公开(公告)号：US20200273935A1

公开(公告)日：2020-08-27

申请号：US16872806

申请日：2020-05-12

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Masakatsu Ohno ,  Hiroki Adachi ,  Satoru Idojiri ,  Koichi TAKESHIMA

IPC: H01L27/32 ,  B23K26/04 ,  B23K26/08 ,  H01L51/00 ,  H01L29/786 ,  B23K26/06 ,  H01L27/12 ,  B23K26/0622 ,  H01L51/52 ,  H01L29/24 ,  H01L51/56 ,  H01L29/66

Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

公开(公告)号：US20160361913A1

公开(公告)日：2016-12-15

申请号：US15248579

申请日：2016-08-26

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Masakatsu OHNO ,  Hiroki ADACHI ,  Satoru IDOJIRI ,  Koichi TAKESHIMA

IPC: B32B43/00 ,  B32B37/00 ,  H01L27/32 ,  H01L51/00 ,  H01L51/52 ,  B32B38/10 ,  H01L51/56

CPC classification number: B32B43/006 ,  B32B37/0053 ,  B32B37/025 ,  B32B37/12 ,  B32B37/1207 ,  B32B38/10 ,  B32B2037/1253 ,  B32B2037/268 ,  B32B2457/20 ,  B32B2457/208 ,  H01L27/322 ,  H01L27/323 ,  H01L27/3262 ,  H01L51/0013 ,  H01L51/003 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/5284 ,  H01L51/56 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5315 ,  H01L2251/5338 ,  Y10T156/1111 ,  Y10T156/1174 ,  Y10T156/1928 ,  Y10T156/195

Abstract: The yield of a peeling process is improved. A peeling apparatus includes a structure body with a convex surface and a stage with a supporting surface which faces the convex surface. The structure body can hold a first member of a process member between the convex surface and the supporting surface. The stage can hold a second member of the process member. The radius of curvature of the convex surface is less than the radius of curvature of the supporting surface. The linear velocity of the convex surface is greater than or equal to the speed of a rotation center of the structure body passing the stage. The first member is wound along the convex surface to be separated from the second member.

公开(公告)号：US20150319893A1

公开(公告)日：2015-11-05

申请号：US14696525

申请日：2015-04-27

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Masakatsu OHNO ,  Satoru IDOJIRI ,  Koichi TAKESHIMA ,  Kayo KUMAKURA ,  Yoshiharu HIRAKATA ,  Kohei YOKOYAMA

IPC: H05K13/04 ,  B32B38/10 ,  B32B43/00

CPC classification number: B32B38/10 ,  B32B38/1858 ,  B32B43/006 ,  B32B2457/00 ,  H05K13/0486 ,  Y10T156/1105 ,  Y10T156/1132 ,  Y10T156/1906 ,  Y10T156/1944

Abstract: A separation apparatus (1) for separating a thin-film flexible stacked body (3) from a component (16) where the thin-film flexible stacked body (3) including an element layer is formed over a rigid substrate (2) such as a glass substrate, a quartz substrate, a ceramic substrate, or a metal substrate is provided. The separation apparatus (1) mainly includes a fixing device (10) for fixing the substrate (2) of the component (16), suction jigs (11) for lifting the flexible stacked body (3) by suction to be separated, circular suction pads (13) that are brought into direct contact with the flexible stacked body (3) and attached to the flexible stacked body (3) by suction, and clamp jigs (9) for holding an edge of the flexible stacked body (3). A position sensor such as a laser measuring instrument for measuring or monitoring a separation state of the flexible stacked body may be used together.

Abstract translation: 一种用于将薄膜柔性层叠体（3）从包括元件层的薄膜柔性层叠体（3）的部件（16）分离的分离装置（1）形成在刚性基板（2）上，例如 玻璃基板，石英基板，陶瓷基板或金属基板。 分离装置（1）主要包括用于固定部件（16）的基板（2）的固定装置（10），用于通过抽吸提升柔性堆叠体（3）以分离的吸入夹具（11），圆形抽吸 与柔性层叠体（3）直接接触并通过抽吸附接到柔性层叠体（3）的垫（13）和用于保持柔性层叠体（3）的边缘的夹具（9）。 可以一起使用诸如用于测量或监测柔性层叠体的分离状态的激光测量仪器的位置传感器。

公开(公告)号：US20150314456A1

公开(公告)日：2015-11-05

申请号：US14699614

申请日：2015-04-29

Applicant: Semiconductor Energy Laboratory Co., LTD.

