公开(公告)号：US09450159B2

公开(公告)日：2016-09-20

申请号：US14355521

申请日：2012-10-09

Applicant: Seoul Viosys Co., Ltd.

Inventor： Hee Cheul Jung ,  Jung Hye Chae ,  Bo Ram I Jang ,  Jun Yong Park ,  Dae Woong Suh

IPC: H01L21/44 ,  H01L33/58 ,  H01L33/48

CPC classification number: H01L33/58 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Disclosed are a light-emitting diode package and a method for manufacturing same. The method for manufacturing a light-emitting diode package comprises: preparing a package main body having a cavity and an air vent passageway which extends from the cavity; installing a light-emitting diode inside the cavity of the package main body; attaching a transparent member by means of an adhesive so as to cover the upper part of the cavity; and blocking the air vent passageway by forming a sealing member. As the air vent passageway is blocked after the transparent member is attached, the transparent member may be prevented from peeling off from the air pressure inside the cavity.

Abstract translation: 公开了一种发光二极管封装及其制造方法。 制造发光二极管封装的方法包括：制备具有空腔的封装主体和从空腔延伸的排气通道; 在封装主体的腔体内安装发光二极管; 通过粘合剂附接透明构件以覆盖空腔的上部; 并且通过形成密封构件来堵塞排气通道。 在安装透明构件之后，当排气通道被阻塞时，可以防止透明构件从空腔内的空气压力中剥离。

公开(公告)号：US09263658B2

公开(公告)日：2016-02-16

申请号：US14069343

申请日：2013-10-31

Applicant: SEOUL VIOSYS CO., LTD

Inventor： Jun Yong Park ,  Hee Cheul Jung ,  In Kyu Park ,  Seung Wook Lee ,  Daewoong Suh

IPC: H01L33/48 ,  H01L33/58 ,  H01L33/64

CPC classification number: H01L33/644 ,  H01L33/483 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2933/0058 ,  H01L2924/00014

Abstract: Disclosed are a light-emitting device and a manufacturing method thereof. A light-emitting device according to an exemplary embodiment of the present invention includes a base, a lighting element disposed on the base, the lighting element including an epitaxial layer and a substrate disposed on the epitaxial layer, a contact member disposed between the lighting element and the base, the contact member electrically connecting the lighting element and the base, and a lens disposed on the substrate.

Abstract translation: 公开了一种发光器件及其制造方法。 根据本发明的示例性实施例的发光器件包括基座，设置在基座上的发光元件，所述发光元件包括外延层和设置在所述外延层上的基板，设置在所述照明元件 并且基座，电连接照明元件和基座的接触构件和设置在基板上的透镜。

公开(公告)号：US11761592B2

公开(公告)日：2023-09-19

申请号：US17562433

申请日：2021-12-27

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Ki Yon Park ,  Jun Yong Park

IPC: F21K9/69 ,  G02B19/00 ,  F21Y105/16 ,  F21Y115/10

CPC classification number: F21K9/69 ,  G02B19/0066 ,  F21Y2105/16 ,  F21Y2115/10

Abstract: A light emitting apparatus includes a substrate, a plurality of light emitting structures, a window, and a reflector. The substrate has a luminous region and a non-luminous region. The plurality of light emitting structures is disposed on the luminous region of the substrate. The window has a dome shape and is disposed to cover the luminous region. The window is configured to control a traveling path of light emitted from the a plurality of light emitting structures. The reflector is configured to support the window and reflect the light emitted from the plurality of light emitting structures. The reflector has an opening that exposes the plurality of light emitting structures mounted on the substrate. A distance between two adjacent light emitting structures of the plurality of light emitting structures is 500 micrometers or less.

公开(公告)号：US20230155072A1

公开(公告)日：2023-05-18

申请号：US18098030

申请日：2023-01-17

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Chi Hyun In ,  Jun Yong Park ,  Kyu Ho Lee ,  Dae Woong Suh ,  Jong Hyeon Chae ,  Chang Hoon Kim ,  Sung Hyun Lee

IPC: H01L33/48

CPC classification number: H01L33/486 ,  H01L33/20

Abstract: A light emitting diode, including a first type semiconductor layer, an active layer, and a second type semiconductor layer; an ohmic contact layer disposed on the second type semiconductor layer; a first insulating layer disposed on the semiconductor structure and including a first opening overlapping the first type semiconductor layer and a second opening overlapping the ohmic contact layer; a first connection wiring disposed on the first insulating layer, the first connection wiring having a first portion and a second portion; and a second connection wiring disposed on the first insulating layer and spaced apart from the first connection wiring, the second connection wiring electrically connected to the second type semiconductor layer through the second opening. The second connection wiring surrounds at least a portion of the first portion of the first connection wiring in a plan view.

