公开(公告)号：US20170047783A1

公开(公告)日：2017-02-16

申请号：US15081092

申请日：2016-03-25

Applicant: QUALCOMM Incorporated

Inventor： Sumukh Ashok Shevde ,  Francesco Carobolante ,  Joseph Najib Maalouf

IPC: H02J50/12

CPC classification number: H02J50/12 ,  H04B5/0037

Abstract: An apparatus for receiving wireless power is provided. The apparatus comprises a coupler configured to receive a first amount of wireless power via a wireless field generated by a wireless power transmitter. The apparatus comprises a sensor circuit configured to measure the first amount of wireless power. The apparatus comprises a controller configured to instruct a feedback circuit to provide an indication to a user based on a comparison of the first amount of wireless power measured by the sensor circuit to a power threshold.

Abstract translation: 提供了一种用于接收无线电力的装置。 该装置包括被配置为经由无线电力发射机产生的无线电场接收第一数量的无线电力的耦合器。 该装置包括被配置为测量第一数量的无线功率的传感器电路。 该装置包括控制器，其被配置为基于由传感器电路测量的第一无线功率量与功率阈值的比较来指示反馈电路向用户提供指示。

公开(公告)号：US20150334847A1

公开(公告)日：2015-11-19

申请号：US14811813

申请日：2015-07-28

Applicant: QUALCOMM Incorporated

Inventor： Changhan Yun ,  Francesco Carobolante ,  Chengjie Zuo ,  Jonghae Kim ,  Mario Francisco Velez ,  Lawrence D. Smith ,  Matthew M. Nowak

IPC: H05K3/10 ,  H05K3/00 ,  H05K3/30

CPC classification number: H05K1/165 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/19105 ,  H05K1/0231 ,  H05K1/0243 ,  H05K1/0262 ,  H05K3/0091 ,  H05K3/10 ,  H05K3/30 ,  H05K7/1092 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49147 ,  Y10T29/49156

Abstract: A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage regulator. The two-stage power delivery network also includes a semiconductor die supported by the packaging substrate. The two-stage power delivery network also includes a capacitor that is supported by the packaging substrate. The capacitor is operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator.

Abstract translation: 两级供电网络包括电压调节器和插入器。 插入器包括具有嵌入式电感器的封装衬底。 嵌入式电感器包括一组迹线和一组在迹线的相对端处的通过衬底通孔。 插入器耦合到电压调节器。 两级供电网络还包括由封装基板支撑的半导体管芯。 两级供电网络还包括由包装基板支撑的电容器。 电容器可操作以提供与半导体管芯相关联的去耦电容和电容，以降低电压调节器的开关噪声。

公开(公告)号：US09101068B2

公开(公告)日：2015-08-04

申请号：US13830033

申请日：2013-03-14

Applicant: QUALCOMM Incorporated

Inventor： Changhan Yun ,  Francesco Carobolante ,  Chengjie Zuo ,  Jonghae Kim ,  Mario Francisco Velez ,  Lawrence D. Smith ,  Matthew M. Nowak

IPC: H05K7/00 ,  H05K7/10 ,  H05K1/02 ,  H05K1/16 ,  H01L23/498

CPC classification number: H05K1/165 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/19105 ,  H05K1/0231 ,  H05K1/0243 ,  H05K1/0262 ,  H05K3/0091 ,  H05K3/10 ,  H05K3/30 ,  H05K7/1092 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49147 ,  Y10T29/49156

Abstract: A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage regulator. The two-stage power delivery network also includes a semiconductor die supported by the packaging substrate. The two-stage power delivery network also includes a capacitor that is supported by the packaging substrate. The capacitor is operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator.

Abstract translation: 两级供电网络包括电压调节器和插入器。 插入器包括具有嵌入式电感器的封装衬底。 嵌入式电感器包括一组迹线和一组在迹线的相对端处的通过衬底通孔。 插入器耦合到电压调节器。 两级供电网络还包括由封装基板支撑的半导体管芯。 两级供电网络还包括由包装基板支撑的电容器。 电容器可操作以提供与半导体管芯相关联的去耦电容和电容，以降低电压调节器的开关噪声。

公开(公告)号：US20150084586A1

公开(公告)日：2015-03-26

申请号：US14273234

申请日：2014-05-08

Applicant: QUALCOMM Incorporated

Inventor： William Henry Von Novak, III ,  Francesco Carobolante ,  Weston Daniel Braun

