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公开(公告)号：US20190239000A1
公开(公告)日：2019-08-01
申请号：US16256816
申请日：2019-01-24
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Giorgio ALLEGATO , Federico VERCESI , Laura Maria CASTOLDI , Laura OGGIONI , Matteo PERLETTI
CPC classification number: H04R19/04 , B81C1/00309 , B81C2201/0133 , H04R1/021 , H04R1/086 , H04R19/005 , H04R31/00 , H04R2201/003
Abstract: A method for manufacturing a semiconductor die, comprising the steps of: providing a MEMS device having a structural body, provided with a cavity, and a membrane structure suspended over the cavity; coupling the structural body to a filtering module via direct bonding or fusion bonding so that a first portion of the filtering module extends over the cavity and a second portion of the filtering module extends seamlessly as a prolongation of the structural body; and etching selective portions of the filtering module in an area corresponding to the first portion, to form filtering openings fluidically coupled to the cavity. The semiconductor die is, for example, a microphone.
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12.发明申请公开(公告)号：US20160145096A1
公开(公告)日：2016-05-26
申请号：US14971639
申请日：2015-12-16
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Giorgio ALLEGATO , Barbara SIMONI , Carlo VALZASINA , Lorenzo CORSO
CPC classification number: B81B7/0074 , B81B7/007 , B81B7/008 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/015 , B81B2207/07 , B81B2207/092 , B81B2207/093 , B81B2207/096 , B81B2207/097 , B81C1/0023 , B81C2203/0118 , B81C2203/0792 , H01L2924/0002 , H01L2924/00
Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.
Abstract translation: 微机电装置包括：容纳微机电结构的主体; 以及盖，其结合到主体并通过导电接合区域电耦合到微机电结构。 盖包括选择模块，其具有耦合到微机电结构的第一选择端子，第二选择端子和至少一个控制端子，并且可以通过控制端子控制以将第二选择端子耦合到相应的第一选择端子， 选择性地，对应于相应的操作条件的多个耦合配置之一。
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公开(公告)号：US20240199408A1
公开(公告)日：2024-06-20
申请号：US18590533
申请日：2024-02-28
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Giorgio ALLEGATO , Lorenzo CORSO , Ilaria GELMI , Carlo VALZASINA
CPC classification number: B81B3/0051 , B81C1/00595 , B81B2201/0235 , B81B2201/0242 , B81C2201/0198
Abstract: A process for manufacturing a MEMS device includes forming a first structural layer of a first thickness on a substrate. First trenches are formed through the first structural layer, and masking regions separated by first openings are formed on the first structural layer. A second structural layer of a second thickness is formed on the first structural layer in direct contact with the first structural layer at the first openings and forms, together with the first structural layer, thick structural regions having a third thickness equal to the sum of the first and the second thicknesses. A plurality of second trenches are formed through the second structural layer, over the masking regions, and third trenches are formed through the first and the second structural layers by removing selective portions of the thick structural regions.
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公开(公告)号：US20240043265A1
公开(公告)日：2024-02-08
申请号：US18359754
申请日：2023-07-26
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Giorgio ALLEGATO , Silvia NICOLI , Anna ALESSANDRI , Matteo GARAVAGLIA
CPC classification number: B81B7/0022 , B81C1/00269 , B81B2201/0228 , B81B2203/0315 , B81B2207/053 , B81C2203/0154 , B81C2203/0109 , B81C2203/038
Abstract: Electronic device including: a MEMS sensor device including a functional structure which transduces a chemical or physical quantity into a corresponding electrical quantity; a cap including a semiconductive substrate; and a bonding dielectric region, which mechanically couples the cap to the MEMS sensor device. The cap further includes a conductive region, which extends between the semiconductive substrate and the MEMS sensor device and includes: a first portion, which is arranged laterally with respect to the semiconductive substrate and is exposed, so as to be electrically coupleable to a terminal at a reference potential by a corresponding wire bonding; and a second portion, which contacts the semiconductive substrate.
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15.发明申请公开(公告)号：US20230029120A1
公开(公告)日：2023-01-26
申请号：US17958761
申请日：2022-10-03
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Mikel AZPEITIA URQUIA , Giorgio ALLEGATO
Abstract: A semiconductor device for ambient sensing including: a cap traversed by a hole; and a main body mechanically coupled to the cap so as to delimit a cavity, which is interposed between the main body and the cap. The main body includes a semiconductor body and a coupling structure, which is interposed between the semiconductor body and the cap and laterally delimits a channel, which fluidically couples the cavity and the hole. The channel performs a mechanical filtering that is finer than the mechanical filtering performed by the hole.
