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公开(公告)号：US20170092557A1
公开(公告)日：2017-03-30
申请号：US15050289
申请日：2016-02-22
Inventor： Yvon Imbs , Laurent Schwarz , David Auchere , Laurent Marechal
IPC: H01L23/31 , H01L23/00 , H01L21/768 , H01L23/66 , H01L21/3105 , H01L21/56 , H01L23/498 , H01L23/48
CPC classification number: H01L23/3121 , H01L21/3105 , H01L21/56 , H01L21/76802 , H01L21/76877 , H01L23/3135 , H01L23/481 , H01L23/49811 , H01L23/49838 , H01L23/66 , H01L24/48 , H01L24/85 , H01L2223/6611 , H01L2223/6677 , H01L2224/16225 , H01L2224/45124 , H01L2224/45147 , H01L2224/48227 , H01L2224/48235 , H01L2224/73257 , H01L2224/8538 , H01L2924/00012 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2224/05599 , H01L2224/85399
Abstract: An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the supporting substrate. An opening is provided in the primary encapsulation block to at least partially uncover an electrical contact. An additional wire made from an electrically conductive material has an end that is electrically connected to the electrical contact. An additional encapsulation block above the primary encapsulation block embeds the additional wire.
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12.发明申请ELECTRONIC DEVICE PROVIDED WITH AN INTEGRATED CONDUCTOR ELEMENT AND FABRICATION METHOD 有权具有集成导体元件和制造方法的电子器件公开(公告)号：US20170062299A1
公开(公告)日：2017-03-02
申请号：US15050253
申请日：2016-02-22
Inventor： David Auchere , Laurent Marechal , Yvon Imbs , Laurent Schwarz
IPC: H01L23/31 , H01L21/48 , H01L21/56 , H01L21/3105 , H01L23/66 , H01L23/498
CPC classification number: H01Q1/2283 , H01L21/3105 , H01L21/4853 , H01L21/56 , H01L23/3121 , H01L23/3135 , H01L23/315 , H01L23/49838 , H01L23/66 , H01L2223/6677 , H01L2224/16227 , H01L2924/15311 , H01L2924/1815
Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An en encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.
Abstract translation: 电子设备包括具有安装面和电连接网络的支撑板。 集成电路芯片安装在安装面上并连接到电气连接网络。 封装块嵌入集成电路芯片。 由导电材料制成的附加元件至少部分地嵌入在封装块内。 附加导电元件具有平行于支撑板延伸的主要部分，并具有与集成电路芯片电连接的次级部分。 在密封块中形成开口，并且次级部分延伸到该开口中以形成电连接。 附加导电元件可以是天线。
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公开(公告)号：US10062961B2
公开(公告)日：2018-08-28
申请号：US15667259
申请日：2017-08-02
Inventor： David Auchere , Laurent Marechal , Laurent Schwarz , Yvon Imbs
CPC classification number: H01Q1/38 , H01L21/4853 , H01L21/486 , H01L21/4889 , H01L21/52 , H01L21/56 , H01L23/13 , H01L23/3114 , H01L23/3128 , H01L23/315 , H01L23/481 , H01L23/498 , H01L23/49811 , H01L23/49827 , H01L23/645 , H01L23/66 , H01L24/16 , H01L24/81 , H01L2223/6677 , H01L2224/16227 , H01L2924/15311 , H01L2924/1815 , H01Q1/2283
Abstract: An electronic device includes a support board having a mounting face and an integrated circuit chip mounted on the mounting face. An encapsulation block embeds the integrated circuit chip, the encapsulation block extending above the integrated circuit chip and around the integrated circuit chip on the mounting face of the support board. The encapsulation block includes a front face with a hole passing through the encapsulation block to uncovering at least part of an electrical contact. A layer made of an electrically conducting material fills the hole to make electrical connection to the electrical contact and further extends over the front face of the encapsulation block.
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公开(公告)号：US20170331182A1
公开(公告)日：2017-11-16
申请号：US15667259
申请日：2017-08-02
Inventor： David Auchere , Laurent Marechal , Laurent Schwarz , Yvon Imbs
CPC classification number: H01Q1/38 , H01L21/4853 , H01L21/486 , H01L21/4889 , H01L21/52 , H01L21/56 , H01L23/13 , H01L23/3114 , H01L23/3128 , H01L23/315 , H01L23/481 , H01L23/498 , H01L23/49811 , H01L23/49827 , H01L23/645 , H01L23/66 , H01L24/81 , H01L2223/6677 , H01L2224/16227 , H01L2924/15311 , H01L2924/1815 , H01Q1/2283
Abstract: An electronic device includes a support board having a mounting face and an integrated circuit chip mounted on the mounting face. An encapsulation block embeds the integrated circuit chip, the encapsulation block extending above the integrated circuit chip and around the integrated circuit chip on the mounting face of the support board. The encapsulation block includes a front face with a hole passing through the encapsulation block to uncovering at least part of an electrical contact. A layer made of an electrically conducting material fills the hole to make electrical connection to the electrical contact and further extends over the front face of the encapsulation block.
