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公开(公告)号：US09105800B2
公开(公告)日：2015-08-11
申请号：US14100048
申请日：2013-12-09
申请人： Raytheon Company
IPC分类号： H01L31/18 , H01L31/0232
CPC分类号： H01L31/18 , B81C1/00373 , B81C2201/0188 , H01L31/02327
摘要： A method for forming a coating of material on selected portions of a surface of a substrate having a plurality of cavities, each cavity having outer, peripheral sidewalls extending outwardly from the surface. The method includes: providing a structure having a release agent thereon; contacting top surface of the wafer with the release agent to transfer portions of the release agent to the top surface of the wafer while bottom portions of the cavities remain spaced from the release agent to produce an intermediate structure; the release agent disposed on the top surface of the wafer and with the bottom portions of the cavities void of the release agent; exposing the intermediate structure to the material to blanket coat the material on both the release agent and the bottom portions of the cavities; and selectively removing the release agent together with the coating material while leaving the coating material on the bottom portions of the cavities.
摘要翻译： 一种用于在具有多个空腔的基板的表面的选定部分上形成材料涂层的方法，每个空腔具有从表面向外延伸的外部周边侧壁。 该方法包括：提供其上具有脱模剂的结构; 使所述晶片的顶表面与所述脱模剂接触以将所述脱模剂的部分转移到所述晶片的顶表面，同时所述空腔的底部保持与所述脱模剂间隔开以产生中间结构; 所述脱模剂设置在所述晶片的顶表面上，并且所述空腔的底部部分脱离所述脱模剂; 将所述中间结构暴露于所述材料以在所述空腔的所述脱模剂和所述底部两者上均匀地涂覆所述材料; 并且与涂料一起选择性地除去脱模剂，同时将涂料留在空腔的底部。
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公开(公告)号：US20140346643A1
公开(公告)日：2014-11-27
申请号：US14456156
申请日：2014-08-11
申请人： Raytheon Company
IPC分类号： B81B7/00
CPC分类号： B81B7/0041 , B81B7/007 , B81C1/00269 , B81C2203/019 , H01L23/053 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/27444 , H01L2224/27462 , H01L2224/27464 , H01L2224/29011 , H01L2224/291 , H01L2224/83001 , H01L2224/83007 , H01L2224/83139 , H01L2224/8314 , H01L2224/83141 , H01L2224/83192 , H01L2924/1461 , H01L2924/163 , H01L2924/00014 , H01L2924/014
摘要： A method of forming a wafer level packaged circuit device includes forming a device wafer, the device wafer including a first group of one or more material layers left remaining in a first region of a substrate of the device wafer; and forming a cap wafer configured to be attached to the device wafer, the cap wafer including a second group of one or more material layers left remaining in a second region of a substrate of the cap wafer; wherein a combined thickness of the first and second groups of one or more material layers defines an integrated bond gap control structure upon bonding of the device wafer and the cap wafer.
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13.发明申请METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WAFER LEVEL PACKAGED INFRARED FOCAL PLANE ARRAYS 有权用于水平包装的红外焦平面阵列的抗反射涂层盖子中的应力消除方法公开(公告)号：US20140053966A1
公开(公告)日：2014-02-27
申请号：US13688714
申请日：2012-11-29
申请人： RAYTHEON COMPANY
IPC分类号： B05D5/06
CPC分类号： B81C1/00325 , B05D5/061 , B81B7/0067 , B81B2201/0207 , B81C2203/0118
摘要： Methods for reducing wafer bow induced by an anti-reflective coating of a cap wafer are provided. The method may utilize a shadow mask having at least one opening therein that is positioned opposite recessed regions in a cap wafer. The method may further include depositing at least one layer of an anti-reflective coating material through the shadow mask onto a planar side of a cap wafer to provide a discontinuous coating on the planar side.
摘要翻译： 提供了通过盖晶片的抗反射涂层引起的减少晶片弓的方法。 该方法可以利用其中具有至少一个开口的荫罩，其位于帽晶片中的相对凹陷区域。 该方法还可以包括将至少一层抗反射涂层材料通过荫罩沉积到盖晶片的平面侧上，以在平面侧上提供不连续的涂层。
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公开(公告)号：US20130334635A1
公开(公告)日：2013-12-19
申请号：US13628248
申请日：2012-09-27
申请人： RAYTHEON COMPANY
发明人： Adam M. Kennedy , Stephen H. Black
IPC分类号： H01L31/02
CPC分类号： G01J5/045 , G01J5/0285 , G01J5/20
摘要： A pixel structure, which may be used for infrared bolometers or other microelectromechanical systems (MEMS) devices, configured to increase immunity of the pixel to molecular heat transfer and reduce the vacuum requirements for a wafer level packaged device incorporating the pixel or an array thereof. In one example, the pixel has a perforated body or discontinuous surface structure.