IPC: H02J7/02

CPC classification number: H02J50/90 ,  H02J7/025 ,  H02J17/00 ,  H02J50/12 ,  H02J50/40 ,  H02J50/60

Abstract: Exemplary embodiments are directed to detection and validation of wirelessly chargeable devices positioned within a charging region of a wireless power transmitter. A device may include a detection circuit comprising an oscillator, the detection circuit configured to detect a change in a frequency of the oscillator. The device may also include a wireless power transmitter configured to determine whether a chargeable device is positioned within a charging region of the transmitter upon the detection circuit detecting the change in the frequency of the oscillator, wherein the transmitter further configured to be selectively electrically isolated from the detection circuit.

Abstract translation: 示例性实施例涉及位于无线功率发射器的充电区域内的无线可充电装置的检测和验证。 设备可以包括检测电路，该检测电路包括振荡器，该检测电路被配置为检测振荡器的频率变化。 所述设备还可以包括无线电力发射机，其被配置为在所述检测电路检测所述振荡器的频率的变化时，确定所述可充电设备是否位于所述发射机的充电区域内，其中所述发射机还被配置为选择性地电隔离 检测电路。

公开(公告)号：US20140167273A1

公开(公告)日：2014-06-19

申请号：US13719984

申请日：2012-12-19

Applicant: QUALCOMM INCORPORATED

Inventor： Jonghae Kim ,  Chengjie Zuo ,  Changhan Yun ,  Mario Francisco Velez ,  Ravindra V. Shenoy ,  Matthew M. Nowak ,  Francesco Carobolante ,  Kyu-Pyung Hwang ,  Dong Wook Kim ,  Young K. Song

IPC: H01L23/482 ,  H01L23/00

CPC classification number: H01L21/6836 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L2221/68345 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/1517 ,  H01L2924/181 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10015 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: One feature pertains to a multi-layer package substrate of an integrated circuit package that comprises a discrete circuit component (DCC) having at least one electrode. The DCC is embedded within an insulator layer, and a via coupling component electrically couples to the electrode. A first portion of the via coupling component extends beyond a first edge of the electrode, and a plurality of vias each having a first end couple to the first via coupling component. At least a first via of the plurality of vias couples to the first portion of the via coupling component that extends beyond the first edge of the electrode. Moreover, the plurality of vias each have a second end that electrically couple to a first outer metal layer, and at least a second portion of the via coupling component is positioned within a first inner metal layer.

Abstract translation: 一个特征涉及集成电路封装的多层封装衬底，其包括具有至少一个电极的分立电路部件（DCC）。 DCC嵌入在绝缘体层内，并且通孔耦合部件电耦合到电极。 通孔耦合部件的第一部分延伸超过电极的第一边缘，并且多个通孔各自具有耦合到第一通路耦合部件的第一端。 多个通孔中的至少第一通孔耦合到延伸超出电极的第一边缘的通孔连接部件的第一部分。 此外，多个通孔各自具有电耦合到第一外部金属层的第二端，并且通孔连接部件的至少第二部分位于第一内部金属层内。

公开(公告)号：US10418465B1

公开(公告)日：2019-09-17

申请号：US15969986

申请日：2018-05-03

Applicant: QUALCOMM Incorporated

Inventor： Qingqing Liang ,  Francesco Carobolante ,  Sinan Goktepeli ,  George Imthurn ,  Fabio Alessio Marino ,  Narasimhulu Kanike

IPC: H01L29/792 ,  H01L29/66 ,  H01L29/788 ,  H01L27/11556 ,  G11C16/34 ,  G11C16/04 ,  H01L27/105 ,  H01L27/11 ,  H01L29/78

Abstract: Certain aspects of the present disclosure provide a memory device. One example memory device generally includes a first semiconductor region having a first region, a second region, and a third region, the second region being between the first region and the third region and having a different doping type than the first region and the third region. In certain aspects, the memory device also includes a first non-insulative region, a first insulative region being disposed between the first non-insulative region and the first semiconductor region. In certain aspects, the memory device may include a second non-insulative region, and a second insulative region disposed between the second region and the second non-insulative region, wherein the first insulative region and the second insulative region are disposed adjacent to opposite sides of the second region.

