公开(公告)号：US09083872B2

公开(公告)日：2015-07-14

申请号：US14032607

申请日：2013-09-20

Applicant: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.

Inventor： Jing-En Luan

IPC: H04N5/225

CPC classification number: H04N5/2254 ,  H04N5/2257

Abstract: An imaging device may include a housing, an image sensor IC in the housing, a lens adjacent the image sensor IC, and a cap over the lens and having an adhesive filling opening therein. The cap, the housing, and the lens may define an adhesive receiving cavity therein and in communication with the adhesive filling opening. The imaging device may also include adhesive material within the adhesive receiving cavity touching the cap, the housing, and the lens.

Abstract translation: 成像装置可以包括壳体，壳体中的图像传感器IC，与图像传感器IC相邻的透镜，以及透镜上方的盖，并且在其中具有粘合剂填充开口。 盖，壳体和透镜可以在其中限定粘合剂容纳腔并与粘合剂填充开口连通。 成像装置还可以包括粘合剂容纳腔内的接触盖，壳体和透镜的粘合剂材料。

公开(公告)号：US09768341B2

公开(公告)日：2017-09-19

申请号：US14259344

申请日：2014-04-23

Applicant: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.

Inventor： Jing-En Luan

IPC: H01L31/173 ,  H01L31/0203 ,  H01L31/0232 ,  G01S7/481 ,  G01S17/02 ,  H01L23/00 ,  G01S17/08

CPC classification number: H01L31/173 ,  G01S7/4813 ,  G01S17/026 ,  G01S17/08 ,  H01L24/19 ,  H01L31/0203 ,  H01L31/02327 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A proximity detector device may include a first interconnect layer including a first dielectric layer, and first electrically conductive traces carried thereby, an IC layer above the first interconnect layer and having an image sensor IC, and a light source IC laterally spaced from the image sensor IC. The proximity detector device may include a second interconnect layer above the IC layer and having a second dielectric layer, and second electrically conductive traces carried thereby. The second interconnect layer may have first and second openings therein respectively aligned with the image sensor IC and the light source IC. Each of the image sensor IC and the light source IC may be coupled to the first and second electrically conductive traces. The proximity detector device may include a lens assembly above the second interconnect layer and having first and second lenses respectively aligned with the first and second openings.

公开(公告)号：US20160372406A1

公开(公告)日：2016-12-22

申请号：US15251127

申请日：2016-08-30

Applicant: STMicroelectronics (Shenzhen) R&D Co. Ltd.

Inventor： Jing-En Luan

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/768 ,  H01L23/482 ,  H01L23/498

CPC classification number: H01L23/49531 ,  H01L21/56 ,  H01L21/561 ,  H01L21/76885 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/481 ,  H01L23/482 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/16 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/03003 ,  H01L2224/03334 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06177 ,  H01L2224/09151 ,  H01L2224/12105 ,  H01L2224/16238 ,  H01L2224/32221 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/85 ,  H01L2224/92127 ,  H01L2224/92242 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2224/81 ,  H01L2924/00012

Abstract: An electronic device may include leads, an IC having first and second bond pads, and an encapsulation material adjacent the leads and the IC so the leads extend to a bottom surface of the encapsulation material defining first contact pads. The electronic device may include bond wires between the first bond pads and corresponding ones of the leads, and conductors extending from corresponding ones of the second bond pads to the bottom surface of the encapsulation material defining second contact pads.

Abstract translation: 电子设备可以包括引线，具有第一和第二接合焊盘的IC以及与引线和IC相邻的封装材料，使得引线延伸到限定第一接触焊盘的封装材料的底表面。 电子器件可以包括在第一接合焊盘和相应的引线之间的接合线，以及从第二接合焊盘中的相应焊盘延伸到限定第二接触焊盘的封装材料的底表面的导体。

公开(公告)号：US09365415B2

公开(公告)日：2016-06-14

申请号：US14587324

申请日：2014-12-31

Applicant: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.

