公开(公告)号：US20180042118A1

公开(公告)日：2018-02-08

申请号：US15670627

申请日：2017-08-07

Applicant: ROHM CO., LTD.

Inventor： Yasuhiro KONDO ,  Katsuya MATSUURA ,  Hiroshi TAMAGAWA

IPC: H05K3/04 ,  H01L23/66 ,  H05K13/02 ,  H05K3/00 ,  B23K1/005

CPC classification number: H05K3/045 ,  B23K1/0056 ,  H01L21/6836 ,  H01L21/71 ,  H01L21/78 ,  H01L22/12 ,  H01L23/3185 ,  H01L23/3192 ,  H01L23/564 ,  H01L23/66 ,  H01L24/03 ,  H01L24/05 ,  H01L2221/68327 ,  H01L2224/03462 ,  H01L2224/0348 ,  H01L2224/0401 ,  H01L2224/05164 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05644 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/94 ,  H01L2924/10158 ,  H05K1/0274 ,  H05K3/002 ,  H05K3/0044 ,  H05K13/024 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2924/014

Abstract: A chip part includes a substrate having a first main surface on one side thereof and a second main surface on the other side thereof, a functional device famed at a first main surface side of the substrate, an external terminal formed at the first main surface side of the substrate and electrically connected to the functional device, and a light diffusion reflection structure formed at a second main surface side of the substrate and diffusely reflecting light irradiated toward the second main surface of the substrate.

公开(公告)号：US20170365655A1

公开(公告)日：2017-12-21

申请号：US15647592

申请日：2017-07-12

Applicant: ROHM CO., LTD.

Inventor： Hiroshi TAMAGAWA ,  Yasuhiro KONDO ,  Yasuhiro FUWA ,  Hiroyuki OKADA ,  Eiji NUKAGA ,  Katsuya MATSUURA

IPC: H01L49/02 ,  H01C13/02 ,  H01L21/3065 ,  H01L27/08 ,  H01L27/06 ,  H01L21/308 ,  H01C1/14 ,  H05K3/34 ,  H01C17/00 ,  H01C17/242

CPC classification number: H01L28/20 ,  H01C1/14 ,  H01C13/02 ,  H01C17/006 ,  H01C17/242 ,  H01L21/3065 ,  H01L21/3083 ,  H01L27/0676 ,  H01L27/0802 ,  H05K3/3431 ,  H05K2201/10674

Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.

公开(公告)号：US20150332842A1

公开(公告)日：2015-11-19

申请号：US14713684

申请日：2015-05-15

Applicant: ROHM CO., LTD.

Inventor： Takuma SHIMOICHI ,  Yasuhiro KONDO ,  Keishi WATANABE ,  Takamichi TORII ,  Katsuya MATSUURA

IPC: H01F27/29 ,  H01F27/28 ,  H01G4/30 ,  H01G4/228 ,  H01C1/01 ,  H01C1/14

CPC classification number: H01C1/01 ,  H01C1/02 ,  H01C1/14 ,  H01C1/142 ,  H01C7/006 ,  H01C13/02 ,  H01C17/267 ,  H01F17/0006 ,  H01F27/2804 ,  H01F27/292 ,  H01F2017/0026 ,  H01G4/228 ,  H01G4/30 ,  H01G4/33 ,  H01L23/5228 ,  H01L23/647 ,  H01L28/20 ,  H05K1/0293 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167

Abstract: A chip part is provided that includes a substrate 2 in which an element region 5 and an electrode region 16 are set, an insulating film (a first insulating film 9 and a second insulating film 3) which is formed on the substrate 2 and which selectively includes an internal concave/convex structure 18 in the electrode region 16 on a surface, a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering the concave portion 17 of the internal concave/convex structure 18 and which include an external concave/convex structure 6, 7 on a surface on the opposite side and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.

Abstract translation: 提供了芯片部件，其包括其中设置有元件区域5和电极区域16的基板2，形成在基板2上的绝缘膜（第一绝缘膜9和第二绝缘膜3），并且选择性地 包括在表面上的电极区域16中的内部凹凸结构18，第一连接电极3和第二连接电极4，第一连接电极3和第二连接电极4在底部包括进入内凹/ 凸形结构18，其在相反侧的表面上包括外部凹凸结构6,7，以及设置在元件区域5中并与第一连接电极3和第二连接电极电连接的电路元件 4。