公开(公告)号：US20180261739A1

公开(公告)日：2018-09-13

申请号：US15758302

申请日：2016-09-07

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jun Yong Park ,  In Kyu Park ,  Yeo Jin Yoon

IPC: H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/46

CPC classification number: H01L33/60 ,  H01L23/3114 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/46 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/48111 ,  H01L2924/00014

Abstract: A light-emitting diode package comprising: a substrate having one or more first pads, one or more second pads, a first terminal, and a second terminal, which are all formed on the upper surface; a plurality of light-emitting diode chips loaded on the one or more first pads and electrically connected to the first pad and the second pad; and a reflector coupled to an upper part of the substrate and having an opening part through which the plurality of light-emitting diode chips is exposed, wherein the first pad is formed as one body with the substrate, and the first terminal or the second terminal are connected to an external power source and formed to have a predetermined height at the upper surface of the substrate.

公开(公告)号：US20150295139A1

公开(公告)日：2015-10-15

申请号：US14350323

申请日：2012-10-08

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jun Yong Park ,  Daewoong Suh ,  Bo Ram I Jang ,  Hee Cheul Jung ,  Kyu Ho Lee ,  Chang Hoon Kim

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/22

CPC classification number: H01L33/483 ,  H01L33/22 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention relates to a light-emitting diode package. According to the present invention, a light-emitting diode package comprises: a substrate for growth; a passivation layer formed on a surface of one side of the substrate for growth; and a package substrate having a main body portion and a wall portion, wherein the wall portion is formed on the main body portion. At least the space formed among the main body portion, the wall portion and the passivation layer is sealed from the outside.

Abstract translation: 本发明涉及一种发光二极管封装。 根据本发明，发光二极管封装包括：用于生长的衬底; 形成在用于生长的基板的一侧的表面上的钝化层; 以及具有主体部分和壁部分的封装基板，其中壁部形成在主体部分上。 至少在主体部分，壁部分和钝化层之间形成的空间与外部密封。

公开(公告)号：US11069846B2

公开(公告)日：2021-07-20

申请号：US15572051

申请日：2016-04-25

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jun Yong Park ,  Jae Hyun Park ,  Yeo Jin Yoon ,  In Kyu Park

IPC: H01L33/64 ,  H01L25/075 ,  H01L33/48 ,  H01L33/62 ,  H01L33/60

Abstract: A light-emitting device is provided. The light-emitting device comprises: a first body unit including a base part and at least three conductive patterns positioned on the base part while including a plurality of element loading areas; and a plurality of light-emitting elements positioned on the plurality of element loading areas of the first body unit, wherein at least one conductive pattern among the conductive patterns is electrically connected to at least two light-emitting elements, the at least two light-emitting elements are connected to each other in series, at least two conductive patterns among the conductive patterns include pad electrode areas, an area of the plurality of conductive patterns is 80% or more of an upper surface area of the base part, and a separation distance among the plurality of conductive patterns is 200 μm to 2,400 μm.

公开(公告)号：US10727376B2

公开(公告)日：2020-07-28

申请号：US16125769

申请日：2018-09-10

Applicant: SEOUL VIOSYS CO., LTD

Inventor： Chi Hyun In ,  Jun Yong Park ,  Kyu Ho Lee ,  Dae Woong Suh ,  Jong Hyeon Chae ,  Chang Hoon Kim ,  Sung Hyun Lee

IPC: H01L33/48 ,  H01L33/20 ,  H01L33/44 ,  H01L33/50 ,  H01L33/62

Abstract: Disclosed herein are a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes: a substrate, a light-emitting layer disposed on a surface of the substrate and including a first type semiconductor layer, an active layer, and a second type semiconductor layer, a first bump disposed on the first type semiconductor layer and a second bump disposed the second type semiconductor layer, a protective layer covering at least the light-emitting layer, and a first bump pad and a second bump pad disposed on the protective layer and connected to the first bump and the second bump, respectively.

公开(公告)号：US10158050B2

公开(公告)日：2018-12-18

申请号：US15673046

申请日：2017-08-09

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jun Yong Park ,  Hee Cheul Jung ,  In Kyu Park ,  Daewoong Suh

IPC: H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L25/075

Abstract: A light-emitting diode package includes a frame portion with a chip-mounting region defined in an upper portion thereof, and first and second frames spaced apart from each other. A light-emitting diode is mounted on at least a portion of the chip-mounting region with a bonding layer interposed therebetween. The frame portion includes a depressed portion formed on an upper surface thereof, and the depressed portion includes the chip-mounting region defined on a bottom thereof. The depressed portion also includes a step portion disposed at an outer upper end thereof.

公开(公告)号：US09768362B2

公开(公告)日：2017-09-19

申请号：US14981301

申请日：2015-12-28

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jun Yong Park ,  Hee Cheul Jung ,  In Kyu Park ,  Daewoong Suh

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/58 ,  H01L25/075

CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L33/48 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: Disclosed are a light-emitting device and a manufacturing method thereof. A light-emitting device according to a preferred embodiment of the disclosure comprises: a frame portion having a bottom and a sidewall; a light-emitting portion which is disposed on the frame portion and emits light; and a window portion disposed over the frame portion so as to cover the light-emitting portion.