公开(公告)号：US10340395B2

公开(公告)日：2019-07-02

申请号：US15583289

申请日：2017-05-01

Applicant: QUALCOMM Incorporated

Inventor： Xia Li ,  Fabio Alessio Marino ,  Qingqing Liang ,  Francesco Carobolante ,  Seung Hyuk Kang

IPC: H01L29/06 ,  H01L29/93 ,  H01L29/66 ,  H01L29/94 ,  H01L29/36

Abstract: Certain aspects of the present disclosure generally relate to a semiconductor variable capacitor, and techniques for fabricating the same, implemented using a threshold voltage implant region. For example, the semiconductor variable capacitor generally includes a first non-insulative region disposed above a first semiconductor region, a second non-insulative region disposed above the first semiconductor region, and a threshold voltage (Vt) implant region interposed between the first non-insulative region and the first semiconductor region and disposed adjacent to the second non-insulative region. In certain aspects, the semiconductor variable capacitor also includes a control region disposed above the first semiconductor region such that a capacitance between the first non-insulative region and the second non-insulative region is configured to be adjusted by varying a control voltage applied to the control region.

公开(公告)号：US10128663B2

公开(公告)日：2018-11-13

申请号：US14528634

申请日：2014-10-30

Applicant: QUALCOMM Incorporated

Inventor： Seong Heon Jeong ,  Francesco Carobolante

IPC: H02J5/00 ,  H01F38/14 ,  H02J7/02 ,  H02J17/00

Abstract: A wireless power transfer system may include a primary resonator and one or more secondary resonators. At least one of the secondary resonators lie in overlapping relation to the primary resonator. An electromagnetic (EM) field generated by the primary resonator can couple to the secondary resonators, thus inducing current flow in the secondary resonators. EM fields generated by the secondary resonators interact with the EM field from the primary resonator to produce a resultant EM field.

公开(公告)号：US09985442B2

公开(公告)日：2018-05-29

申请号：US14863538

申请日：2015-09-24

Applicant: QUALCOMM Incorporated

Inventor： William Henry Von Novak, III ,  Francesco Carobolante ,  Linda Stacey Irish ,  Charles Edward Wheatley ,  Paolo Menegoli

IPC: H02J5/00

CPC classification number: H02J5/005 ,  H02J7/025 ,  H02J50/12 ,  H02J50/80

Abstract: An apparatus for wirelessly receiving power via a wireless field generated by a transmitter includes a resonator configured to generate electrical current to power or charge a load based on a voltage induced in the resonator in response to the wireless field, a first variable capacitor electrically coupled to the resonator and configured to adjust a first capacitance of the first variable capacitor responsive to a first control signal, a second variable capacitor electrically coupled to the resonator and configured to adjust a second capacitance of the second variable capacitor responsive to a second control signal, and a control circuit configured to adjust and apply the first control signal and the second control signal to the first variable capacitor and the second variable capacitor, respectively, to adjust a resonant frequency of the resonator and a voltage output to the load based on an electrical characteristic indicative of a level of power output to the load.

公开(公告)号：US09960608B2

公开(公告)日：2018-05-01

申请号：US15061759

申请日：2016-03-04

Applicant: QUALCOMM Incorporated

Inventor： Linda Stacey Irish ,  Francesco Carobolante ,  Gabriel Isaac Mayo

IPC: H01H19/64 ,  H02J5/00 ,  H02J50/12 ,  H02J7/02 ,  H02M1/12 ,  H02M7/217 ,  H02M7/219 ,  H02J50/10 ,  H02M7/483 ,  H02M1/00

CPC classification number: H02J5/005 ,  H02J7/025 ,  H02J50/10 ,  H02J50/12 ,  H02M1/12 ,  H02M7/217 ,  H02M7/219 ,  H02M7/483 ,  H02M2001/0058 ,  Y02B70/1491

Abstract: A multi-level rectifier is presented that is suitable for use at high frequencies, including into MHz range such as in the 6.78 MHz band used for wireless power transfer. To maintain the proper timing or switching waveform when operating at high frequencies, a feedback loop is used. The rectification circuit includes a multi-level waveform generator circuit that generates a multi-level control waveform from the input waveform and an indication of its current. The multi-level control waveform is maintained in phase with the input waveform. A control signal generation circuit receives the multi-level control waveform and generates control signals corresponding to levels of the multi-level control waveform. A synchronous rectifier receives the input waveform and includes a plurality of switches to provide an output voltage generated from the input waveform. The switches are coupled to receive the control signals and the output voltage is a function of the multi-level control waveform.