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公开(公告)号：US10362931B2
公开(公告)日：2019-07-30
申请号：US15958033
申请日：2018-04-20
Inventor： Shintaro Hayashi
Abstract: An optical device is provided. The optical device includes an excitation light source that emits excitation light. A first optical fiber guides the excitation light emitted from the excitation light source. A fluorescent plate includes a fluorescent light emitter that receives the excitation light guided by the first optical fiber and emits fluorescent light. The fluorescent plate further includes a dichroic mirror on a side of the fluorescent light emitter that receives the excitation light. The dichroic mirror transmits the excitation light and reflects the fluorescent light.
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公开(公告)号：US10240726B2
公开(公告)日：2019-03-26
申请号：US15682706
申请日：2017-08-22
Inventor： Hiroshi Kitano , Hideharu Kawachi , Shintaro Hayashi
IPC: F21K2/06 , F21K9/64 , F21K9/90 , H01S5/00 , F21Y115/30 , F21V9/35 , H01S5/022 , H01S5/323 , H01S5/40
Abstract: A luminaire including a wavelength converter and a method of manufacturing the luminaire are provided. The wavelength converter radiates, based on a laser light beam, a light beam having a wavelength different from the laser light beam. The method of measuring the luminaire includes measuring wavelengths of laser light beams oscillated by a plurality of laser elements to identify main wavelengths of the plurality of laser elements, storing association information between main wavelength information items indicating the main wavelengths identified and element information items identifying the plurality of laser elements corresponding to the main wavelengths identified, selecting a combination of laser elements having a composite wavelength falling within a predetermined range, from the plurality of laser elements, based on the association information, and arranging optical paths to irradiate a same area of the wavelength converter with the laser light beams of the combination of laser elements selected.
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公开(公告)号：US09920919B2
公开(公告)日：2018-03-20
申请号：US15112184
申请日：2015-02-17
Inventor： Kouichirou Matsuoka , Kazuhiko Hayashi , Shintaro Hayashi
IPC: F21V17/00 , F21V31/00 , F21V3/00 , F21V17/06 , F21V17/10 , F21V7/00 , A61L2/10 , H01L33/48 , F21Y115/10
CPC classification number: F21V31/005 , A61L2/10 , A61L2209/12 , F21V3/00 , F21V7/00 , F21V17/06 , F21V17/101 , F21Y2115/10 , H01L33/486
Abstract: A light emitting device includes a substrate with a circuit incorporated in the substrate, an interposer having a circuit connected to the circuit of the substrate, a light emitting element disposed on the interposer, a transmissive component disposed positioned to the light emitting element, and a frame body having an opening in which the transmissive component is disposed. The light emitting device further includes a ring-shaped body that encompasses the frame body on the substrate, and a sealant making the substrate and the ring-shaped body tightly contact one another. The frame body is disposed so as to encompass the light emitting element on the substrate. This provides the light emitting device with waterproof function.
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公开(公告)号：US09885602B2
公开(公告)日：2018-02-06
申请号：US15388614
申请日：2016-12-22
Inventor： Hirotaka Matsunami , Shintaro Hayashi , Shinichi Kitaoka
CPC classification number: G01J1/0252 , G01J1/0403 , G01N15/00 , G01N15/0211 , G01N15/1434 , G01N15/1459 , G01N21/53 , G01N2015/0046 , G01N2015/1486 , G08B17/107 , G08B17/113
Abstract: A particle sensor is provided. The particle sensor includes a light projector that projects light to a detection area. A light receiver receives scattered light. The scattered light is light from the light projector that has been scattered by particles in the detection area. A first support supports the light receiver. A second support supports the light projector and has a linear expansion coefficient different from a linear expansion coefficient of the first support. The first support includes a first placement region in which the light receiver is disposed and a second placement region in which the second support is disposed. The first placement region and the second placement region are located at different distances from at least one of an optical axis of the light projector and an optical axis of the light receiver.
