公开(公告)号：US11688815B2

公开(公告)日：2023-06-27

申请号：US17081299

申请日：2020-10-27

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Alexandre Mas ,  Eric Saugier ,  Gaetan Lobascio ,  Benoit Besancon

IPC: H01L31/02 ,  H01L31/0203 ,  H01L31/18 ,  H01L31/0232 ,  H01L31/12 ,  B29C45/14 ,  H01L33/48 ,  B29L31/34

CPC classification number: H01L31/0203 ,  B29C45/14065 ,  B29C45/14639 ,  H01L31/02002 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/18 ,  H01L33/483 ,  B29C45/14778 ,  B29K2995/0026 ,  B29L2031/3481

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

公开(公告)号：US11437527B2

公开(公告)日：2022-09-06

申请号：US16896780

申请日：2020-06-09

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Veronique Ferre ,  Agnes Baffert ,  Jean-Michel Riviere

IPC: H01L31/0203 ,  H01L21/56 ,  H01L31/0232 ,  H01L31/18 ,  H01L31/16 ,  H01L31/12 ,  H01L33/48

Abstract: An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.

公开(公告)号：US10748883B2

公开(公告)日：2020-08-18

申请号：US16182315

申请日：2018-11-06

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Jean-Michel Riviere

IPC: H01L21/00 ,  H01L25/16 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02 ,  H01L31/167 ,  H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L33/00 ,  B29C45/14 ,  B29C69/00 ,  H01L31/18 ,  G01S7/481 ,  B29L31/34 ,  G01S17/04

Abstract: An encapsulation cover for an electronic package includes a cover body having a frontal wall provided with at least one optical element allowing light to pass through. The optical element is inserted into the encapsulation cover by overmolding into a through-passage of the frontal wall. A front face of the optical element is set back with respect to a front face of the frontal wall. The process for fabricating the encapsulation cover includes forming a stack of a sacrificial spacer on top of an optical element, with the stack placed into a cavity of a mold.

公开(公告)号：US20130155620A1

公开(公告)日：2013-06-20

申请号：US13722282

申请日：2012-12-20

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Jean-Michel Riviere ,  Karine Saxod

IPC: H05K7/20

CPC classification number: H05K7/20 ,  G01F1/20 ,  H01L23/34 ,  H01L23/4334 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H05K1/0209 ,  H05K3/284 ,  H05K7/20436 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/1316 ,  H01L2924/00

Abstract: An electronic component package includes a support and heat conductor. The heat conductor has a protuberance and the support has a socket arranged to be able to receive the protuberance so that the movement of heat conductor relative to the support during the assembly process is reduced.

Abstract translation: 电子部件封装包括支撑件和导热体。 热导体具有突起，并且支撑件具有布置成能够容纳突起的插座，使得在组装过程期间热导体相对于支撑件的移动减小。

公开(公告)号：US12066678B2

公开(公告)日：2024-08-20

申请号：US18110568

申请日：2023-02-16

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Research & Development) Limited

Inventor： Nicolas Mastromauro ,  Roy Duffy ,  Karine Saxod

IPC: H01L31/0232 ,  G02B7/00 ,  G02B13/00 ,  H01L31/0203

CPC classification number: G02B7/006 ,  G02B13/00 ,  H01L31/0203 ,  H01L31/02325

Abstract: An electronic device includes a carrier substrate having a front face. An electronic chip is mounted on the front face of the carrier substrate and includes an optical component. An encapsulation cover is mounted on top of the front face of the carrier substrate and bounds a chamber within which the chip is situated. A front opening extends through the cover and is situated in front of the optical component. An optical element, designed to allow light to pass, is mounted within the chamber at a position which covers the front opening of the encapsulation cover. The optical element includes a central region designed to deviate the light and having an optical axis aligned with the front opening and the optical component. A positioning pattern is provided on the optical element to assist with mounting the optical element to the cover and mounting the cover to the carrier substrate.

公开(公告)号：US10998470B2

公开(公告)日：2021-05-04

申请号：US16218906

申请日：2018-12-13

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Jean-Michel Riviere ,  Romain Coffy ,  Karine Saxod

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/58 ,  H05K5/03 ,  H01L31/12 ,  H01L31/0232 ,  H01L31/0203 ,  H01L31/18 ,  H01L31/16

Abstract: A cover for an electronic circuit package, including an element having peripheral portions housed in an inner groove of a through opening.

公开(公告)号：US10483408B2

公开(公告)日：2019-11-19

申请号：US15689976

申请日：2017-08-29

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Alexandre Mas ,  Eric Saugier ,  Gaetan Lobascio ,  Benoit Besancon

IPC: H01L31/0203 ,  H01L31/18 ,  H01L31/0232 ,  H01L31/02 ,  H01L31/12 ,  B29C45/14 ,  H01L33/48 ,  B29L31/34

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

公开(公告)号：US20170127567A1

公开(公告)日：2017-05-04

申请号：US15131652

申请日：2016-04-18

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Benoit Besancon ,  Agnes Baffert ,  Karine Saxod

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K7/20509 ,  H01L23/3128 ,  H01L23/4334 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0203 ,  H05K1/181 ,  H05K2201/066 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device includes a support plate with an integrated circuit chip fixed onto the support plate. A heat sink is mounted to the support plate. An electrical connection wire is provided with one end electrically connected to the heat sink and another end electrically connected to an electrical contact provided on the support plate.

公开(公告)号：US11664475B2

公开(公告)日：2023-05-30

申请号：US17090461

申请日：2020-11-05

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Nicolas Mastromauro

IPC: H01L31/14 ,  G01S7/484 ,  G01S7/4865 ,  H01L31/0203 ,  H01L33/52 ,  H01L31/18 ,  H01L33/00

CPC classification number: H01L31/143 ,  G01S7/484 ,  G01S7/4865 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/005 ,  H01L33/52 ,  H01L2933/005

Abstract: A carrier substrate is configured to carry at least one electronic chip and includes a mounting front face. An encapsulating cover is mounted on the front face of the carrier substrate through a mounting. This mounting includes at least one seating surface through which the cover and the carrier substrate make contact. At least one adhesive bead is located elsewhere than the seating surface in order to securely fasten the encapsulation cover and the carrier substrate.

公开(公告)号：US11546059B2

公开(公告)日：2023-01-03

申请号：US17169010

申请日：2021-02-05

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Jean-Michel Riviere ,  Romain Coffy ,  Karine Saxod

IPC: H04B10/40 ,  H05K7/02 ,  H05K5/03 ,  H04B10/80 ,  H01L31/16 ,  H01L31/0203

Abstract: A cover for an electronic circuit package, including: a body having an opening extending therethrough; a first element located in the opening and having a surface continuing planar or rounded shapes of a surface of the cover; and a second element of connection of the first element to the body.