公开(公告)号：US10040175B2

公开(公告)日：2018-08-07

申请号：US14696515

申请日：2015-04-27

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Kayo Kumakura ,  Satoru Idojiri ,  Masakatsu Ohno ,  Koichi Takeshima ,  Yoshiharu Hirakata ,  Kohei Yokoyama

IPC: B25B11/00 ,  B29C53/18 ,  H01L21/687 ,  B29L7/00

Abstract: A film-like member is supported in a flat shape by vacuum suction. A plurality of lift pins are arranged in a planar configuration and bear a film-like member placed on their upper ends. Tubular pads made of rubber for holding the film-like member by vacuum suction are attached to upper portions of the lift pins. The height of the lift pins can be adjusted by a screw fastening mechanism. The deformation of the film-like member can be corrected to a flat or concavely curved shape by suction from the pads. When the correction cannot be achieved by suction alone, the correction may be supplemented by ejection of air from a nozzle.

公开(公告)号：US09905589B2

公开(公告)日：2018-02-27

申请号：US15100476

申请日：2014-11-26

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Masakatsu Ohno ,  Hiroki Adachi ,  Satoru Idojiri ,  Koichi Takeshima

IPC: H01L27/00 ,  H01L27/12 ,  H01L21/683 ,  H01L29/786 ,  H01L51/00 ,  H01L27/32

CPC classification number: H01L27/1266 ,  H01L21/6835 ,  H01L27/1222 ,  H01L27/1285 ,  H01L27/3244 ,  H01L29/78648 ,  H01L29/78675 ,  H01L51/003 ,  H01L2221/6835

Abstract: An object is to provide a novel separation method or a novel manufacturing method of a device. In the case where a bond of M-O—W (M is a given element) is divided by application of physical force, a liquid is absorbed into the gap, whereby the bond becomes bonds of M-OH HO—W with a longer bond distance and the detachment can be promoted accordingly. In the detachment, a roller such as a drum roller can be used. Part of the roller surface may have adhesiveness. For example, an adhesive tape or the like may be put on part of the roller surface. By rotating the roller, the layer to be separated is wound and detached from the substrate having an insulating surface.

公开(公告)号：US09437831B2

公开(公告)日：2016-09-06

申请号：US14553251

申请日：2014-11-25

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Masakatsu Ohno ,  Hiroki Adachi ,  Satoru Idojiri ,  Koichi Takeshima

IPC: H01L23/52 ,  H01L51/00 ,  H01L51/56 ,  H01L51/52 ,  H01L51/50 ,  H01L41/314 ,  H01L27/32

CPC classification number: H01L27/3272 ,  B23K26/04 ,  B23K26/0617 ,  B23K26/0622 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/083 ,  H01L27/1225 ,  H01L27/1266 ,  H01L27/322 ,  H01L27/3244 ,  H01L27/3258 ,  H01L27/3262 ,  H01L29/24 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/7869 ,  H01L41/314 ,  H01L51/0024 ,  H01L51/0027 ,  H01L51/003 ,  H01L51/0097 ,  H01L51/5096 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5284 ,  H01L51/56 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5338 ,  H01L2251/558 ,  Y02E10/549 ,  Y02P70/521

Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

Abstract translation: 在第一基板上形成第一有机树脂层; 在第一有机树脂层上形成第一绝缘膜; 第一元件层形成在第一绝缘膜上; 在第二基板上形成第二有机树脂层; 在第二有机树脂层上形成第二绝缘膜; 第二元件层形成在第二绝缘膜上; 第一基板和第二基板接合; 第一分离步骤，其中第一有机树脂层和第一基板之间的粘合力减小; 第一有机树脂层和第一柔性基板与第一接合层接合; 第二分离步骤，其中所述第二有机树脂层和所述第二基板之间的粘合减小; 并且第二有机树脂层和第二柔性基板与第二接合层接合。