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公开(公告)号：US09508679B2
公开(公告)日：2016-11-29
申请号：US14420181
申请日：2013-03-11
Inventor： Mitsuhiko Ueda , Yoshiharu Sanagawa , Takanori Aketa , Shintaro Hayashi
IPC: H01L23/00 , B23K20/00 , H01L21/52 , H01L21/683
CPC classification number: H01L24/97 , B23K20/00 , H01L21/52 , H01L21/6836 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/75 , H01L24/83 , H01L2221/68327 , H01L2221/68381 , H01L2224/04026 , H01L2224/05155 , H01L2224/05166 , H01L2224/05664 , H01L2224/05669 , H01L2224/2745 , H01L2224/2746 , H01L2224/29011 , H01L2224/29012 , H01L2224/29013 , H01L2224/2908 , H01L2224/29082 , H01L2224/29111 , H01L2224/29144 , H01L2224/29147 , H01L2224/3003 , H01L2224/32225 , H01L2224/32227 , H01L2224/32501 , H01L2224/32505 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/75252 , H01L2224/75301 , H01L2224/75744 , H01L2224/75745 , H01L2224/75753 , H01L2224/75901 , H01L2224/7598 , H01L2224/8301 , H01L2224/83013 , H01L2224/83065 , H01L2224/83075 , H01L2224/8309 , H01L2224/83123 , H01L2224/83127 , H01L2224/83193 , H01L2224/83203 , H01L2224/83207 , H01L2224/83805 , H01L2224/83825 , H01L2224/8383 , H01L2224/83906 , H01L2224/83907 , H01L2224/92247 , H01L2224/97 , H01L2924/01322 , H01L2924/10161 , H01L2924/10162 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/1461 , H01L2224/83 , H01L2924/0105 , H01L2924/00014 , H01L2924/01032 , H01L2924/01083 , H01L2924/01029 , H01L2924/00012 , H01L2924/00
Abstract: A mounting method of mounting chips on a substrate includes a temporarily-bonding process, and a main-bonding process. Temporarily-bonding process is to perform a first basic process, repeatedly depending on the number of the chips. First basic process includes a first step and a second step. First step is to align, on a first metal layer of the substrate, a second metal layer of each chip. Second step is to temporarily bond each chip by subjecting the first and second metal layers to solid phase diffusion bonding. Main-bonding process is to perform a second basic process, repeatedly depending on the number of the chips. Second basic process includes a third step and a fourth step. Third step is to recognize a position of each chip temporarily mounted on the substrate. Fourth step is to firmly bond each chip by subjecting the first and second metal layers to liquid phase diffusion bonding.
Abstract translation: 将芯片安装在基板上的安装方法包括临时粘合工艺和主要粘结工艺。 暂时粘接过程是根据芯片的数量重复执行第一个基本过程。 第一基本过程包括第一步骤和第二步骤。 第一步是在衬底的第一金属层上对准每个芯片的第二金属层。 第二步是通过使第一和第二金属层进行固相扩散接合来临时粘合每个芯片。 主键合过程是根据芯片的数量重复执行第二个基本过程。 第二基本过程包括第三步骤和第四步骤。 第三步是识别临时安装在基板上的每个芯片的位置。 第四步是通过使第一和第二金属层进行液相扩散接合来牢固地结合每个芯片。
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Patent Agency Ranking
公开(公告)号：US11280949B2
公开(公告)日：2022-03-22
申请号：US17100297
申请日：2020-11-20
Inventor： Yudai Shibata , Takeshi Abe , Shogo Motegi , Shintaro Hayashi
Abstract: A light-emitting device includes: a laser light source that radiates blue-based light as primary light; a wavelength converting member that emits secondary light, the secondary light including wavelength-converted light, the wavelength-converted light being the primary light converted into light having more long-wavelength components than the primary light; a first light-guiding member that transmits the secondary light emitted by the wavelength converting member; and a second light-guiding member which includes a resin material, and transmits the secondary light transmitted by the first light-guiding member, and the first light-guiding member and the second light-guiding member are connected by a connector, the connector including a numerical aperture (NA) converting member that optically connects a transmission path in the first light-guiding member and a transmission path in the second light-guiding member.