摘要翻译： 可用于红外测辐射热计或其他微机电系统（MEMS）装置的像素结构，其被配置为增加像素对分子热传递的免疫力，并降低结合有像素或其阵列的晶片级封装装置的真空要求。 在一个示例中，像素具有穿孔体或不连续表面结构。
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公开(公告)号：US20220310690A1
公开(公告)日：2022-09-29
申请号：US17212085
申请日：2021-03-25
申请人： Raytheon Company
发明人： David J. Gulbransen , Sean P. Kilcoyne , Eric Miller , Matthew D. Chambers , Eric J. Beuville , Andrew E. Gin , Adam M. Kennedy
IPC分类号： H01L27/146 , H01L21/66 , H01L23/00
摘要： A focal plane array includes a mosaic integrated circuit device having a plurality of discrete integrated circuit tiles mounted on a motherboard. The focal plane array includes an optically continuous detector array electrically connected to the mosaic integrated circuit device with an interposer disposed therebetween. The interposer is configured to adjust a pitch of the continuous detector array to match a pitch of each of the plurality of discrete integrated circuit tiles so that the optical gaps between each of the plurality of integrated circuit tiles on the motherboard are minimized and the detector array is optically continuous, having high yield over the large format focal plane array.
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公开(公告)号：US10262913B2
公开(公告)日：2019-04-16
申请号：US15942911
申请日：2018-04-02
申请人： RAYTHEON COMPANY
IPC分类号： H01L23/48 , H01L23/10 , H01L23/498 , H01L21/768 , B81B7/00 , H01L23/26 , H01L27/146 , B81C1/00 , H01L21/52
摘要： An electronic device and methods of manufacture thereof. One or more methods may include providing a lid wafer having a cavity and a surface surrounding the cavity and a device wafer having a detector device and a reference device. In certain examples, a solder barrier layer of titanium material may be deposited onto the surface of the lid wafer. The solder barrier layer of titanium material may further be activated to function as a getter. In various examples, the lid wafer and the device wafer may be bonded together using solder, and the solder barrier layer of titanium material may prevent the solder from contacting the surface of the lid wafer.
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公开(公告)号：US20170148695A1
公开(公告)日：2017-05-25
申请号：US15402329
申请日：2017-01-10
申请人： RAYTHEON COMPANY
发明人： Stephen H. Black , Adam M. Kennedy
CPC分类号： H01L23/26 , H01L21/3221 , H01L21/3225 , H01L21/4817 , H01L21/54 , H01L23/041 , H01L23/10
摘要： A surface defined by a wafer level package (WLP) region and an external region, and A system and method for forming a wafer level package. In one example, a substrate used in the wafer level package includes a layer of getter material is disposed on at least a portion of the external region. According to one embodiment, the external region comprises a saw-to-reveal (STR) region of the wafer.
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公开(公告)号：US20170129775A1
公开(公告)日：2017-05-11
申请号：US15416206
申请日：2017-01-26
申请人： Raytheon Company
发明人： Buu Q. Diep , Adam M. Kennedy , Thomas Allan Kocian , Mark Lamb
CPC分类号： B81B7/0058 , B81B7/0041 , B81B2201/0207 , B81B2201/04 , B81C1/00269 , B81C1/00317 , B81C2203/0109 , B81C2203/0118 , B81C2203/0145 , B81C2203/019
摘要： A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.
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19.发明授权Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling 有权晶圆级封装红外（IR）焦平面阵列（FPA）与ev逝波耦合公开(公告)号：US09227839B2
公开(公告)日：2016-01-05
申请号：US14270945
申请日：2014-05-06
申请人： Raytheon Company
CPC分类号： B81B7/0067 , B81B7/0035 , B81B2201/0207 , B81C1/00317 , G01J5/045 , G01J5/08 , G01J5/20 , H01L37/00
摘要： A structure for detecting electromagnetic radiation having a predetermined wavelength. The structure includes a device wafer having a sensing element disposed on a predetermined region of a surface of the device wafer responsive to the electromagnetic radiation. A cover wafer is provided having a region thereof transparent to the electromagnetic radiation for passing the electromagnetic radiation through the transparent region onto a surface of the sensing element. A bond gap spacer structure is provided for supporting the surface of the sensing element from an opposing surface of the transparent region of the cover wafer a distance less than a fraction of the predetermined wavelength when the cover wafer is bonded to the device wafer.
摘要翻译： 一种用于检测具有预定波长的电磁辐射的结构。 该结构包括具有传感元件的器件晶片，其响应于电磁辐射而设置在器件晶片的表面的预定区域上。 提供了覆盖晶片，其具有对电磁辐射透明的区域，以将电磁辐射穿过透明区域传递到感测元件的表面上。 提供了一种键间隔结构，用于当覆盖晶片接合到器件晶片时，从盖晶片的透明区域的相对表面支撑感测元件的表面，该距离小于预定波长的一小部分。
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公开(公告)号：US20150249042A1
公开(公告)日：2015-09-03
申请号：US14193437
申请日：2014-02-28
申请人： Raytheon Company
CPC分类号： C23C14/28 , B32B3/10 , B32B15/04 , B32B2255/205 , B32B2457/00 , C23C14/06 , G01J5/045 , H01L23/26 , H01L2924/0002 , Y10T428/24802 , H01L2924/00
摘要： A getter structure and method wherein a layer of seed material is deposited on a predetermined region of a surface of a structure under conditions to form a plurality of nucleation sites on a surface of the structure. The nucleation sites have an average height over the surface area of the predetermined region of less than one molecule thick. Subsequently a getter material is deposited over the surface to form a plurality of getter material members projecting outwardly from the nucleation sites.
摘要翻译： 一种吸气剂结构和方法，其中在结构的表面上形成多个成核位置的条件下，将种子材料层沉积在结构的表面的预定区域上。 成核位置具有小于一分子厚的预定区域的表面积的平均高度。 随后，吸气剂材料沉积在表面上以形成从成核位置向外突出的多个吸气材料构件。
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