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11.
公开(公告)号:US12091771B2
公开(公告)日:2024-09-17
申请号:US17173170
申请日:2021-02-10
Applicant: SLT Technologies, Inc
Inventor: Drew W. Cardwell , Mark P. D'Evelyn
CPC classification number: C30B25/18 , C01B21/0632 , C30B25/04 , C30B29/406
Abstract: Embodiments of the present disclosure include techniques related to techniques for processing materials for manufacture of group-III metal nitride and gallium based substrates. More specifically, embodiments of the disclosure include techniques for growing large area substrates using a combination of processing techniques. Merely by way of example, the disclosure can be applied to growing crystals of GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, and others for manufacture of bulk or patterned substrates. Such bulk or patterned substrates can be used for a variety of applications including optoelectronic and electronic devices, lasers, light emitting diodes, solar cells, photo electrochemical water splitting and hydrogen generation, photodetectors, integrated circuits, and transistors, and others.
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公开(公告)号:US12024795B2
公开(公告)日:2024-07-02
申请号:US17514656
申请日:2021-10-29
Applicant: SLT Technologies, Inc
Inventor: Mark P. D'Evelyn , Paul M. Von Dollen , Lisa M. Gay , Douglas W. Pocius , Jonathan D. Cook
CPC classification number: C30B7/105 , C30B29/403
Abstract: A method for growth of group III metal nitride crystals includes providing a manifold comprising including one or more transfer vessels, a source vessel containing a condensable mineralizer composition, and a receiving vessel, chilling a metallic surface within the one or more transfer vessels, the metallic surface comprising a composition that does not form a reaction product when exposed to the condensable mineralizer composition, transferring a quantity of the condensable mineralizer composition to the one or more transfer vessels via a vapor phase and causing condensation of the condensable mineralizer composition within the one or more transfer vessels, measuring the quantity of the condensable mineralizer composition within the at least one transfer vessel, transferring at least a portion of the condensable mineralizer composition to the receiving vessel, and forming at least a portion of a group III metal nitride boule by an ammonothermal crystal growth process that comprises exposing a seed crystal to a temperature of at least about 400 degrees Celsius, and exposing the seed crystal to a mineralizer that is formed from the condensable mineralizer composition transferred from the receiving vessel.
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公开(公告)号:US11661670B2
公开(公告)日:2023-05-30
申请号:US17133002
申请日:2020-12-23
Applicant: SLT Technologies, Inc
Inventor: Mark P. D'Evelyn , Drew W. Cardwell , Jonathan D. Cook
CPC classification number: C30B7/105 , C30B28/04 , C30B29/406
Abstract: High quality ammonothermal group III metal nitride crystals having a pattern of locally-approximately-linear arrays of threading dislocations, methods of manufacturing high quality ammonothermal group III metal nitride crystals, and methods of using such crystals are disclosed. The crystals are useful for seed bulk crystal growth and as substrates for light emitting diodes, laser diodes, transistors, photodetectors, solar cells, and for photoelectrochemical water splitting for hydrogen generation devices.
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公开(公告)号:US11575055B2
公开(公告)日:2023-02-07
申请号:US17151110
申请日:2021-01-15
Applicant: SLT Technologies, Inc
Inventor: Drew W. Cardwell , Mark P. D'Evelyn
IPC: H01L31/0232 , H01L31/109 , G01J1/44 , G01J1/04
Abstract: According to the present disclosure, techniques related to manufacturing and applications of power photodiode structures and devices based on group-III metal nitride and gallium-based substrates are provided. More specifically, embodiments of the disclosure include techniques for fabricating photodiode devices comprising one or more of GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, structures and devices. Such structures or devices can be used for a variety of applications including optoelectronic devices, photodiodes, power-over-fiber receivers, and others.
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15.
公开(公告)号:US20210249266A1
公开(公告)日:2021-08-12
申请号:US17173169
申请日:2021-02-10
Applicant: SLT Technologies, Inc.
Inventor: Mark P. D'Evelyn , Wenkan Jiang , Drew W. Cardwell , Dirk Ehrentraut
Abstract: Embodiments of the present disclosure include techniques related to techniques for processing materials for manufacture of group-III metal nitride and gallium based substrates. More specifically, embodiments of the disclosure include techniques for growing large area substrates using a combination of processing techniques. Merely by way of example, the disclosure can be applied to growing crystals of GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, and others for manufacture of bulk or patterned substrates. Such bulk or patterned substrates can be used for a variety of applications including optoelectronic and electronic devices, lasers, light emitting diodes, solar cells, photo electrochemical water splitting and hydrogen generation, photodetectors, integrated circuits, and transistors, and others.