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公开(公告)号：US10859249B2
公开(公告)日：2020-12-08
申请号：US16860674
申请日：2020-04-28
Inventor： Masahito Yamana , Noboru Iizawa , Shintaro Hayashi , Yoshiyuki Nakano
IPC: F21V29/502 , F21V9/30 , F21V13/02 , G02B5/20 , H01S5/06 , H01L33/50 , F21Y115/30 , F21V5/04 , F21V29/70 , F21V29/89
Abstract: A wavelength conversion device for laser light including a laser light source that emits laser light having a predetermined wavelength; a first substrate that is light-transmissive; a second substrate that is light-transmissive; a phosphor layer provided between and in surface contact with the first substrate and the second substrate, the phosphor layer converting a wavelength of the laser light; and a gap-maintaining component located between the first substrate and the second substrate, the gap-maintaining component adjusting a thickness of the phosphor layer by maintaining a uniform distance between the first substrate and the second substrate. Each of the first substrate and the second substrate has a thermal conductivity higher than a thermal conductivity of the phosphor layer. The gap-maintaining component is a plurality of thickness adjustment particles that are light-transmissive and have a shape having a substantially equal diameter, and the shape is one of wire-shaped, ring-shaped, and protruding.
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公开(公告)号：US10677437B2
公开(公告)日：2020-06-09
申请号：US16322145
申请日：2017-09-14
Inventor： Masahito Yamana , Noboru Iizawa , Shintaro Hayashi , Yoshiyuki Nakano
IPC: F21V9/16 , F21V29/502 , H01S5/06 , H01L33/50 , G02B5/20 , F21V13/02 , F21V9/30 , F21Y115/30 , F21V29/89 , F21V29/70 , F21V5/04
Abstract: A wavelength conversion device, etc., for laser light according to the present disclosure includes: a first substrate that is light-transmissive; a second substrate that is light-transmissive; and a phosphor layer provided between the first substrate and the second substrate and including a phosphor that converts the wavelength of incident laser light having a predetermined wavelength. The laser light has a laser irradiation power density of at least 0.03 W/mm2, and each of the first substrate and the second substrate has a thermal conductivity higher than the thermal conductivity of the phosphor layer.
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公开(公告)号：US10342419B2
公开(公告)日：2019-07-09
申请号：US15875377
申请日：2018-01-19
Inventor： Shintaro Hayashi
IPC: A61B1/06 , A61B1/04 , G02B23/24 , A61B1/00 , A61B1/12 , G02B6/38 , G02B23/26 , G02B6/42 , G02B6/06 , H04N5/225
Abstract: An endoscope lighting device to be used for an endoscope is provided. The endoscope lighting device includes a housing. A laser light source is in the housing. A fiber cable receives laser light emitted by the laser light source. A phosphor of a fluorescent light emitter emits fluorescent light using the laser light exiting from the fiber cable. A blower generates airflow in the housing. A shakable body contacts the fiber cable and shakes in reaction to the airflow generated by the blower.
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公开(公告)号：US10094521B2
公开(公告)日：2018-10-09
申请号：US15657610
申请日：2017-07-24
Inventor： Shintaro Hayashi
Abstract: A light-emitting apparatus includes a first light guide, a converter, a second light guide, and a return. The first light guide includes a first photoreceptor, a second photoreceptor, and a leak. The first light guide guides first light radiated by a radiation apparatus and received by the first photoreceptor and the second photoreceptor. The leak allows second light to be leaked out in a direction crossing a light-guiding direction. The second light is part of the first light. The converter is disposed along the first light guide and converts a wavelength of the second light leaked out of the first light guide. The second light guide does not include the leak and guides third light radiated by the radiation apparatus toward the second photoreceptor. The return returns the third light guided by the second light guide.
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