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15.发明申请公开(公告)号：US20170323841A1
公开(公告)日：2017-11-09
申请号：US15659078
申请日：2017-07-25
Inventor： Yvon Imbs , Laurent Schwarz , David Auchere , Laurent Marechal
IPC: H01L23/31 , H01L21/768 , H01L23/498 , H01L21/3105 , H01L23/66 , H01L23/00 , H01L21/56 , H01L23/48
CPC classification number: H01L23/3121 , H01L21/3105 , H01L21/56 , H01L21/76802 , H01L21/76877 , H01L23/3135 , H01L23/481 , H01L23/49811 , H01L23/49838 , H01L23/66 , H01L24/48 , H01L24/85 , H01L2223/6611 , H01L2223/6677 , H01L2224/16225 , H01L2224/45124 , H01L2224/45147 , H01L2224/48227 , H01L2224/48235 , H01L2224/73257 , H01L2224/8538 , H01L2924/00012 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2224/05599 , H01L2224/85399
Abstract: An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the supporting substrate. An opening is provided in the primary encapsulation block to at least partially uncover an electrical contact. An additional wire made from an electrically conductive material has an end that is electrically connected to the electrical contact. An additional encapsulation block above the primary encapsulation block embeds the additional wire.
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Patent Agency Ranking
公开(公告)号：US10116037B2
公开(公告)日：2018-10-30
申请号：US15668816
申请日：2017-08-04
Inventor： David Auchere , Laurent Marechal , Yvon Imbs , Laurent Schwarz
Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An en encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.
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公开(公告)号：US10103079B2
公开(公告)日：2018-10-16
申请号：US15659078
申请日：2017-07-25
Inventor： Yvon Imbs , Laurent Schwarz , David Auchere , Laurent Marechal
IPC: H01L23/48 , H01L23/31 , H01L21/56 , H01L21/768 , H01L21/3105 , H01L23/498 , H01L23/66 , H01L23/00
Abstract: An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the supporting substrate. An opening is provided in the primary encapsulation block to at least partially uncover an electrical contact. An additional wire made from an electrically conductive material has an end that is electrically connected to the electrical contact. An additional encapsulation block above the primary encapsulation block embeds the additional wire.
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18.发明申请公开(公告)号：US20180213654A1
公开(公告)日：2018-07-26
申请号：US15926583
申请日：2018-03-20
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： David Auchere , Laurent Marechal
IPC: H05K3/42 , H01L23/498 , H01L23/64
CPC classification number: H05K3/42 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/645 , H01L2224/16225 , H01L2924/15311 , Y10T29/4913
Abstract: An electronic device includes a substrate having an external surface, and an integrated circuit over the external surface of the substrate. The substrate is provided with an electrical connection network including electrical links for linking the integrated circuit to another electrical device. Some of the electrical links include an impedance-compensating inductor on an external surface of the substrate.
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公开(公告)号：US09949381B2
公开(公告)日：2018-04-17
申请号：US14330176
申请日：2014-07-14
Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor： David Auchere , Laurent Marechal
IPC: H05K1/18 , H05K3/42 , H01L23/64 , H01L23/498
CPC classification number: H05K3/42 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/645 , H01L2224/16225 , H01L2924/15311 , Y10T29/4913
Abstract: An electronic device includes a substrate having an external surface, and an integrated circuit over the external surface of the substrate. The substrate is provided with an electrical connection network including electrical links for linking the integrated circuit to another electrical device. Some of the electrical links include an impedance-compensating inductor on an external surface of the substrate.
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公开(公告)号：US20170318664A1
公开(公告)日：2017-11-02
申请号：US15142213
申请日：2016-04-29
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Laurent Marechal , Richard Rembert , Jerome Lopez
CPC classification number: H05K1/0251 , H05K1/0222
Abstract: An electronic device disclosed herein includes a first conductor layer, a first nonconducting layer, and a second conductor layer in a stacked arrangement. A signal carrying conductive via is formed in the first nonconducting layer and extends between the first conductor layer and the second conductor layer. A shielding conductive via is formed in the first nonconducting layer, is not electrically coupled to the signal carrying conductive via, and substantially completely surrounds the signal carrying conductive via in spaced apart relation thereto.
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