摘要:
A semiconductor memory device and method of operation that is capable of reducing disturbance of adjacent word lines. A memory cell array includes a plurality of memory cells coupled to a plurality of word-lines and a plurality of bit-lines. A first word-line, which is selected in response to an access address received from the memory controller, is enabled in response to a first command received from a memory controller, and the first word-line is disabled internally in the semiconductor memory device or in response to a disable command received from the memory controller after a reference time interval elapses. The reference time interval starts from a first time point when the first command is applied to the semiconductor memory device, and corresponds to a time interval equal to or greater than a row active time interval of the semiconductor memory device.
摘要:
A semiconductor memory device includes a memory cell array in which a plurality of memory cells are arranged. The semiconductor memory device includes an error correcting code (ECC) circuit configured to generate parity data based on main data, write a codeword including the main data and the parity data in the memory cell array, read the codeword from a selected memory cell row to generate syndromes, and correct errors in the read codeword on a per symbol basis based on the syndromes. The main data includes first data of a first memory cell of the selected memory cell row and second data of a second memory cell of the selected memory cell row. The first data and the second data are assigned to one symbol of a plurality of symbols, and the first memory cell and the second memory cell are adjacent to each other in the memory cell array.
摘要:
In a method of operating a memory device, a command and a first address from a memory controller are received. A read code word including a first set of data corresponding to the first address, a second set of data corresponding to a second address and a read parity data is read from a memory cell array of the memory device. Corrected data are generated by operating error checking and correction (ECC) using an ECC circuit based on the read cord word.
摘要:
An error correction apparatus includes an error correction circuit configured to selectively perform error correction on a portion of data that is at least one of written to and read from a plurality of memory cells of a memory device. The portion of data is at least one of written to and read from a subset of the plurality of memory cells, and the subset includes only fail cells among the plurality of memory cells. The error correction apparatus further includes a fail address storage circuit configured to store address information for the fail cells.
摘要:
In one example embodiment, a memory module includes a plurality of memory devices and a buffer chip configured to manage the plurality of memory device. The buffer chip includes a memory management unit having an error correction unit configured to perform error correction operation on each of the plurality of memory devices. Each of the plurality of memory devices includes at least one spare column that is accessible by the memory management unit, and the memory management unit is configured to correct errors of the plurality of memory devices by selectively using the at least one spare column based on an error correction capability of the error correction unit.
摘要:
A repair control circuit of controlling a repair operation of a semiconductor memory device includes a row matching block and a column matching block. The row matching block stores fail group information indicating one or more fail row groups among a plurality of row groups. The row groups are determined by grouping a plurality of row addresses corresponding to a plurality of wordlines. The row matching block generates a group match signal based on input row address and the fail group information, such that the group match signal indicates the fail row group including the input row address. The column matching block stores fail column addresses of the fail memory cells, and generates a repair control signal based on input column address, the group match signal and the fail column addresses, such that the repair control signal indicates whether the repair operation is executed or not.
摘要:
A semiconductor memory device includes a memory cell array and a first buffer. The memory cell array includes a plurality of bank arrays. Each of the plurality of bank arrays includes a plurality of memory cells. The memory cell array and the first buffer are configured for performing a first internal read operation, which represents operations of retrieving first data from a first region of the memory cell array and of storing the first data into the first buffer, based on a first read command and a first read address. The first internal read operation is performed based on a deterministic interface in which the first data is stored into the first buffer within a predetermined first duration after the first read command is received and a generation of a first acknowledgement signal is unnecessary after storing the first data into the first buffer is completed.
摘要:
A use time managing method of a semiconductor device may include (1) measuring an amount of accumulated operation time of the semiconductor device and when the amount is reached to a predetermined value, generating a unit storage activation signal; (2) repeating step (1) to generate one or more additional unit storage activation signals, thereby generating a plurality of unit storage activation signals, wherein the predetermined values are different for each repeating step; (3) storing data indicating each occurrence of generating the unit storage activation signals; and (4) detecting use time of the semiconductor device based on the cumulatively stored data.
摘要:
A memory module includes a plurality of memory devices and a buffer chip. The buffer chip manages the memory devices. The buffer chip includes a refresh control circuit that groups a plurality of memory cell rows of the memory devices into a plurality of groups according to a data retention time of tire memory cell rows. The buffer chip selectively refreshes each of the plurality of groups in each of a plurality of refresh time regions that are periodically repeated and applies respective refresh periods to the plurality of groups, respectively.
摘要:
A memory device may be provided which includes a memory cell array including a plurality of sub arrays each sub array having a plurality of memory cells connected to bit lines; an address buffer configured to receive a row address and a column address; and a column decoder configured to receive the column address from the address buffer and, for each of the sub arrays, to select a column selection line corresponding to the column address, from among a plurality of column selection lines, based on different offset values applied to the sub arrays, respectively. The selected column selection lines correspond to bit lines having different physical locations, respectively, according to the different offset values.