Abstract:
Provided is a semiconductor apparatus which includes a plurality of output buffers configured to connect a plurality of power sources, and a data noise measuring unit configured to fix an output data of a selected output buffer among the plurality of output buffers to have a specific level, measure a noise of the output data using a capacitance and control a slew rate of the plurality of output buffers based on the noise.
Abstract:
A semiconductor device includes a one-time programmable (OTP) memory cell includes a first MOS transistor having a gate coupled to a bit line, a first switching device, coupled to one side of a source/drain of the first MOS transistor, configured to provide a current path for a current supplied to the gate of the first MOS transistor, and a second switching device configured to provide a bias voltage at the other side of the source/drain of the first MOS transistor.
Abstract:
A semiconductor package includes at least one semiconductor chip disposed in such a way that an active surface with chip pads faces a redistribution layer, vertical interconnectors extending in a vertical direction from the chip pads toward the redistribution layer, wherein each of the vertical connectors has a first end portion that is connected to a corresponding chip pad and a second end portion that is disposed on an opposite end of each vertical interconnector in relation to the first end portion, and a molding layer covering the semiconductor chip and the vertical interconnectors while exposing a surface of each of the second end portions of the vertical interconnectors, wherein the redistribution layer is formed over the molding layer, the redistribution layer having a redistribution land that is in contact with the surface of the second end portion, and wherein a width of the surface of the second end portion is greater than a width of an extension portion between the first end portion and the second end portion of each vertical interconnector.
Abstract:
An electronic device includes a semiconductor memory including material layers each including one or more low-resistance areas and one or more high-resistance areas, insulating layers stacked alternately with the material layers and including protrusions extending more than the material layers, conductive pillars passing through the insulating layers and the low-resistance areas, conductive layers located between the protrusions, and variable resistance layers interposed between the low-resistance areas and the conductive layers.
Abstract:
A semiconductor memory device includes memory cells coupled to a word line; and a peripheral circuit configured to read first to kth page data from the memory cells by sequentially applying first to kth test voltages to the word line, where k is a natural number greater than 3, wherein the peripheral circuit is configured to gradually reduce times during which the first to kth test voltages are applied to the word line.
Abstract:
A method of programming a non-volatile memory device includes programming memory cells selected from the plurality of memory cells by increasing turn values of program loops based on an incremental step pulse program (ISPP) algorithm; detecting a first turn value of a first program loop wherein, in the first program loop, a first number or a first ratio of first unprogrammed memory cells is smaller than or equal to a first set value; calculating a second turn value of a second program loop based on the first turn value wherein, in the second program loop, a second number or a second ratio of second unprogrammed memory cells is expected to be smaller than or equal to a second set value, the second set value being smaller than the first set value; executing subsequent program loops on the unprogrammed memory cells up to the second program loop; detecting a third number or a third ratio of third unprogrammed memory cells in the second program loop; comparing the third number or the third ratio of the third unprogrammed memory cells to the second set value; determining a program pass when the third number or the third ratio of the third unprogrammed memory cells is smaller than or equal to the second set value; and determining a program fail when the third number or the third ratio of the unprogrammed memory cell exceeds the second set value.
Abstract:
A semiconductor memory device and a method of operating the same are provided. The method of operating the semiconductor memory device includes detecting a first group of changed bits between first and second page data, by comparing the first and second page data, which are read out using first and second test voltages from the memory cells, respectively, detecting a second group of changed bits between the second page data and a third page data, by comparing the second page data with the third page data read out from the memory cells using a third test voltage, comparing the numbers of the first and second groups of changed bits, and determining one of the first to third test voltages as a read voltage according to the comparing of the numbers of the first and second groups of changed bits.
Abstract:
A data storage system and a method of operating the same are provided. The method includes performing a program operation on a first page of the pages of a memory block, deciding, when power is switched on after a sudden power-off is generated while the program operation is performed, whether to skip the program operation on a first erase page of the pages based on a second page on which the program operation is performed subsequent to the first page, and performing the program operation on the second page.
Abstract:
A semiconductor memory device is provided. The semiconductor memory device includes memory cells having first to fourth middle states corresponding to different threshold voltage distributions. The semiconductor memory device also includes a peripheral circuit configured to perform a first program operation to program memory cells having the third and the fourth middle states to have four upper states and perform a second program operation to program memory cells having the first and the second middle states to have another four upper states.
Abstract:
A method for manufacturing an electronic device including a semiconductor memory may include forming a first carbon electrode material, surface-treating the first carbon electrode material to decrease a surface roughness of the first carbon electrode material, and forming a second carbon electrode material on the treated surface of the first carbon electrode material. The second carbon electrode material may have a thickness that is greater than a thickness of the first carbon electrode material.