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    Electronic device comprising an optical chip and method of fabrication
    11.
    发明授权
    Electronic device comprising an optical chip and method of fabrication 有权

    公开(公告)号：US10923638B2

    公开(公告)日：2021-02-16

    申请号：US16572979

    申请日：2019-09-17

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Nicolas Mastromauro ,  Karine Saxod

    IPC: H01L33/48 ,  H01L33/58 ,  H01L33/54 ,  H01L33/62

    Abstract: An electronic device includes a carrier substrate having a front face and an electronic chip mounted on the front face. An encapsulation cover is mounted above the front face and bounds a chamber in which the chip is situated. A front opening is provided in front of an optical component of the chip. An optical element, designed to allow light to pass, is mounted on the cover in a position which covers the front opening of the cover. The optical element includes a central region designed to deviate light and a positioning pattern that is visible through the front opening. An additional mask is mounted on the encapsulation cover in a position which extends in front of the optical element. A local opening of the additional mask is situated in front of the optical component.

    Electronic package and fabrication method
    12.
    发明授权
    Electronic package and fabrication method 有权

    公开(公告)号：US10483181B2

    公开(公告)日：2019-11-19

    申请号：US16035083

    申请日：2018-07-13

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Karine Saxod ,  Nicolas Mastromauro

    IPC: H01L23/12 ,  H01L23/31 ,  H01L23/32 ,  H01L23/04 ,  H01L23/10

    Abstract: An integrated circuit chip is mounted to a front face of a support plate. An encapsulation cap in then mounted to the support plate. The encapsulation cap includes a front wall and a peripheral wall having an end edge at least partly facing a peripheral zone of the support plate. The support plate and the encapsulation cap delimit a chamber in which the integrated circuit chip is situated. To mount the encapsulation cap, a bead of glue is inserted between the peripheral zone and the end edge of the peripheral wall of the encapsulation cap. A peripheral outer face of the encapsulation cap includes a recess extending from the end edge which locally uncovers a part of the bead of glue. A local hardening of the glue at the recess is performed as a first attachment step. Further hardening of the remainder of the glue is then performed.

    Electronic housing including a grooved cover
    18.
    发明授权
    Electronic housing including a grooved cover 有权

    公开(公告)号：US10480994B2

    公开(公告)日：2019-11-19

    申请号：US15611266

    申请日：2017-06-01

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Karine Saxod ,  Jean-Michel Riviere

    IPC: G01J1/02 ,  H01L25/16 ,  G01J1/04 ,  G01V8/10 ,  H05K1/18 ,  H05K3/28 ,  H01L31/0203 ,  H01L31/167

    Abstract: A microchip has a rear face attached to a front mounting face of a support plate. An encapsulation cover for the microchip is mounted to the support plate. The encapsulation cover includes a front wall, a peripheral wall extending from the front wall and an inside partition extending from the front wall and between opposite sides of the peripheral wall. The inside partition passes locally above the microchip to delimit two cavities. A bonding material is interposed between encapsulation cover and the support plate and microchip. An end part of the inside partition of the cover, adjacent to the front face of the microchip, include an accumulation and containment recess that is configured to at least partly receive the bonding material.

    METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE COMPRISING A COVER
    20.
    发明申请
    METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE COMPRISING A COVER 审中-公开

    公开(公告)号：US20180190511A1

    公开(公告)日：2018-07-05

    申请号：US15685285

    申请日：2017-08-24

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Alexandre Mas ,  Benoit Besancon ,  Karine Saxod

    IPC: H01L21/56 ,  H01L23/28 ,  H01L23/02

    Abstract: A method for manufacturing a cover for an electronic package includes placing an electrically conductive insert (including an electrical contact surface) inside a cavity of a mold in a position such that the electrical contact surface is in contact with a face of the cavity of the mold. A coating material is injected into said cavity and set so as to produce a substrate that is overmolded around the insert and forms the cover where the electrical contact surface of the overmolded substrate is not covered by the coating material. An electronic package is then formed from a chip mounted on a carrier substrate that is covered by the cover. The electrical contact surface is located above and electrically connected to an electrical connection pad of either the chip or the carrier substrate.

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