公开(公告)号：US09427949B2

公开(公告)日：2016-08-30

申请号：US14553227

申请日：2014-11-25

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Masakatsu Ohno ,  Hiroki Adachi ,  Satoru Idojiri ,  Koichi Takeshima

IPC: B32B38/10 ,  B32B43/00 ,  B32B37/12 ,  B32B37/00 ,  H01L51/56 ,  B32B37/26 ,  H01L51/00

CPC classification number: B32B43/006 ,  B32B37/0053 ,  B32B37/025 ,  B32B37/12 ,  B32B37/1207 ,  B32B38/10 ,  B32B2037/1253 ,  B32B2037/268 ,  B32B2457/20 ,  B32B2457/208 ,  H01L27/322 ,  H01L27/323 ,  H01L27/3262 ,  H01L51/0013 ,  H01L51/003 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/5284 ,  H01L51/56 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5315 ,  H01L2251/5338 ,  Y10T156/1111 ,  Y10T156/1174 ,  Y10T156/1928 ,  Y10T156/195

Abstract: The yield of a peeling process is improved. A peeling apparatus includes a structure body with a convex surface and a stage with a supporting surface which faces the convex surface. The structure body can hold a first member of a process member between the convex surface and the supporting surface. The stage can hold a second member of the process member. The radius of curvature of the convex surface is less than the radius of curvature of the supporting surface. The linear velocity of the convex surface is greater than or equal to the speed of a rotation center of the structure body passing the stage. The first member is wound along the convex surface to be separated from the second member.

Abstract translation: 剥离过程的产率提高。 剥离装置包括具有凸面的结构体和具有与凸面对置的支撑面的台。 结构体可以在凸表面和支撑表面之间保持处理构件的第一构件。 舞台可以容纳进程成员的第二个成员。 凸面的曲率半径小于支撑面的曲率半径。 凸面的线速度大于或等于通过平台的结构体的旋转中心的速度。 第一构件沿凸形表面缠绕以与第二构件分离。

公开(公告)号：US12048207B2

公开(公告)日：2024-07-23

申请号：US18138866

申请日：2023-04-25

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Shunpei Yamazaki ,  Masakatsu Ohno ,  Hiroki Adachi ,  Satoru Idojiri ,  Koichi Takeshima

IPC: H01L23/00 ,  B23K26/04 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/08 ,  H01L27/12 ,  H01L29/24 ,  H01L29/66 ,  H01L29/786 ,  H10K50/842 ,  H10K50/844 ,  H10K59/121 ,  H10K59/124 ,  H10K59/126 ,  H10K59/38 ,  H10K71/00 ,  H10K71/40 ,  H10K71/50 ,  H10K71/80 ,  H10K77/10 ,  H10K50/18 ,  H10K50/86 ,  H10K59/12 ,  H10K102/00 ,  H10N30/074

CPC classification number: H10K59/126 ,  B23K26/04 ,  B23K26/0617 ,  B23K26/0622 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/083 ,  H01L27/1225 ,  H01L27/1266 ,  H01L29/24 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/7869 ,  H10K50/8426 ,  H10K50/844 ,  H10K59/1213 ,  H10K59/124 ,  H10K59/38 ,  H10K71/00 ,  H10K71/421 ,  H10K71/50 ,  H10K71/80 ,  H10K77/111 ,  H10K50/18 ,  H10K50/865 ,  H10K59/12 ,  H10K59/1201 ,  H10K2102/311 ,  H10K2102/351 ,  H10N30/074 ,  Y02E10/549 ,  Y02P70/50

Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

公开(公告)号：US20210257432A1

公开(公告)日：2021-08-19

申请号：US17307088

申请日：2021-05-04

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Shunpei Yamazaki ,  Masakatsu Ohno ,  Hiroki Adachi ,  Satoru Idojiri ,  Koichi Takeshima

IPC: H01L27/32 ,  H01L51/00 ,  H01L51/56 ,  H01L51/52 ,  H01L27/12 ,  H01L29/24 ,  H01L29/66 ,  H01L29/786 ,  B23K26/0622 ,  B23K26/04 ,  B23K26/06 ,  B23K26/08

Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

公开(公告)号：US10528198B2

公开(公告)日：2020-01-07

申请号：US15697738

申请日：2017-09-07

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Yoshiharu Hirakata ,  Koichi Takeshima ,  Takayuki Ohide ,  Kenji Shinozaki ,  Kanpei Kojima

IPC: G06F3/044 ,  G09G3/36 ,  G09G3/3233 ,  G06F1/16

Abstract: A display panel and the like with a novel structure are provided. In the display panel, a first functional layer includes a pixel circuit and a first insulating film. A second functional layer includes a coloring film and a second insulating film. The first insulating film and the second insulating film each have a thickness of 0.5 μm to 3 μm and a Young's modulus of 3 GPa to 12 GPa. A sealing material is provided between a first base and a second base. A structure body is provided between the first base and the second base, and keeps a predetermined gap between the first and second bases. A pixel is surrounded by the first base, the second base, and the sealing material. A display element in the pixel is electrically connected to a pixel circuit and overlaps with a coloring film and a liquid crystal material.

公开(公告)号：US10355067B2

公开(公告)日：2019-07-16

申请号：US15894117

申请日：2018-02-12

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Masakatsu Ohno ,  Hiroki Adachi ,  Satoru Idojiri ,  Koichi Takeshima

IPC: H01L27/32 ,  H01L51/00 ,  H01L51/56 ,  H01L51/52 ,  H01L29/24 ,  H01L29/66 ,  H01L29/786 ,  B23K26/0622 ,  B23K26/04 ,  B23K26/06 ,  B23K26/08 ,  H01L27/12 ,  H01L51/50 ,  H01L41/314

Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

公开(公告)号：US10259207B2

公开(公告)日：2019-04-16

申请号：US15413696

申请日：2017-01-24

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Masakatsu Ohno ,  Koichi Takeshima

IPC: B32B43/00 ,  H01L21/683 ,  H01L27/12 ,  H01L51/00 ,  B32B37/18 ,  H01L51/56 ,  B32B38/10 ,  B32B37/02 ,  B32B37/12 ,  B32B37/00 ,  H01L27/32

Abstract: A starting point for separating a separation layer and a layer to be separated is formed in a process member. A first step of irradiating a first portion of the process member with first laser light in a frame-like shape and a second step of irradiating at least part of a region which is irradiated with the first laser light with second laser light are performed. The process member includes a first substrate, the separation layer, the layer to be separated, and an adhesive layer which are stacked in this order. In the first portion, the adhesive layer overlaps with the first substrate with the separation layer and the layer to be separated provided therebetween. In the first step, the first laser light is absorbed by at least the layer to be separated and the adhesive layer. In the second step, the second laser light is absorbed by at least the separation layer.

公开(公告)号：US09808937B2

公开(公告)日：2017-11-07

申请号：US14699614

申请日：2015-04-29

Applicant: Semiconductor Energy Laboratory Co., LTD.

Inventor： Kayo Kumakura ,  Satoru Idojiri ,  Masakatsu Ohno ,  Koichi Takeshima ,  Yoshiharu Hirakata ,  Kohei Yokoyama

IPC: B25J15/06 ,  B25J11/00 ,  B25J15/00

CPC classification number: B25J15/0616 ,  B25J11/00 ,  B25J15/0004 ,  B25J15/0028 ,  B25J15/0061

Abstract: A film suction mechanism is provided which can prevent a film-like member from warping or sagging for reliable suction, handing over, or the like of the film-like member. A film suction mechanism of the present invention is a film suction mechanism for processing or transferring a flexible film-like member. The film suction mechanism includes a suction unit having a function of attaching the film-like member thereto by suction and an air nozzle having a function of blowing pressurized air onto a first surface of the film-like member. The suction unit includes a plurality of suction pads. The suction unit is capable of attaching a second surface of the film-like member thereto by suction while the pressurized air is blown onto the first surface of the film-like member.