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公开(公告)号:USRE47114E1
公开(公告)日:2018-11-06
申请号:US15469196
申请日:2017-03-24
Applicant: SLT TECHNOLOGIES, INC.
Inventor: Mark P. D'Evelyn , Derrick S. Kamber
Abstract: A gettered polycrystalline group III metal nitride is formed by heating a group III metal with an added getter in a nitrogen-containing gas. Most of the residual oxygen in the gettered polycrystalline nitride is chemically bound by the getter. The gettered polycrystalline group III metal nitride is useful as a raw material for ammonothermal growth of bulk group III nitride crystals.
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公开(公告)号:US12040417B2
公开(公告)日:2024-07-16
申请号:US18059293
申请日:2022-11-28
Applicant: SLT Technologies, Inc.
Inventor: Drew W. Cardwell , Mark P. D'Evelyn
IPC: H01L31/0232 , G02B6/42 , H01L31/0216 , H01L31/0224 , H01L31/0304 , H01L31/0352 , H01L31/036 , H01L31/109 , H01L31/18
CPC classification number: H01L31/02327 , G02B6/4206 , H01L31/02161 , H01L31/022408 , H01L31/03048 , H01L31/035236 , H01L31/036 , H01L31/109 , H01L31/1892
Abstract: According to the present disclosure, techniques related to manufacturing and applications of power photodiode structures and devices based on group-III metal nitride and gallium-based substrates are provided. More specifically, embodiments of the disclosure include techniques for fabricating photodiode devices comprising one or more of GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, structures and devices. Such structures or devices can be used for a variety of applications including optoelectronic devices, photodiodes, power-over-fiber receivers, and others.
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公开(公告)号:US11453956B2
公开(公告)日:2022-09-27
申请号:US16550947
申请日:2019-08-26
Applicant: SLT TECHNOLOGIES, INC.
Inventor: Mark P. D'Evelyn , James S. Speck , Derrick S. Kamber , Douglas W. Pocius
IPC: C30B33/06 , C30B7/10 , H01L21/02 , H01L29/20 , C30B25/02 , C30B25/18 , C30B29/40 , C30B19/06 , C30B19/12
Abstract: Techniques for processing materials in supercritical fluids including processing in a capsule disposed within a high-pressure apparatus enclosure are disclosed. The disclosed techniques are useful for growing crystals of GaN, AlN, InN, and their alloys, including InGaN, AlGaN, and AlInGaN for the manufacture of bulk or patterned substrates, which in turn can be used to make optoelectronic devices, lasers, light emitting diodes, solar cells, photoelectrochemical water splitting and hydrogen generation devices, photodetectors, integrated circuits, and transistors.
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公开(公告)号:US11444216B2
公开(公告)日:2022-09-13
申请号:US16930250
申请日:2020-07-15
Applicant: SLT Technologies, Inc
Inventor: Drew W. Cardwell , Mark P. D'Evelyn
IPC: H01L31/036 , H01L31/0224 , H01L31/0232 , H01L31/0304 , H01L31/105 , H01L31/18
Abstract: According to the present disclosure, techniques related to manufacturing and applications of power photodiode structures and devices based on group-III metal nitride and gallium-based substrates are provided. More specifically, embodiments of the disclosure include techniques for fabricating photodiode devices comprising one or more of GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, structures and devices. Such structures or devices can be used for a variety of applications including optoelectronic devices, photodiodes, power-over-fiber receivers, and others.
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公开(公告)号:US11047041B2
公开(公告)日:2021-06-29
申请号:US16814813
申请日:2020-03-10
Applicant: SLT Technologies, Inc
Inventor: Douglas W. Pocius , Derrick S. Kamber , Mark P. D'Evelyn , Jonathan D. Cook
Abstract: A process of preparing polycrystalline group III nitride chunks comprising the steps of (a) placing a group III metal inside a source chamber; (b) flowing a halogen-containing gas over the group III metal to form a group III metal halide; (c) contacting the group III metal halide with a nitrogen-containing gas in a deposition chamber containing a foil, the foil comprising at least one of Mo, W, Ta, Pd, Pt, Ir, or Re; (d) forming a polycrystalline group III nitride layer on the foil within the deposition chamber; (e) removing the polycrystalline group III nitride layer from the foil; and (f) comminuting the polycrystalline group III nitride layer to form the polycrystalline group III nitride chunks, wherein the removing and the comminuting are performed in any order or simultaneously.
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