Inventor： Jing-En Luan

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81C1/0023 ,  B81B7/007 ,  H01L24/97 ,  H01L2224/32145 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic device may include first and second laterally spaced apart interconnect substrates defining a slotted opening, and a first IC in the slotted opening and electrically coupled to one or more of the first and second interconnect substrates. The electronic device may include a first other IC over the first IC and electrically coupled to one or more of the first and second interconnect substrates, and encapsulation material over the first and second interconnect substrates, the first IC, and the first other IC.

Abstract translation: 电子设备可以包括限定开槽开口的第一和第二横向间隔开的互连基板，以及开槽开口中的第一IC，并且电耦合到第一和第二互连基板中的一个或多个。 电子器件可以包括位于第一IC上的第一其它IC，并且电耦合到第一和第二互连衬底中的一个或多个，以及在第一和第二互连衬底，第一IC和第一其他IC上的封装材料。

公开(公告)号：US20150380454A1

公开(公告)日：2015-12-31

申请号：US14750859

申请日：2015-06-25

Applicant: STMicroelectronics (Shenzhen) R&D Co. Ltd

Inventor： Jing-En Luan

IPC: H01L27/146 ,  H04N5/369

CPC classification number: H01L27/14685 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/16225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H04N5/2257 ,  H04N5/369

Abstract: Embodiments of the present invention provide a camera module and a method of manufacturing the same, the camera module comprising a sensor assembly, at least one semiconductor substrate, and a molding compound; wherein the sensor assembly comprises a semiconductor die, a sensor circuit disposed on the top surface of the semiconductor die, and a transparent cover coupled to the semiconductor die over the top surface of the semiconductor die; wherein each semiconductor substrate is disposed around the sensor assembly in a horizontal direction; and wherein the molding compound is filled between each semiconductor substrate and the sensor assembly.

Abstract translation: 本发明的实施例提供了一种相机模块及其制造方法，所述相机模块包括传感器组件，至少一个半导体衬底和模塑料; 其中所述传感器组件包括半导体管芯，设置在所述半导体管芯的顶表面上的传感器电路以及在所述半导体管芯的顶表面上连接到所述半导体管芯的透明盖; 其中每个半导体衬底沿水平方向设置在所述传感器组件周围; 并且其中所述模制化合物填充在每个半导体衬底和所述传感器组件之间。

公开(公告)号：US09177939B2

公开(公告)日：2015-11-03

申请号：US14553799

申请日：2014-11-25

Applicant: STMicroelectronics (Shenzhen) R&D Co., Ltd.

Inventor： Jing-En Luan

IPC: H01L23/00 ,  H01L23/495 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L24/83 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49551 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/73 ,  H01L24/84 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40499 ,  H01L2224/73263 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/92246 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2924/00012

Abstract: Embodiments of the present disclosure relate to a leadless surface mount assembly package, an electronic device, and a method for forming a surface mount assembly package, which package comprising: a first lead; a second lead; a chip fixed on an upper surface of the first lead; a clip coupled to the second lead, a lower surface of the clip being fixed to an upper surface of the chip. The surface mount assembly package further comprises a molding compound for molding the first lead, the second lead, the chip, and the clip, wherein ends of the first lead and the second lead are only exposed from the molding compound, without outward extending from the molding compound. By using the embodiments of the present disclosure, costs can be saved and processing flow can be simplified, and a new-model leadless surface mount assembly package is obtained.

Abstract translation: 本公开的实施例涉及无引线表面安装组件封装，电子器件和用于形成表面安装组件封装的方法，该封装包括：第一引线; 第二个领先; 固定在所述第一引线的上表面上的芯片; 夹子，其联接到所述第二引线，所述夹子的下表面固定到所述芯片的上表面。 表面安装组件封装还包括用于模制第一引线，第二引线，芯片和夹子的模制化合物，其中第一引线和第二引线的端部仅从模制化合物暴露而不向外延伸 模塑料。 通过使用本公开的实施例，可以节省成本并且可以简化处理流程，并且获得新型无引线表面安装组件封装。