公开(公告)号：US20150333160A1

公开(公告)日：2015-11-19

申请号：US14813413

申请日：2015-07-30

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Hideomi SUZAWA ,  Shinya SASAGAWA ,  Tetsuhiro TANAKA

IPC: H01L29/66 ,  H01L29/45 ,  H01L21/4763 ,  H01L21/441 ,  H01L21/4757 ,  H01L29/786

CPC classification number: H01L21/02565 ,  C23C14/086 ,  C23C14/3414 ,  H01L21/02488 ,  H01L21/02554 ,  H01L21/02592 ,  H01L21/02609 ,  H01L21/02617 ,  H01L21/02631 ,  H01L21/441 ,  H01L21/47576 ,  H01L21/47635 ,  H01L29/045 ,  H01L29/26 ,  H01L29/45 ,  H01L29/4908 ,  H01L29/66969 ,  H01L29/78 ,  H01L29/7869

Abstract: In a semiconductor device in which a channel formation region is included in an oxide semiconductor layer, an oxide insulating film below and in contact with the oxide semiconductor layer and a gate insulating film over and in contact with the oxide semiconductor layer are used to supply oxygen of the gate insulating film, which is introduced by an ion implantation method, to the oxide semiconductor layer.

Abstract translation: 在氧化物半导体层中包括沟道形成区域的半导体器件中，使用氧化物半导体层下方并与氧化物半导体层接触的氧化物绝缘膜和与氧化物半导体层接触并与氧化物半导体层接触的栅极绝缘膜供给氧 通过离子注入法引入的栅极绝缘膜到氧化物半导体层。

公开(公告)号：US20150060846A1

公开(公告)日：2015-03-05

申请号：US14471766

申请日：2014-08-28

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Yoshitaka YAMAMOTO ,  Tetsuhiro TANAKA ,  Takayuki INOUE ,  Hideomi SUZAWA

IPC: H01L27/12 ,  H01L29/66 ,  H01L21/02 ,  H01L29/786 ,  H01L29/51

CPC classification number: H01L29/7869 ,  H01L21/0214 ,  H01L21/02181 ,  H01L21/02266 ,  H01L21/02274 ,  H01L21/28194 ,  H01L21/28282 ,  H01L21/31116 ,  H01L21/31122 ,  H01L21/31645 ,  H01L21/32136 ,  H01L21/441 ,  H01L21/465 ,  H01L21/473 ,  H01L27/1225 ,  H01L29/24 ,  H01L29/42384 ,  H01L29/4908 ,  H01L29/517 ,  H01L29/66969 ,  H01L29/78648 ,  H01L29/78693 ,  H01L29/78696 ,  H01L29/792

Abstract: A semiconductor device in which the threshold is adjusted is provided. In a transistor including a semiconductor, a source or drain electrode electrically connected to the semiconductor, a gate electrode, and an electron trap layer between the gate electrode and the semiconductor, the electron trap layer includes crystallized hafnium oxide. The crystallized hafnium oxide is deposited by a sputtering method using hafnium oxide as a target. When the substrate temperature is Tsub (° C.) and the proportion of oxygen in an atmosphere is P (%) in the sputtering method, P≧45−0.15×Tsub is satisfied. The crystallized hafnium oxide has excellent electron trapping properties. By the trap of an appropriate number of electrons, the threshold of the semiconductor device can be adjusted.

Abstract translation: 提供其中调整阈值的半导体器件。 在包括半导体，与半导体电连接的源电极或漏电极，栅电极和栅电极和半导体之间的电子捕获层的晶体管中，电子捕获层包括结晶的氧化铪。 通过使用氧化铪作为靶的溅射法沉积结晶的氧化铪。 溅射法中，衬底温度为Tsub（℃），气氛中氧的比例为P（％）时，P≥45〜0.15×Tsub。 结晶的氧化铪具有优异的电子捕获性能。 通过适当数量的电子的陷阱，可以调整半导体器件的阈值。

公开(公告)号：US20140339560A1

公开(公告)日：2014-11-20

申请号：US14276294

申请日：2014-05-13

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Masayuki SAKAKURA ,  Hideomi SUZAWA

