公开(公告)号：US10553641B2

公开(公告)日：2020-02-04

申请号：US15933967

申请日：2018-03-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Hye Yeon ,  Sung Hyun Sim ,  Wan Tae Lim ,  Yong Il Kim ,  Hanul Yoo

IPC: H01L27/15 ,  H01L33/50

Abstract: A light emitting device package includes a substrate for growth having a plurality of light-emitting windows, a plurality of semiconductor light-emitting units corresponding to the plurality of light-emitting windows, each semiconductor light-emitting unit having a first surface contacting the substrate for growth and a second surface opposite the first surface, and each semiconductor light-emitting unit having a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer stacked on each other, a plurality of wavelength conversion units respectively disposed inside the plurality of light-emitting windows, each wavelength conversion unit is configured to provide light having a wavelength different from light emitted by the respective semiconductor light-emitting unit, a metal support layer disposed on at least one surface of each of the plurality of semiconductor light-emitting units and having a lateral surface coplanar with a lateral surface of the substrate for growth, and an insulating layer disposed between each of the plurality of semiconductor light-emitting units and a respective metal support layer.

公开(公告)号：US10326061B2

公开(公告)日：2019-06-18

申请号：US15486982

申请日：2017-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wan Tae Lim ,  Sung Hyun Sim ,  Hanul Yoo ,  Yong Il Kim ,  Hye Seok Noh ,  Ji Hye Yeon

IPC: H01L33/50 ,  H01L27/15 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62

Abstract: A method of fabricating a light emitting device package includes forming a plurality of semiconductor light emitting parts, each having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on a growth substrate, forming a partition structure having a plurality of light emitting windows on the growth substrate, filling each of the plurality of light emitting windows with a resin having a phosphor, and forming a plurality of wavelength conversion parts by planarizing a surface of the resin.

公开(公告)号：US09660139B2

公开(公告)日：2017-05-23

申请号：US15018026

申请日：2016-02-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Geon Wook Yoo ,  Kyung Wook Hwang ,  Yong Min Kim ,  Sung Hyun Sim

IPC: H01L33/00 ,  H01L33/06 ,  H01L33/18 ,  H01L33/08 ,  H01L33/14 ,  B82Y20/00 ,  H01L33/24 ,  H01L33/52

CPC classification number: H01L33/06 ,  B82Y20/00 ,  H01L33/0025 ,  H01L33/08 ,  H01L33/145 ,  H01L33/18 ,  H01L33/24 ,  H01L33/44 ,  H01L33/52 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A nanostructure semiconductor light emitting device includes a base layer, an insulating layer, a plurality of light emitting nanostructures, and a contact electrode. The base layer is formed of a first conductivity-type semiconductor material. The insulating layer is disposed on the base layer. Each light emitting nanostructure is disposed in a respective opening of a plurality of openings in the base layer, and includes a nanocore formed of the first conductivity-type semiconductor material, and an active layer and a second conductivity-type semiconductor layer sequentially disposed on a surface of the nanocore. The contact electrode is spaced apart from the insulating layer and is disposed on a portion of the second conductivity-type semiconductor layer. A tip portion of the light emitting nanostructure has crystal planes different from those on side surfaces of the light emitting nanostructure.

公开(公告)号：US10991857B2

公开(公告)日：2021-04-27

申请号：US16442870

申请日：2019-06-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wan Tae Lim ,  Sung Hyun Sim ,  Hanul Yoo ,  Yong Il Kim ,  Hye Seok Noh ,  Ji Hye Yeon

IPC: H01L33/50 ,  H01L25/075 ,  H01L27/15 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L33/44

Abstract: A method of fabricating a light emitting device package includes forming a plurality of semiconductor light emitting parts, each having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on a growth substrate, forming a partition structure having a plurality of light emitting windows on the growth substrate, filling each of the plurality of light emitting windows with a resin having a phosphor, and forming a plurality of wavelength conversion parts by planarizing a surface of the resin.

公开(公告)号：US10573628B2

公开(公告)日：2020-02-25

申请号：US15971196

申请日：2018-05-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong Il Kim ,  Wan Tae Lim ,  Young Jin Choi ,  Sung Hyun Sim

IPC: H01L25/16 ,  H01L27/12 ,  H01L33/50 ,  H01L33/54 ,  H01L33/06 ,  H01L33/32

Abstract: A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second surface opposite the first surface, each of the plurality of semiconductor light emitting units having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked on each other. The light emitting device package may further include a plurality of wavelength conversion units disposed on the first surface of the cell array to correspond to the plurality of semiconductor light emitting units, respectively, each configured to convert a wavelength of light, emitted by a respective one of the plurality of semiconductor light emitting units, into a different wavelength of light, and a partition structure disposed in a space between the plurality of wavelength conversion units, and a plurality of switching units spaced apart from the plurality of wavelength conversion units within the partition structure, and electrically connected to the plurality of semiconductor light emitting units.

