告)日：2016-02-25
申请号：US14931246
申请日：2015-11-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L33/48 , H01L31/0232 , H01L33/56 , H01L31/0203 , H01L33/62 , H01L33/60
CPC classification number: H01L33/0079 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas, a surface at a top side of the semiconductor chip, and a surface at a bottom side of the semiconductor chip; a shaped body having a surface at a top side of the shaped body and a surface at an underside of the shaped body; at least one plated-through hole including an electrically conductive material; and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein the side areas of the optoelectronic semiconductor chip are covered by the shaped body, and the surface at the top side and/or the surface at the bottom side of the optoelectronic semiconductor chip are completely free of the shaped body.
Abstract translation: 光电子半导体部件包括具有侧面区域的半导体芯片，半导体芯片顶面的表面和半导体芯片底面的表面， 成形体，其具有在成形体的顶侧的表面和成形体的下侧的表面; 至少一个包括导电材料的电镀通孔; 以及与半导体芯片和镀通孔导电连接的导电连接，其中光电子半导体芯片的侧面被成形体覆盖，并且在顶部和/或底部的表面处的表面 光电半导体芯片的一侧完全没有成形体。
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公开(公告)号：US20150270459A1
公开(公告)日：2015-09-24
申请号：US14430539
申请日：2013-09-24
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Georg Dirscherl , Walter Wegleiter , Caroline Cassignol , Karl Weidner
CPC classification number: H01L33/56 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: The invention relates to an optoelectronic semiconductor component, which has a carrier element (1), on which an optoelectronic semiconductor chip (2) having at least one active layer is arranged, wherein the active layer is designed to emit or receive light during operation and wherein the semiconductor chip (2) is covered with a protective layer (3) that contains poly-para-xylenes.
Abstract translation: 本发明涉及一种具有载体元件（1）的光电子半导体元件，其上布置有具有至少一个有源层的光电子半导体芯片（2），其中该有源层被设计为在操作期间发射或接收光;以及 其中所述半导体芯片（2）被包含聚对二甲苯的保护层（3）覆盖。
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16.发明申请公开(公告)号：US20150014737A1
公开(公告)日：2015-01-15
申请号：US14378610
申请日：2013-01-17
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stefan Illek , Walter Wegleiter , Karl Weidner , Stefan Stegmeier
CPC classification number: H01L33/64 , H01L25/0753 , H01L27/15 , H01L33/005 , H01L33/36 , H01L33/486 , H01L33/52 , H01L33/54 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48137 , H01L2933/0016 , H01L2933/0025 , H01L2933/005 , H01L2933/0066 , H01L2924/00014
Abstract: In at least one embodiment, the semiconductor component includes at least one optoelectronic semiconductor chip having a radiation exit side. The surface-mountable semiconductor component comprises a shaped body that covers side surfaces of the semiconductor chip directly and in a positively locking manner. The shaped body and the semiconductor chip do not overlap, as seen in a plan view of the radiation exit side.
Abstract translation: 在至少一个实施例中，半导体部件包括具有辐射出射侧的至少一个光电子半导体芯片。 可表面安装的半导体部件包括直接覆盖半导体芯片的侧表面并以正锁定方式覆盖的成形体。 成形体和半导体芯片不重叠，如在辐射出口侧的平面图中所见。
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