IPC: H01L29/786

CPC classification number: H01L29/78696 ,  H01L27/1052 ,  H01L27/1225 ,  H01L27/14616 ,  H01L29/04 ,  H01L29/045 ,  H01L29/24 ,  H01L29/66969 ,  H01L29/7854 ,  H01L29/7869 ,  H01L29/78693

Abstract: A semiconductor device having a structure which can prevent a decrease in electrical characteristics due to miniaturization is provided. The semiconductor device includes, over an insulating surface, a stack in which a first oxide semiconductor layer and a second oxide semiconductor layer are sequentially formed, and a third oxide semiconductor layer covering part of a surface of the stack. The third oxide semiconductor layer includes a first layer in contact with the stack and a second layer over the first layer. The first layer includes a microcrystalline layer, and the second layer includes a crystalline layer in which c-axes are aligned in a direction perpendicular to a surface of the first layer.

Abstract translation: 提供具有能够防止由于小型化引起的电特性降低的结构的半导体器件。 半导体器件在绝缘表面上包括其中顺序形成第一氧化物半导体层和第二氧化物半导体层的堆叠，以及覆盖堆叠表面的一部分的第三氧化物半导体层。 第三氧化物半导体层包括与堆叠接触的第一层和在第一层上的第二层。 第一层包括微晶层，第二层包括其中c轴在垂直于第一层的表面的方向上排列的结晶层。

公开(公告)号：US20140339538A1

公开(公告)日：2014-11-20

申请号：US14269832

申请日：2014-05-05

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Hideomi SUZAWA ,  Yutaka OKAZAKI

IPC: H01L29/786

CPC classification number: H01L29/7869 ,  H01L29/24 ,  H01L29/517 ,  H01L29/66969 ,  H01L29/78606 ,  H01L29/78648 ,  H01L29/78696

Abstract: To provide a semiconductor device that includes an oxide semiconductor and is miniaturized while keeping good electrical properties. In the semiconductor device, an oxide semiconductor layer is surrounded by an insulating layer including an aluminum oxide film containing excess oxygen. Excess oxygen in the aluminum oxide film is supplied to the oxide semiconductor layer including a channel by heat treatment in a manufacturing process of the semiconductor device. Furthermore, the aluminum oxide film forms a barrier against oxygen and hydrogen. It is thus possible to suppress the removal of oxygen from the oxide semiconductor layer surrounded by the insulating layer including an aluminum oxide film, and the entry of impurities such as hydrogen into the oxide semiconductor layer; as a result, the oxide semiconductor layer can be made highly intrinsic. In addition, gate electrode layers over and under the oxide semiconductor layer control the threshold voltage effectively.

Abstract translation: 提供一种包含氧化物半导体并在保持良好的电气性能的同时小型化的半导体器件。 在半导体器件中，氧化物半导体层被包含含有过量氧的氧化铝膜的绝缘层包围。 在半导体器件的制造工艺中，通过热处理将氧化铝膜中的氧过多地供给到包括沟道的氧化物半导体层。 此外，氧化铝膜形成对氧和氢的阻挡。 因此，可以抑制由包含氧化铝膜的绝缘层包围的氧化物半导体层中的氧的除去以及诸如氢的杂质进入到氧化物半导体层中的氧; 结果，可以使氧化物半导体层高度固有。 此外，氧化物半导体层上方和下方的栅电极层有效地控制阈值电压。

公开(公告)号：US20140332251A1

公开(公告)日：2014-11-13

申请号：US14444276

申请日：2014-07-28

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Koji ONO ,  Hideomi SUZAWA

IPC: H01B1/02 ,  H01B13/00 ,  H01B5/14

CPC classification number: H01L27/1214 ,  C23F4/00 ,  H01B1/02 ,  H01B5/14 ,  H01B13/0006 ,  H01B13/0036 ,  H01L21/32136 ,  H01L21/76838 ,  H01L27/12 ,  H01L27/124 ,  H01L29/42376 ,  H01L29/456 ,  H01L29/4908 ,  H01L29/495 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A metal wiring suitable for a substrate of large size is provided. The present invention is characterized in that at least one layer of conductive film is formed on an insulating surface, a resist pattern is formed on the conductive film, and the conductive film having the resist pattern is etched to form a metal wiring while controlling its taper angle α in accordance with the bias power density, the ICP power density, the temperature of lower electrode, the pressure, the total flow rate of etching gas, or the ratio of oxygen or chlorine in etching gas. The thus formed metal wiring has less fluctuation in width or length and can satisfactorily deal with an increase in size of substrate.