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Patent Agency Ranking
公开(公告)号：US20210276044A1
公开(公告)日：2021-09-09
申请号：US17191475
申请日：2021-03-03
Applicant: STMicroelectronics S.r.l.
Inventor： Federico VERCESI , Alessandro DANEI , Giorgio ALLEGATO , Gabriele GATTERE , Roberto CAMPEDELLI
Abstract: A method for manufacturing a PMUT device including a piezoelectric element located at a membrane element is provided. The method includes receiving a silicon on insulator substrate having a first silicon layer, an oxide layer, and a second silicon layer. Portions of a first surface of the second silicon layer are exposed by removing exposed side portions of the first silicon layer and corresponding portions of the oxide layer, and a central portion including the remaining portions of the first silicon layer and of the oxide layer is defined. Anchor portions for the membrane element are formed at the exposed portions of the first surface of the second silicon layer. The piezoelectric element is formed above the central portion, and the membrane element is defined by selectively removing the second layer and removing the remaining portion of the oxide from under the remaining portion of the first silicon layer.
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17.发明申请公开(公告)号：US20200156114A1
公开(公告)日：2020-05-21
申请号：US16684289
申请日：2019-11-14
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Gabriele GATTERE , Carlo VALZASINA , Federico VERCESI , Giorgio ALLEGATO
Abstract: An ultrasonic MEMS acoustic transducer formed in a body of semiconductor material having first and second surfaces opposite to one another. A first cavity extends in the body and delimits at the bottom a sensitive portion, which extends between the first cavity and the first surface of the body. The sensitive portion houses a second cavity and forms a membrane that extends between the second cavity and the first surface of the body. An elastic supporting structure extends between the sensitive portion and the body and is suspended over the first cavity.
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18.发明申请公开(公告)号：US20190090067A1
公开(公告)日：2019-03-21
申请号：US16128288
申请日：2018-09-11
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Matteo PERLETTI , Federico VERCESI , Silvia ADORNO , Giorgio ALLEGATO
CPC classification number: H04R19/04 , B81B7/0029 , B81B2201/0257 , B81B2203/0127 , B81B2207/012 , B81C1/00309 , B81C1/00626 , B81C2201/014 , B81C2201/0198 , H04R1/086 , H04R1/2807 , H04R19/005 , H04R31/00 , H04R2201/003
Abstract: A method for manufacturing a filtering module comprising the steps of: forming a multilayer body comprising a filter layer of semiconductor material and having a thickness of less than 10 μm, a first structural layer coupled to a first side of the filter layer, and a second structural layer coupled to a second side, opposite to the first side, of the filter layer; forming a recess in the first structural layer, which extends throughout its thickness; removing selective portions, exposed through the recess, of the filter layer to form a plurality of openings, which extend throughout the thickness of the filter layer; and completely removing the second structural layer to connect fluidically the first and second sides of the filter layer, thus forming a filtering membrane designed to inhibit passage of contaminating particles.
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19.发明申请公开(公告)号：US20170369309A1
公开(公告)日：2017-12-28
申请号：US15379091
申请日：2016-12-14
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Giorgio ALLEGATO , Laura OGGIONI , Matteo GARAVAGLIA , Roberto SOMASCHINI
CPC classification number: B81C1/00269 , B81B3/0097 , B81B2201/0242 , B81B2201/0264 , B81B2201/042 , B81B2203/0315 , B81C3/001 , B81C2201/019 , B81C2203/0118 , B81C2203/019 , B81C2203/037
Abstract: A microelectromechanical device having a first substrate of semiconductor material and a second substrate of semiconductor material having a bonding recess delimited by projecting portions, monolithic therewith. The bonding recess forms a closed cavity with the first substrate. A bonding structure is arranged within the closed cavity and is bonded to the first and second substrates. A microelectromechanical structure is formed in a substrate chosen between the first and second substrates. The device is manufactured by forming the bonding recess in a first wafer; depositing a bonding mass in the bonding recess, the bonding mass having a greater depth than the bonding recess; and bonding the two wafers.
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公开(公告)号：US20170297906A1
公开(公告)日：2017-10-19
申请号：US15638001
申请日：2017-06-29
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Giorgio ALLEGATO , Barbara SIMONI , Carlo VALZASINA , Lorenzo CORSO
CPC classification number: B81B7/0074 , B81B7/007 , B81B7/008 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/015 , B81B2207/07 , B81B2207/092 , B81B2207/093 , B81B2207/096 , B81B2207/097 , B81C1/0023 , B81C2203/0118 , B81C2203/0792 , H01L2224/18 , H01L2924/0002 , H01L2924/00
Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.
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