公开(公告)号：US10475957B2

公开(公告)日：2019-11-12

申请号：US16190538

申请日：2018-11-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Nam Goo Cha ,  Yong Il Kim ,  Young Soo Park ,  Sung Hyun Sim ,  Hanul Yoo

IPC: H01L33/08 ,  G09G3/20 ,  H01L33/38 ,  H01L33/50 ,  H01L33/58 ,  H01L25/075 ,  G09G3/32 ,  H01L33/46 ,  H01L33/62

Abstract: An LED light source module includes a light emitting stacked body, and a first through electrode structure and a second through electrode structure passing through a portion of the light emitting stacked body. The light emitting stacked body includes a base insulating layer, light emitting layers sequentially stacked on the base insulating layer, each of the light emitting layers including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer disposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer, and an interlayer insulating layer disposed between the light emitting layers. The first through electrode structure is connected to the first conductivity-type semiconductor layer of each of the light emitting layers, and the second through electrode structure is connected to any one or any combination of the second conductivity-type semiconductor layer of each of the light emitting layers.

公开(公告)号：US10333035B2

公开(公告)日：2019-06-25

申请号：US15337215

申请日：2016-10-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Nam Goo Cha ,  Sung Hyun Sim ,  Wan tae Lim ,  Hye Seok Noh ,  Hanul Yoo

IPC: H01L33/50 ,  H01L33/60 ,  H01L27/15

Abstract: A method of manufacturing a light emitting device package is provided. The method includes preparing a film strip including one or more light blocking regions and one or more wavelength conversion regions, preparing light emitting devices, each including one or more light emitting regions, bonding the film strip to the light emitting devices so as to dispose the one or more wavelength conversion regions on the one or more light emitting regions of each of the light emitting devices, and cutting the film strip and the light emitting devices into individual device units.

公开(公告)号：US10217914B2

公开(公告)日：2019-02-26

申请号：US15163204

申请日：2016-05-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Nam Goo Cha ,  Wan Tae Lim ,  Yong Il Kim ,  Hye Seok Noh ,  Eun Joo Shin ,  Sung Hyun Sim ,  Hanul Yoo

IPC: H01L29/49 ,  H01L33/58 ,  H01L33/50 ,  H01L33/44 ,  H01L33/00 ,  F21Y103/10 ,  F21Y115/10 ,  F21S8/02 ,  F21V23/00 ,  F21K9/275 ,  F21K9/237

Abstract: A semiconductor light emitting device includes: a light emitting structure including a first conductivity-type semiconductor layer and a second conductivity-type semiconductor layer respectively providing a first surface and a second surface, opposite to each other, of the light emitting structure, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer, a region of the first conductivity-type semiconductor layer being open toward the second surface, and the first surface having a concavo-convex portion disposed thereon; a first electrode and a second electrode disposed on the region of the first conductivity-type semiconductor layer and a region of the second conductivity-type semiconductor layer, respectively; a transparent support substrate disposed on the first surface of the light emitting structure; and a transparent adhesive layer disposed between the first surface of the light emitting structure and the transparent support substrate.

公开(公告)号：US09825016B1

公开(公告)日：2017-11-21

申请号：US15386425

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong Il Kim ,  Wan Tae Lim ,  Young Jin Choi ,  Sung Hyun Sim

IPC: H01L25/16 ,  H01L27/12 ,  H01L33/50 ,  H01L33/54 ,  H01L33/06 ,  H01L33/32

CPC classification number: H01L25/167 ,  H01L27/124 ,  H01L33/06 ,  H01L33/32 ,  H01L33/50 ,  H01L33/54

Abstract: A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second surface opposite the first surface, each of the plurality of semiconductor light emitting units having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked on each other. The light emitting device package may further include a plurality of wavelength conversion units disposed on the first surface of the cell array to correspond to the plurality of semiconductor light emitting units, respectively, each configured to convert a wavelength of light, emitted by a respective one of the plurality of semiconductor light emitting units, into a different wavelength of light, and a partition structure disposed in a space between the plurality of wavelength conversion units, and a plurality of switching units spaced apart from the plurality of wavelength conversion units within the partition structure, and electrically connected to the plurality of semiconductor light emitting units.

公开(公告)号：US11075326B2

公开(公告)日：2021-07-27

申请号：US16913201

申请日：2020-06-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hyun Sim ,  Yong Il Kim ,  Ha Nul Yoo ,  Ji Hye Yeon ,  Jun Bu Youn ,  Ji Hoon Yun ,  Su Hyun Jo

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62

Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.