Inventor： Kayo KUMAKURA ,  Satoru IDOJIRI ,  Masakatsu OHNO ,  Koichi TAKESHIMA ,  Yoshiharu HIRAKATA ,  Kohei YOKOYAMA

IPC: B25J15/06 ,  B25J11/00

CPC classification number: B25J15/0616 ,  B25J11/00 ,  B25J15/0004 ,  B25J15/0028 ,  B25J15/0061

Abstract: A film suction mechanism is provided which can prevent a film-like member from warping or sagging for reliable suction, handing over, or the like of the film-like member. A film suction mechanism of the present invention is a film suction mechanism for processing or transferring a flexible film-like member. The film suction mechanism includes a suction unit having a function of attaching the film-like member thereto by suction and an air nozzle having a function of blowing pressurized air onto a first surface of the film-like member. The suction unit includes a plurality of suction pads. The suction unit is capable of attaching a second surface of the film-like member thereto by suction while the pressurized air is blown onto the first surface of the film-like member.

Abstract translation: 提供了一种胶片吸引机构，其可以防止膜状构件翘曲或下垂以获得膜状构件的可靠抽吸，移交等。 本发明的吸膜机构是用于加工或转移柔性膜状部件的膜吸引机构。 薄膜抽吸机构包括具有通过抽吸将薄膜状构件附接到其上的功能的抽吸单元和具有将加压空气吹送到薄膜状构件的第一表面上的功能的空气喷嘴。 抽吸单元包括多个吸盘。 抽吸单元能够通过抽吸将薄膜状构件的第二表面附着在压力空气吹到薄膜状构件的第一表面上。

公开(公告)号：US20150155505A1

公开(公告)日：2015-06-04

申请号：US14553251

申请日：2014-11-25

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Masakatsu OHNO ,  Hiroki ADACHI ,  Satoru IDOJIRI ,  Koichi TAKESHIMA

IPC: H01L51/00 ,  H01L51/52 ,  H01L51/50 ,  H01L51/56

CPC classification number: H01L27/3272 ,  B23K26/04 ,  B23K26/0617 ,  B23K26/0622 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/083 ,  H01L27/1225 ,  H01L27/1266 ,  H01L27/322 ,  H01L27/3244 ,  H01L27/3258 ,  H01L27/3262 ,  H01L29/24 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/7869 ,  H01L41/314 ,  H01L51/0024 ,  H01L51/0027 ,  H01L51/003 ,  H01L51/0097 ,  H01L51/5096 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5284 ,  H01L51/56 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5338 ,  H01L2251/558 ,  Y02E10/549 ,  Y02P70/521

Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

Abstract translation: 在第一基板上形成第一有机树脂层; 在第一有机树脂层上形成第一绝缘膜; 第一元件层形成在第一绝缘膜上; 在第二基板上形成第二有机树脂层; 在第二有机树脂层上形成第二绝缘膜; 第二元件层形成在第二绝缘膜上; 第一基板和第二基板接合; 第一分离步骤，其中第一有机树脂层和第一基板之间的粘合力减小; 第一有机树脂层和第一柔性基板与第一接合层接合; 第二分离步骤，其中所述第二有机树脂层和所述第二基板之间的粘合减小; 并且第二有机树脂层和第二柔性基板与第二接合层接合。

公开(公告)号：US20190333976A1

公开(公告)日：2019-10-31

申请号：US16509819

申请日：2019-07-12

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Masakatsu OHNO ,  Hiroki ADACHI ,  Satoru IDOJIRI ,  Koichi TAKESHIMA

IPC: H01L27/32 ,  B23K26/0622 ,  B23K26/04 ,  B23K26/06 ,  B23K26/08 ,  H01L51/52 ,  H01L29/66 ,  H01L29/786 ,  H01L51/00 ,  H01L51/56 ,  H01L27/12 ,  H01L29/24

Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

公开(公告)号：US20190096977A1

公开(公告)日：2019-03-28

申请号：US16204102

申请日：2018-11-29

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Masakatsu OHNO ,  Hiroki ADACHI ,  Satoru IDOJIRI ,  Koichi TAKESHIMA

IPC: H01L27/32 ,  B23K26/08 ,  H01L51/00 ,  H01L51/56 ,  H01L29/786 ,  H01L27/12 ,  B23K26/0622 ,  H01L51/52 ,  B23K26/04 ,  B23K26/06 ,  H01L29/66 ,  H01L29/24 ,  H01L41/314 ,  H01L51/50

Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

公开(公告)号：US20180166524A1

公开(公告)日：2018-06-14

申请号：US15894117

申请日：2018-02-12

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Masakatsu OHNO ,  Hiroki ADACHI ,  Satoru IDOJIRI ,  Koichi TAKESHIMA

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/56 ,  H01L51/00 ,  H01L27/12 ,  H01L29/66 ,  H01L29/786

CPC classification number: H01L27/3272 ,  B23K26/04 ,  B23K26/0617 ,  B23K26/0622 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/083 ,  H01L27/1225 ,  H01L27/1266 ,  H01L27/322 ,  H01L27/3244 ,  H01L27/3258 ,  H01L27/3262 ,  H01L29/24 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/7869 ,  H01L41/314 ,  H01L51/0024 ,  H01L51/0027 ,  H01L51/003 ,  H01L51/0097 ,  H01L51/5096 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5284 ,  H01L51/56 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5338 ,  H01L2251/558 ,  Y02E10/549 ,  Y02P70/521

Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

公开(公告)号：US20160300865A1

公开(公告)日：2016-10-13

申请号：US15100476

申请日：2014-11-26

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Masakatsu OHNO ,  Hiroki ADACHI ,  Satoru IDOJIRI ,  Koichi TAKESHIMA

IPC: H01L27/12 ,  H01L29/786

CPC classification number: H01L27/1266 ,  H01L21/6835 ,  H01L27/1222 ,  H01L27/1285 ,  H01L27/3244 ,  H01L29/78648 ,  H01L29/78675 ,  H01L51/003 ,  H01L2221/6835

Abstract: An object is to provide a novel separation method or a novel manufacturing method of a device. In the case where a bond of M——W (M is a given element) is divided by application of physical force, a liquid is absorbed into the gap, whereby the bond becomes bonds of M—OH HO—W with a longer bond distance and the detachment can be promoted accordingly. In the detachment, a roller such as a drum roller can be used. Part of the roller surface may have adhesiveness. For example, an adhesive tape or the like may be put on part of the roller surface. By rotating the roller, the layer to be separated is wound and detached from the substrate having an insulating surface.

Abstract translation: 目的在于提供一种新的分离方法或新颖的器件制造方法。 在M-W（M为给定元素）的键通过施加物理力分离的情况下，液体被吸收到间隙中，由此键变为具有较长键的M-OH HO-W的键 距离和分离可以相应推动。 在拆卸中，可以使用诸如鼓辊的辊。 辊表面的一部分可能具有粘合性。 例如，可以将胶带等放置在辊表面的一部分上。 通过旋转辊，待分离的层从具有绝缘表面的基板上卷绕并分离。

公开(公告)号：US20160247868A1

公开(公告)日：2016-08-25

申请号：US15145246

申请日：2016-05-03

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Masakatsu OHNO ,  Hiroki ADACHI ,  Satoru IDOJIRI ,  Koichi TAKESHIMA

IPC: H01L27/32 ,  H01L29/24 ,  H01L51/56 ,  H01L51/52 ,  H01L29/66 ,  H01L29/786

CPC classification number: H01L27/3272 ,  B23K26/04 ,  B23K26/0617 ,  B23K26/0622 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/083 ,  H01L27/1225 ,  H01L27/1266 ,  H01L27/322 ,  H01L27/3244 ,  H01L27/3258 ,  H01L27/3262 ,  H01L29/24 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/7869 ,  H01L41/314 ,  H01L51/0024 ,  H01L51/0027 ,  H01L51/003 ,  H01L51/0097 ,  H01L51/5096 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5284 ,  H01L51/56 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5338 ,  H01L2251/558 ,  Y02E10/549 ,  Y02P70/521

Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.