Abstract translation: 提供适合于大尺寸基板的金属布线。 本发明的特征在于，在绝缘表面上形成至少一层导电膜，在导电膜上形成抗蚀剂图案，并且蚀刻具有抗蚀剂图案的导电膜以形成金属布线，同时控制其锥度 根据偏置功率密度，ICP功率密度，下部电极的温度，压力，蚀刻气体的总流量，或蚀刻气体中的氧气或氯气的比例来确定角度α。 这样形成的金属布线的宽度或长度波动较小，并且可以令人满意地处理基板尺寸的增加。

公开(公告)号：US20140203309A1

公开(公告)日：2014-07-24

申请号：US14223366

申请日：2014-03-24

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Koji ONO ,  Hideomi SUZAWA ,  Tatsuya ARAO

IPC: H01L33/08

CPC classification number: H01L27/1222 ,  G02F1/13624 ,  H01L27/12 ,  H01L27/1214 ,  H01L27/124 ,  H01L27/127 ,  H01L29/42384 ,  H01L29/4908 ,  H01L29/66757 ,  H01L29/78621 ,  H01L29/78627 ,  H01L33/08 ,  H01L33/62 ,  H01L2029/7863 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Disclosed is an electroluminescence device having a substrate, a thin film transistor over the substrate, an insulating film over the thin film transistor, an electroluminescence element over the insulating film, a passivation film over the electroluminescence element, and a counter substrate over the passivation film. The electroluminescence element is configured to emit light through the counter substrate, and a space between the substrate and the counter substrate is filled with a filler. The electroluminescence device is featured by the tapered side surface of a gate electrode of the thin film transistor.

公开(公告)号：US20140103340A1

公开(公告)日：2014-04-17

申请号：US14054130

申请日：2013-10-15

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Hideomi SUZAWA ,  Shinya SASAGAWA ,  Tetsuhiro TANAKA

IPC: H01L21/02 ,  H01L29/26 ,  H01L29/78 ,  H01L29/04

CPC classification number: H01L27/1225 ,  H01L21/02554 ,  H01L21/02565 ,  H01L21/02609 ,  H01L21/02617 ,  H01L21/02631 ,  H01L29/045 ,  H01L29/26 ,  H01L29/78 ,  H01L29/7869

Abstract: A semiconductor device in which an increase in oxygen vacancies in an oxide semiconductor layer can be suppressed is provided. A semiconductor device with favorable electrical characteristics is provided. A highly reliable semiconductor device is provided. A semiconductor device includes an oxide semiconductor layer in a channel formation region, and by the use of an oxide insulating film below and in contact with the oxide semiconductor layer and a gate insulating film over and in contact with the oxide semiconductor layer, oxygen of the oxide insulating film or the gate insulating film is supplied to the oxide semiconductor layer. Further, a conductive nitride is used for metal films of a source electrode layer, a drain electrode layer, and a gate electrode layer, whereby diffusion of oxygen to the metal films is suppressed.

Abstract translation: 提供了可以抑制氧化物半导体层中氧空位增加的半导体器件。 提供了具有良好电气特性的半导体器件。 提供了一种高度可靠的半导体器件。 半导体器件包括在沟道形成区域中的氧化物半导体层，并且通过使用氧化物半导体层下方并与氧化物半导体层接触的氧化物绝缘膜和与氧化物半导体层接触的栅绝缘膜， 氧化物绝缘膜或栅极绝缘膜被提供给氧化物半导体层。 此外，导电氮化物用于源电极层，漏电极层和栅电极层的金属膜，由此抑制氧向金属膜的扩散。

公开(公告)号：US20140103338A1

公开(公告)日：2014-04-17

申请号：US14054082

申请日：2013-10-15

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Hideomi SUZAWA ,  Shinya SASAGAWA ,  Tetsuhiro TANAKA

