公开(公告)号：US20230209728A1

公开(公告)日：2023-06-29

申请号：US18173390

申请日：2023-02-23

Applicant: RAYTHEON COMPANY

Inventor： Mikhail Pevzner ,  Gregory G. Beninati ,  James E. Benedict ,  Andrew R. Southworth

IPC: H05K3/46

CPC classification number: H05K3/465 ,  H05K3/4679

Abstract: A process of fabricating an electromagnetic circuit includes providing three laminate sheets, forming a first feature in a first laminate sheet of the three laminate sheets, and forming a second feature in a second laminate sheet of the three laminate sheets. The second feature is aligned with the first feature when aligning the second laminate sheet with the first laminate sheet. The process further includes stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with the third laminate sheet. The first feature and the second feature define a contiguous element. The process further includes filling the contiguous element with an electrically conductive material to form an electrically continuous conductor.

公开(公告)号：US11606865B2

公开(公告)日：2023-03-14

申请号：US16678188

申请日：2019-11-08

Applicant: RAYTHEON COMPANY

Inventor： Mikhail Pevzner ,  Gregory G. Beninati ,  James E. Benedict ,  Andrew R. Southworth

IPC: H05K3/46

Abstract: A process of fabricating an electromagnetic circuit includes providing three laminate sheets, forming a first feature in a first laminate sheet of the three laminate sheets, and forming a second feature in a second laminate sheet of the three laminate sheets. The second feature is aligned with the first feature when aligning the second laminate sheet with the first laminate sheet. The process further includes stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with the third laminate sheet. The first feature and the second feature define a contiguous element. The process further includes filling the contiguous element with an electrically conductive material to form an electrically continuous conductor.

公开(公告)号：US20210296751A1

公开(公告)日：2021-09-23

申请号：US16822399

申请日：2020-03-18

Applicant: RAYTHEON COMPANY

Inventor： JAMES BENEDICT ,  Erika Klek ,  John P. Haven ,  Michael Souliotis ,  Thomas V. Sikina ,  Andrew R. Southworth ,  Kevin Wilder

IPC: H01P5/08 ,  H01P3/08

Abstract: A RAMP-radio frequency (RAMP-RF) assembly is provided and includes an RF panel including a microstrip interface, a plate including a stripline interface and a microstrip-to-stripline transition element operably connectable to the microstrip interface and to the stripline interface.

公开(公告)号：US11107610B2

公开(公告)日：2021-08-31

申请号：US16901429

申请日：2020-06-15

Applicant: Raytheon Company ,  University of Massachusetts

Inventor： Erika C. Klek ,  Mary K. Herndon ,  Thomas V. Sikina ,  James E. Benedict ,  Andrew R. Southworth ,  Kevin M. Wilder ,  Oshadha K. Ranasingha ,  Alkim Akyurtlu

IPC: H01C7/00 ,  H01B3/10 ,  H01C17/065

Abstract: A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250° C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. Blending the dielectric material with the carbon-based ink causes the modified carbon-based ink to have a resistivity that is at least double a resistivity of the carbon-based ink.

公开(公告)号：US20210051805A1

公开(公告)日：2021-02-18

申请号：US16541789

申请日：2019-08-15

Applicant: RAYTHEON COMPANY

Inventor： Mikhail Pevzner ,  James E. Benedict ,  Andrew R. Southworth ,  Thomas V. Sikina ,  Kevin Wilder ,  Matthew Souza ,  Aaron Michael Torberg

IPC: H05K3/10 ,  B21F11/00

Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

公开(公告)号：US20190269007A1

公开(公告)日：2019-08-29

申请号：US16287240

申请日：2019-02-27

Applicant: RAYTHEON COMPANY

Inventor： Thomas V. Sikina ,  James E. Benedict ,  John P. Haven ,  Andrew R. Southworth ,  Semira M. Azadzoi

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/04 ,  H05K3/36 ,  H05K3/00 ,  H05K3/40

Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.

公开(公告)号：US12021306B2

公开(公告)日：2024-06-25

申请号：US17511153

申请日：2021-10-26

Applicant: Raytheon Company

Inventor： Thomas V. Sikina ,  John P. Haven ,  James E. Benedict ,  Jonathan E. Nufio-Molina ,  Andrew R. Southworth

IPC: H01Q21/00 ,  B33Y10/00 ,  B33Y80/00 ,  H01P1/04 ,  H01P5/02 ,  H01Q1/42 ,  H01Q1/44 ,  H01Q1/52 ,  H01Q13/10 ,  H01Q13/18 ,  H01Q17/00 ,  H05K1/02 ,  H05K3/40

CPC classification number: H01Q21/0087 ,  H01P1/047 ,  H01P5/028 ,  H01Q1/42 ,  H01Q1/44 ,  H01Q1/523 ,  H01Q1/526 ,  H01Q13/10 ,  H01Q13/106 ,  H01Q13/18 ,  H01Q17/001 ,  H01Q17/008 ,  H01Q21/0075 ,  H05K1/0219 ,  H05K3/4038 ,  B33Y10/00 ,  B33Y80/00

Abstract: A low profile array (LPA) includes an antenna element array layer having at least one Faraday wall, and a beamformer circuit layer coupled to the antenna element array layer. The beamformer circuit layer has at least one Faraday wall. The Faraday walls extends between ground planes associated with at least one of the antenna element array layer and the beamformer circuit layer.

公开(公告)号：US11653484B2

公开(公告)日：2023-05-16

申请号：US16678211

申请日：2019-11-08

Applicant: RAYTHEON COMPANY

Inventor： Mikhail Pevzner ,  James E. Benedict ,  Andrew R. Southworth ,  Wade A. Schwanda

IPC: H05K13/04 ,  H05K3/46 ,  H05K3/38 ,  H05K3/00 ,  B29C64/379 ,  B25J18/00

CPC classification number: H05K13/0409 ,  H05K3/38 ,  H05K3/465 ,  H05K3/4638 ,  H05K3/4679 ,  H05K13/0413 ,  B25J18/00 ,  B29C64/379 ,  B32B2457/08 ,  H05K3/0008 ,  H05K2203/167

Abstract: An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.

公开(公告)号：US20230121347A1

公开(公告)日：2023-04-20

申请号：US18068578

申请日：2022-12-20

Applicant: RAYTHEON COMPANY

Inventor： Andrew R. Southworth ,  Thomas V. Sikina ,  John P. Haven ,  James E. Benedict ,  Kevin Wilder

IPC: H05K3/34 ,  H05K3/00 ,  H05K3/42 ,  H05K3/40 ,  H01P5/02 ,  H01P1/04 ,  H05K1/02

Abstract: Electromagnetic circuit structures and methods are provided for a circuit board that includes a hole disposed through a substrate to provide access to an electrical component, such as a signal trace line (or stripline), that is at least partially encapsulated (e.g., sandwiched) between substrates. The electrical component includes a portion substantially aligned with the hole, and an electrical conductor is disposed within the hole. The electrical conductor is soldered to the portion of the electrical component.

公开(公告)号：US20210368629A1

公开(公告)日：2021-11-25

申请号：US17395977

申请日：2021-08-06

Applicant: RAYTHEON COMPANY

Inventor： Mikhail Pevzner ,  James E. Benedict ,  Andrew R. Southworth ,  Thomas V. Sikina ,  Kevin Wilder ,  Matthew Souza ,  Aaron Michael Torberg

IPC: H05K3/10 ,  B21F11/00

Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.