IPC: H01L21/02 ,  H01L29/26 ,  H01L29/78

CPC classification number: H01L29/78693 ,  H01L21/02554 ,  H01L21/02565 ,  H01L21/02581 ,  H01L21/02617 ,  H01L21/02631 ,  H01L21/32139 ,  H01L27/1225 ,  H01L29/26 ,  H01L29/42384 ,  H01L29/4908 ,  H01L29/78 ,  H01L29/78606 ,  H01L29/7869

Abstract: A semiconductor device in which an increase in oxygen vacancies in an oxide semiconductor layer can be suppressed is provided. A semiconductor device with favorable electrical characteristics is provided. A highly reliable semiconductor device is provided. A semiconductor device includes an oxide semiconductor layer in a channel formation region, and by the use of an oxide insulating film below and in contact with the oxide semiconductor layer and a gate insulating film over and in contact with the oxide semiconductor layer, oxygen of the oxide insulating film or the gate insulating film is supplied to the oxide semiconductor layer. Further, a conductive nitride is used for a metal film of a source electrode layer and a drain electrode layer, whereby diffusion of oxygen to the metal film is suppressed.

Abstract translation: 提供了可以抑制氧化物半导体层中氧空位增加的半导体器件。 提供了具有良好电气特性的半导体器件。 提供了一种高度可靠的半导体器件。 半导体器件包括在沟道形成区域中的氧化物半导体层，并且通过使用氧化物半导体层下方并与氧化物半导体层接触的氧化物绝缘膜和与氧化物半导体层接触的栅绝缘膜， 氧化物绝缘膜或栅极绝缘膜被提供给氧化物半导体层。 此外，导电氮化物用于源电极层和漏电极层的金属膜，从而抑制氧向金属膜的扩散。

公开(公告)号：US20140014996A1

公开(公告)日：2014-01-16

申请号：US14027871

申请日：2013-09-16

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Koji ONO ,  Hideomi SUZAWA ,  Tatsuya ARAO

IPC: H01L33/62

CPC classification number: H01L27/1222 ,  G02F1/13624 ,  H01L27/12 ,  H01L27/1214 ,  H01L27/124 ,  H01L27/127 ,  H01L29/42384 ,  H01L29/4908 ,  H01L29/66757 ,  H01L29/78621 ,  H01L29/78627 ,  H01L33/08 ,  H01L33/62 ,  H01L2029/7863 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Disclosed is an electroluminescence device having a substrate, a thin film transistor over the substrate, an insulating film over the thin film transistor, an electroluminescence element over the insulating film, a passivation film over the electroluminescence element, and a counter substrate over the passivation film. The electroluminescence element is configured to emit light through the counter substrate, and a space between the substrate and the counter substrate is filled with a filler. The electroluminescence device is featured by the tapered side surface of a gate electrode of the thin film transistor.

Abstract translation: 公开了一种电致发光器件，其具有衬底，衬底上的薄膜晶体管，薄膜晶体管上的绝缘膜，绝缘膜上的电致发光元件，电致发光元件上的钝化膜以及钝化膜上的对置衬底 。 电致发光元件被配置为通过对置基板发光，并且用填充物填充基板和对向基板之间的空间。 电致发光元件的特征在于薄膜晶体管的栅电极的锥形侧面。

公开(公告)号：US20220123154A1

公开(公告)日：2022-04-21

申请号：US17564518

申请日：2021-12-29

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Masayuki SAKAKURA ,  Hideomi SUZAWA

IPC: H01L29/786 ,  H01L29/04 ,  H01L27/105 ,  H01L27/12 ,  H01L27/146 ,  H01L29/24 ,  H01L29/66

Abstract: A semiconductor device having a structure which can prevent a decrease in electrical characteristics due to miniaturization is provided. The semiconductor device includes, over an insulating surface, a stack in which a first oxide semiconductor layer and a second oxide semiconductor layer are sequentially formed, and a third oxide semiconductor layer covering part of a surface of the stack. The third oxide semiconductor layer includes a first layer in contact with the stack and a second layer over the first layer. The first layer includes a microcrystalline layer, and the second layer includes a crystalline layer in which c-axes are aligned in a direction perpendicular to a surface of the first layer.